1373990 070362.TW 24671twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種清除設備（cleaning equipment) 及運用此清除設備之清除方法，且特別是有關於一種適於 用以清除電路板（print circuit board，PCB)上之印刷圖案 (printed pattern)之清除設備及運用此清除設備之清除方 法。 【先前技術】 目如電子元件（electronic dement)通常是以表面黏著 技術（surface mount technology，SMT)組裝至電路板上， 以與電路板電性連接。而表面黏著技術的第一步驟即為先 將適量的錫膏（solder paste)以印刷的方式塗佈於電路板 之接腳（pin)處。而且，必須等確認錫膏的位置與印刷量 皆正確無誤後，電子元件才可以與電路板接合，以避免電 路板因錫膏的位置錯誤或印刷量過多或過少的問題而造成 短路。 θ在習知技藝中’若以設備或人員判斷出電路板上僅有 少望的錫膏印刷錯誤時，通常會藉由手卫具如牙籤或小到 刀以人工的Τ式清除電路板上印刷錯誤祕膏。然而，當 麟出有數讀乡祕膏印卿誤時，則料會清洗整片 電路板〜除電路板上所有的錫膏，然後再對清洗過後 的電路板重新印刷錫膏。 值得庄病是，在習知技藝巾，祕清除錫膏的方式 通常為人工作業，而且，清除的過程較為麻煩，因此，容 5 (B > 1373990 070362.TW 24671twf.doc/n 易因人為疏失而造成電路板上之錫膏未清除完全的問題。 而電子元件接合於這些電路板時，則會造成電路板短路或 電子元件與電路板接合不良的問題。因此，必須研發新額 的清除設備，以避免上述問題。 【發明内容】 本發明提供一種清除設備，用以清除電路板上之印刷 圖案。1373990 070362.TW 24671twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a cleaning equipment and a cleaning method using the same, and in particular to a suitable A cleaning device for removing a printed pattern on a printed circuit board (PCB) and a cleaning method for using the cleaning device. [Prior Art] Electronic dement is usually assembled on a circuit board by surface mount technology (SMT) to be electrically connected to a circuit board. The first step in the surface adhesion technique is to apply an appropriate amount of solder paste to the pins of the board in a printed manner. Moreover, it is necessary to wait until the position and the amount of the solder paste are correct, and the electronic component can be bonded to the circuit board to prevent the circuit board from being short-circuited due to the positional error of the solder paste or the problem of too much or too little printing. θ In the prior art, 'if the device or personnel judges that there is only a small amount of solder paste printing error on the board, the board is usually manually removed by a hand guard such as a toothpick or a small knife. Printing error secret paste. However, when Lin has a few mistakes, he will clean the entire board ~ except for all the solder paste on the board, and then reprint the solder paste on the cleaned board. It is worthwhile to think that in the traditional technical towel, the way to remove the solder paste is usually manual, and the process of cleaning is more troublesome. Therefore, the volume 5 (B > 1373990 070362.TW 24671twf.doc/n is easy to cause The problem of missing solder paste on the board is completely eliminated. When the electronic components are bonded to these boards, the board may be short-circuited or the electronic components may not be properly bonded to the board. Therefore, it is necessary to develop a new amount of cleaning. The device is to avoid the above problems. SUMMARY OF THE INVENTION The present invention provides a cleaning device for removing printed patterns on a circuit board.
