TWI370899B - - Google Patents
Info
- Publication number
- TWI370899B TWI370899B TW094118936A TW94118936A TWI370899B TW I370899 B TWI370899 B TW I370899B TW 094118936 A TW094118936 A TW 094118936A TW 94118936 A TW94118936 A TW 94118936A TW I370899 B TWI370899 B TW I370899B
- Authority
- TW
- Taiwan
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
- B81C99/005—Test apparatus
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/30—Arrangements for calibrating or comparing, e.g. with standard objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
- G01N29/42—Detecting the response signal, e.g. electronic circuits specially adapted therefor by frequency filtering or by tuning to resonant frequency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2695—Bottles, containers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Remote Sensing (AREA)
- Radar, Positioning & Navigation (AREA)
- Signal Processing (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Micromachines (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004174423 | 2004-06-11 | ||
JP2005064876 | 2005-03-09 | ||
JP2005160701A JP4387987B2 (ja) | 2004-06-11 | 2005-05-31 | 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200609508A TW200609508A (en) | 2006-03-16 |
TWI370899B true TWI370899B (zh) | 2012-08-21 |
Family
ID=35005669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118936A TW200609508A (en) | 2004-06-11 | 2005-06-08 | Device for inspecting micro structure, method for inspecting micro structure and program for inspecting micro structure |
Country Status (6)
Country | Link |
---|---|
US (1) | US7383732B2 (zh) |
EP (1) | EP1605258A3 (zh) |
JP (1) | JP4387987B2 (zh) |
KR (1) | KR20060046415A (zh) |
SG (1) | SG118367A1 (zh) |
TW (1) | TW200609508A (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7814777B2 (en) * | 2005-01-03 | 2010-10-19 | Koninklijke Philips Electronics N.V. | Background acoustic signal suppression in photoacoustic detector |
WO2006093232A1 (ja) * | 2005-03-03 | 2006-09-08 | Tokyo Electron Limited | 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム |
JP4573794B2 (ja) * | 2005-03-31 | 2010-11-04 | 東京エレクトロン株式会社 | プローブカードおよび微小構造体の検査装置 |
JP2007040896A (ja) * | 2005-08-04 | 2007-02-15 | Tokyo Electron Ltd | 微小構造体の検査装置、検査方法および検査プログラム |
EP2135068A4 (en) * | 2007-03-10 | 2013-05-15 | Ruv Systems B V | METHOD AND DEVICE FOR IN-LINE QUALITY CONTROL OF WAFER |
US9933394B2 (en) | 2007-03-10 | 2018-04-03 | Sergei Ostapenko | Method and apparatus for detecting cracks and delamination in composite materials |
WO2009069670A1 (ja) * | 2007-11-26 | 2009-06-04 | Tokyo Electron Limited | 微小構造体検査装置および微小構造体検査方法 |
JP5470724B2 (ja) * | 2008-03-13 | 2014-04-16 | トヨタ自動車株式会社 | 振動試験装置 |
US8368289B2 (en) * | 2008-04-10 | 2013-02-05 | SpectraQuest, Inc. | Nondestructive testing apparatus and method |
US8076921B1 (en) * | 2008-09-18 | 2011-12-13 | The United States Of America As Represented By The Secretary Of The Navy | Self-regulating power supply for micro electronic mechanical systems thermal actuators |
JP5676315B2 (ja) * | 2011-03-07 | 2015-02-25 | 大阪瓦斯株式会社 | 流体識別装置及び流体識別方法 |
JP5929138B2 (ja) * | 2011-12-06 | 2016-06-01 | セイコーエプソン株式会社 | 圧電モーターおよびロボット |
JP5996343B2 (ja) * | 2012-09-14 | 2016-09-21 | 東芝メディカルシステムズ株式会社 | 超音波診断装置 |
EP2747075A3 (en) * | 2012-12-21 | 2016-06-22 | Intermec IP Corp. | Closed-loop active noise reduction system, such as for a thermal printer |
EP3147258A1 (en) * | 2015-09-22 | 2017-03-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Connection panel for electronic components |