本發明提供一種清除方法，用以清除電路板上之印刷 圖案。 本發明提出一種清除設備，適於清除一電路板上之一 印刷圖案。清除设備包括一平台（platf〇rm )、—真空式青 潔機構（vacuum type Cleaner)以及一滾輪式清二二 (roller type Cleaner)。平台適於承栽電路板。真空式清潔 機構具有一吸嘴（suction nozzle) ’且吸嘴適於二二 -方向清除部分之印刷圖案1輪式清潔機構具^一清潔 輪（deaning wheel)，且清潔輪適於菩一笛_ ^The present invention provides a method of cleaning to remove printed patterns on a circuit board. The present invention provides a cleaning device adapted to erase a printed pattern on a circuit board. The cleaning device includes a platform (platf 〇rm), a vacuum type Cleaner, and a roller type cleaner. The platform is suitable for carrying boards. The vacuum cleaning mechanism has a suction nozzle 'and the nozzle is adapted to the two-two-direction clearing portion of the printing pattern 1 wheel cleaning mechanism has a deaning wheel, and the cleaning wheel is suitable for the Bo Yi flute _ ^
殘留之印案。 、。第-方向清除 在本發明之-實施例中’上述之清除設備更包括 一驅動機構。第一驅動機構適於驅動平台盥真办切 構其中之一移動。 —〜月减 在本發明之-實施例中’上述之清除設備更包括 二驅動機構。第二驅減構雜_平台與滾輪式清潔機 構其中之一移動。 月〆’、 方向 在本發明之一實施例中’上述之第一方向與第 6 1373990 070362.TW 24671twf.doc/n 實質上垂直。 在本發明之一實施例中，上述之清潔輪具有平行於第 一方向之一旋轉抽。 在本發明之一實施例中’上述之滚輪式清潔機構更包 括一配置於清潔輪之一表面之吸附材料層（adsorptive material layer)。Residual printing. ,. First-direction clearing In the embodiment of the present invention, the above-described cleaning apparatus further includes a driving mechanism. The first drive mechanism is adapted to drive the platform to physically move one of the moves. - 〜月月减 In the embodiment of the present invention, the above-mentioned cleaning device further includes a second driving mechanism. The second drive reduces the movement of one of the platform and the roller type cleaning mechanism. Month', direction In one embodiment of the invention, the first direction described above is substantially perpendicular to the sixth 1373990 070362.TW 24671twf.doc/n. In an embodiment of the invention, the cleaning wheel has a rotary pumping parallel to one of the first directions. In an embodiment of the invention, the roller cleaning mechanism described above further includes an adsorbent material layer disposed on a surface of the cleaning wheel.
在本發明之一實施例中，上述之吸附材料層包括不織 布（nonwoven cloth ) 〇 在本發明之一實施例中，上述之滚輪式清潔機構更包 括一配置於清潔輪之一表面之溶劑（s〇lvent)。 在本發明之一實施例中，上述之印刷圖案之材料包括 錫膏。 本發明更提出一種清除方法’適於清除一電路板上之 一印刷圖案。清除方法包括令一真空式清潔機構之—吸嘴 沿著一第一方向清除部分之印刷圖案。然後，令一滾輪式In an embodiment of the invention, the layer of adsorbent material comprises a non-woven cloth. In an embodiment of the invention, the roller-type cleaning mechanism further comprises a solvent disposed on a surface of the cleaning wheel. 〇lvent). In an embodiment of the invention, the material of the printed pattern comprises a solder paste. The present invention further provides a cleaning method adapted to remove a printed pattern on a circuit board. The cleaning method includes causing a vacuum cleaning mechanism to remove a portion of the printed pattern along a first direction. Then, make a roller
清潔機構之一清潔輪沿著一第二方向清除殘留之印刷^ 案0 在本發明之一實施例中，上述之清潔輪沿著第二方 清除殘留之印刷圖案後，更包括令清潔輪沿著第二方向^ 相反方向再清除殘留之印刷圖案。 ° 在本發明之一實施例中，上述之第一方向與第二方向 案之材料包括 在本發明之一實施例中，上述之印刷圖 錫膏。 1373990 070362.TW 24671twf.doc/n 本發明可使清除印刷圖案的步驟自動化，以避免人為 疏失所造成的印刷圖案清除不完全的問題，進而避免電子 元件接合於上述電路板而造成電路板短路，或是電子元件 與電路板接合不良的問題。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例’並配合所附圖式，作詳細說明如下。 【實施方式】 圖1為本發明一實施例之一種清除設備之結構示意 圖。請參考圖1 ’清除設備1〇〇可用以清除一電路板200 上之一印刷圖案210。其中，電路板200例如是具有多個 接腳（未繪示）之印刷電路板（printed circuit board)，而 印刷圖案210之材質例如是由微粒金屬（s〇ider partjcie ) 及助焊劑（flux)所組成之錫膏，但也包括印刷在電路板 上的導電層（conductive layer)、光阻層（photo resist layer)、阻障層（barrier layer)或有機/無機保銲層 (organic/inorganic solderability preservative layer)等材 料。再者，印刷圖案210例如是未正確的對應於這些接腳 上。因此，印刷圖案210必須由電路板200之一表面220 上清除，以便於重新印刷正確的印刷圖案21〇。 清除設備100具有一真空式清潔機構14〇以及一滾輪 潔機構150’而真空式清潔機構14〇例如以一吸嘴142 b耆一第一方向X移動，或是以一平台110驅動電路板 相對於吸嘴142沿著第一方向X移動，以清除第一方向X 上的印刷圖案210〇此外，滾輪式清潔機構15〇例如以一 1373990 070362.TW 24671twf.doc/n 清潔輪152沿著一第二方向滾動，或是以平台11〇驅動電 路板200相對於清潔輪152沿著第二方向y移動，以清除 第二方向y上的印刷圖案210。 於此實施例中，平台100例如是χ_γ雙軸導螺桿平 台，並可用以承載電路板200。驅動機構120適於帶^平 台110之一導螺桿112轉動，以驅動平台11〇沿著一第一 方向X相對於真空式清潔機構140移動。驅動機構則 適於帶動平台110之另一導螺桿114轉動，以驅動平台ιι〇 沿著一第二方向y相對於滚輪式清潔機構15〇移動。其中， 第一方向X與第二方向y實質上垂直。 再者’真空式清潔機構140例如具有一長條狀的吸嘴 142，可一次性地吸取在第一方向χ上的印刷圖案12〇，而 滾輪式清潔機構150例如具有一長條狀的清潔輪152，可 一次性地吸附在第二方向y上的印刷圖案12〇。清潔輪152 具有平行於第一方向X之一旋轉軸154，且滾輪式清潔機 構150更具有一配置於清潔輪152之一表面156之吸附材 料層。其中，吸附材料層例如是不織布，且不織布中更包 含有助於清除錫膏之溶劑。以下將說明利用清除設備1〇〇 清除電路板200之表面220上之印刷圖案210的方式。 首先’將電路板200設置於平台11〇上。然後，令驅 動機構120帶動平台110沿著第一方向χ相對於真空式清 潔機構140移動，以使吸嘴142沿著第一方向χ之相反方 向移動。此時，吸嘴142可藉由吸力清除電路板2〇〇之表 面220上之印刷圖案210。接著，令驅動機構13〇帶動平 1373990 070362.TW 24671twf.doc/n 台110沿著第二方向y相對於滾輪式清潔機構⑼移動， 以使清潔輪152沿著第二方向相反方向移動。此時， 輪152可藉由位於其表面156上之吸晴料層與溶劑 >月除電路板200之表φ 220上因吸嘴142雜不完全而殘 印刷圖案210。然、後’驅動機構13()更可帶動平台ιι〇 /。著第一方向y之相反方向相對於滚輪式清潔機構⑼移 動’以重複清除電路板之表面220，直到印刷圖案210 完全清除為止。 由上述實施例中可知’本發明可使清除印刷圖案的步 驟自動化’以避免習知技藝中人為疏失所造成的印刷圖案 清除不完全關題’進㈣免電子元件接合於上述電路板 而造成電路板短路，或是電子元件與電路板接合 題。 、，除此之外，在其他實施例中，平台110還可以是固定 式平台。此時，真空式清潔機構140以一驅動機構（未繪 不）帶動吸嘴14 2沿著第-方向χ移動，而滾輪式清潔機 ^冓150則以另一驅動機構（未繪示）帶動清潔輪152沿著 ，二方向y滾動。其中，上述驅動機構例如是懸吊式驅動 裔、線性傳動皮帶輪、齒輪組或氣壓/液壓控制器等元件， 其分別耦接至吸嘴142與清潔輪152的旋轉軸154，以令 吸嘴142與清潔輪152清除大面積印刷不良的圖案。 综上所述’由於本發明可使清除印刷圖案的步驟自動 =，以避免習知技蟄中人為疏失所造成的印刷圖案清除不 完全的問題。因此，本發明可避免電子元件接合於上述電 1373990 070362.TW 24671twf.d〇c/n 路板而造成f路板轉，献電子元件與電路板接合不良 9Π ΓιΆ όΜ ο 雖然本發明已以較佳實施例揭露如上 限f本發明，任何所屬技術領域中具有通常知 脫離本發明之精神和，當 #在不 :;本發明之保護範圍當視後附之申者One of the cleaning mechanisms cleans the remaining printing along a second direction. In one embodiment of the invention, the cleaning wheel includes a cleaning wheel along the second side to remove the remaining printed pattern. The second direction ^ is reversed to remove the remaining printed pattern. In one embodiment of the invention, the material of the first direction and the second direction described above includes the above-described printed solder paste in an embodiment of the invention. 1373990 070362.TW 24671twf.doc/n The present invention automates the step of removing the printed pattern to avoid the problem of incomplete removal of the printed pattern caused by human error, thereby preventing the electronic component from being bonded to the circuit board and causing the circuit board to be short-circuited. Or the problem of poor connection between electronic components and the board. The above described features and advantages of the present invention will become more apparent from the following description. [Embodiment] FIG. 1 is a schematic structural view of a cleaning device according to an embodiment of the present invention. Referring to Figure 1, the cleaning device 1 can be used to erase one of the printed patterns 210 on a circuit board 200. The circuit board 200 is, for example, a printed circuit board having a plurality of pins (not shown), and the material of the printed pattern 210 is, for example, a particulate metal (s) and a flux (flux). The solder paste is composed of, but also includes a conductive layer, a photo resist layer, a barrier layer or an organic/inorganic solderability layer printed on a circuit board. Preservative layer) and other materials. Furthermore, the printed pattern 210 is, for example, incorrectly corresponding to these pins. Therefore, the printed pattern 210 must be removed from the surface 220 of one of the boards 200 to facilitate reprinting of the correct printed pattern 21". The cleaning device 100 has a vacuum cleaning mechanism 14A and a roller cleaning mechanism 150', and the vacuum cleaning mechanism 14 is moved, for example, by a nozzle 142b in a first direction X, or a platform 110 is used to drive the circuit board relative to The nozzle 142 is moved along the first direction X to remove the printed pattern 210 in the first direction X. Further, the roller cleaning mechanism 15 is, for example, a 1373990 070362.TW 24671 twf.doc/n cleaning wheel 152 along a The second direction is scrolling, or the platform 11 is driven to move the board 200 in the second direction y relative to the cleaning wheel 152 to clear the printed pattern 210 in the second direction y. In this embodiment, the platform 100 is, for example, a χ_γ biaxial lead screw platform and can be used to carry the circuit board 200. The drive mechanism 120 is adapted to rotate the lead screw 112 of the platform 110 to drive the platform 11 to move relative to the vacuum cleaning mechanism 140 in a first direction X. The drive mechanism is adapted to drive the other lead screw 114 of the platform 110 to rotate to drive the platform ιι to move relative to the roller cleaning mechanism 15 in a second direction y. Wherein, the first direction X is substantially perpendicular to the second direction y. Further, the vacuum cleaning mechanism 140 has, for example, an elongated nozzle 142 for sucking the printed pattern 12A in the first direction, and the roller cleaning mechanism 150 has, for example, a long strip of cleaning. The wheel 152 can adsorb the printed pattern 12A in the second direction y at one time. The cleaning wheel 152 has a rotating shaft 154 that is parallel to the first direction X, and the roller cleaning mechanism 150 further has an adsorbing material layer disposed on one surface 156 of the cleaning wheel 152. Among them, the adsorbent material layer is, for example, a non-woven fabric, and the non-woven fabric further contains a solvent which helps to remove the solder paste. The manner in which the cleaning pattern 1 is used to clear the printed pattern 210 on the surface 220 of the circuit board 200 will be described below. First, the circuit board 200 is placed on the platform 11A. Then, the driving mechanism 120 is caused to move the platform 110 in the first direction relative to the vacuum cleaning mechanism 140 to move the suction nozzle 142 in the opposite direction of the first direction. At this time, the suction nozzle 142 can remove the printed pattern 210 on the surface 220 of the circuit board 2 by suction. Next, the drive mechanism 13 is moved to move the flat 1373990 070362.TW 24671 twf.doc/n table 110 in the second direction y relative to the roller cleaning mechanism (9) to move the cleaning wheel 152 in the opposite direction of the second direction. At this time, the wheel 152 may be printed with the pattern 210 by the incompleteness of the nozzle 142 on the surface φ 220 of the substrate 156 on the surface 156 of the solvent < However, the rear 'drive mechanism 13 () can drive the platform ιι〇 /. The opposite direction of the first direction y is moved relative to the roller type cleaning mechanism (9) to repeatedly clear the surface 220 of the board until the printed pattern 210 is completely removed. It can be seen from the above embodiments that 'the present invention can automate the step of clearing the printed pattern' to avoid the incompleteness of the printing pattern caused by human error in the prior art. 4. The electronic component is bonded to the above circuit board to cause the circuit. The board is shorted, or the electronic component and the board are joined. In addition, in other embodiments, the platform 110 can also be a fixed platform. At this time, the vacuum cleaning mechanism 140 drives the suction nozzle 14 2 to move along the first direction by a driving mechanism (not shown), and the roller cleaning device 150 is driven by another driving mechanism (not shown). The cleaning wheel 152 rolls along the two directions y. The driving mechanism is, for example, a suspended driving driver, a linear drive pulley, a gear set or a pneumatic/hydraulic controller, and is coupled to the rotating shaft 154 of the suction nozzle 142 and the cleaning wheel 152 respectively to make the suction nozzle 142. The cleaning wheel 152 is used to remove a pattern of poor printing over a large area. In summary, the present invention allows the step of clearing the printed pattern to be automatically = to avoid the problem of incomplete removal of the printed pattern caused by human error in the prior art. Therefore, the present invention can prevent the electronic component from being bonded to the above-mentioned electric 1373990 070362.TW 24671 tw.d〇c/n board, causing the f-plate to rotate, and the electronic component and the circuit board are not properly bonded. 9 Π Ά Ά όΜ ο ο The preferred embodiment discloses the present invention as the upper limit, and any one of ordinary skill in the art is deviated from the spirit of the present invention, and when the invention is not included in the scope of protection of the present invention
【圖式簡單說明】 之結構示意 圖1為本發明一實施例之—種清除設備 圖。 【主要元件符號說明】 :清除設備 110 :平台BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a cleaning apparatus according to an embodiment of the present invention. [Main component symbol description] : Clearing device 110 : Platform
112 > 114 :導螺桿 120、130 :驅動機構 140 :真空式清潔機構 142 :吸嘴 15〇 :滾輪式清潔機構 152 .清潔輪 154 :旋轉車由 156、220 :表面 2〇〇 :電路板 210 :印刷圖案 X、y :方向112 > 114: lead screw 120, 130: drive mechanism 140: vacuum type cleaning mechanism 142: suction nozzle 15: roller type cleaning mechanism 152. cleaning wheel 154: rotating car by 156, 220: surface 2: board 210 : Printed pattern X, y: direction