EP3654041B1 (en) * | 2018-11-16 | 2022-10-19 | Siemens Industry Software NV | Volume acceleration sensor calibration |
CN113055889B (zh) * | 2021-02-01 | 2022-06-14 | 浙江大学 | 一种基于惯性测量单元共振特征的手机牧场检测与标定方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3706765C3 (de) * | 1987-03-03 | 1995-11-09 | Telefunken Microelectron | Aufprallsensor für ein Fahrzeug, mit einer Prüfschaltung |
JPS63241459A (ja) | 1987-03-30 | 1988-10-06 | Fujitsu General Ltd | 半田付不良検査方法 |
DE3736294A1 (de) | 1987-10-27 | 1989-05-11 | Messerschmitt Boelkow Blohm | Einrichtung zur funktionskontrolle von beschleunigungssensoren |
US4816125A (en) | 1987-11-25 | 1989-03-28 | The Regents Of The University Of California | IC processed piezoelectric microphone |
JPH0267956A (ja) | 1988-09-02 | 1990-03-07 | Oki Electric Ind Co Ltd | 電子部品のリード・オープン不良検出装置 |
FR2666887A1 (fr) * | 1990-09-17 | 1992-03-20 | Asulab Sa | Capteur de mesure d'une grandeur physique. |
US5481184A (en) * | 1991-12-31 | 1996-01-02 | Sarcos Group | Movement actuator/sensor systems |
US6295870B1 (en) * | 1991-02-08 | 2001-10-02 | Alliedsignal Inc. | Triaxial angular rate and acceleration sensor |
JPH0534371A (ja) | 1991-07-31 | 1993-02-09 | Tokai Rika Co Ltd | 半導体加速度センサの感度測定装置 |
JPH05203485A (ja) | 1992-01-28 | 1993-08-10 | Koichi Nakano | 共振周波数自動検出方法及びその装置 |
JPH06313785A (ja) | 1993-04-28 | 1994-11-08 | Hioki Ee Corp | 振動による実装部品の半田付け不良検出方法並びに加振装置及び加振、測定プローブユニット |
JPH09196682A (ja) * | 1996-01-19 | 1997-07-31 | Matsushita Electric Ind Co Ltd | 角速度センサと加速度センサ |
JPH112643A (ja) | 1997-06-12 | 1999-01-06 | Denso Corp | 加速度センサの周波数特性検査装置 |
US6507187B1 (en) * | 1999-08-24 | 2003-01-14 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ultra-sensitive magnetoresistive displacement sensing device |
JP3440037B2 (ja) | 1999-09-16 | 2003-08-25 | 三洋電機株式会社 | 半導体装置、半導体エレクトレットコンデンサマイクロホンおよび半導体エレクトレットコンデンサマイクロホンの製造方法。 |
JP3902134B2 (ja) * | 2001-01-22 | 2007-04-04 | エランテック デバイシーズ コーポレイション | 応力センサ |
US6595058B2 (en) * | 2001-06-19 | 2003-07-22 | Computed Ultrasound Global Inc. | Method and apparatus for determining dynamic response of microstructure by using pulsed broad bandwidth ultrasonic transducer as BAW hammer |
WO2003096444A2 (en) * | 2002-05-13 | 2003-11-20 | University Of Florida | Resonant energy mems array and system including dynamically modifiable power processor |
US6836336B2 (en) * | 2002-10-08 | 2004-12-28 | Bechtel Bwxt Idaho, Llc | Inspection system calibration methods |
FR2847384B1 (fr) * | 2002-11-01 | 2008-08-29 | Suss Microtec Test Systems Gmbh | Procede et dispositif pour tester des substrats sensibles aux mouvements |
US7463364B2 (en) * | 2003-07-31 | 2008-12-09 | Ler Technologies, Inc. | Electro-optic sensor |
JP4573794B2 (ja) * | 2005-03-31 | 2010-11-04 | 東京エレクトロン株式会社 | プローブカードおよび微小構造体の検査装置 |
-
2005
- 2005-05-31 JP JP2005160701A patent/JP4387987B2/ja not_active Expired - Fee Related
- 2005-06-08 TW TW094118936A patent/TW200609508A/zh not_active IP Right Cessation
- 2005-06-10 KR KR20050049878A patent/KR20060046415A/ko active IP Right Grant
- 2005-06-10 US US11/149,176 patent/US7383732B2/en not_active Expired - Fee Related
- 2005-06-10 SG SG200503730A patent/SG118367A1/en unknown
- 2005-06-10 EP EP20050012547 patent/EP1605258A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP4387987B2 (ja) | 2009-12-24 |
EP1605258A3 (en) | 2007-05-30 |
US20050279170A1 (en) | 2005-12-22 |
TW200609508A (en) | 2006-03-16 |
EP1605258A2 (en) | 2005-12-14 |
US7383732B2 (en) | 2008-06-10 |
JP2006313137A (ja) | 2006-11-16 |
KR20060046415A (ko) | 2006-05-17 |
SG118367A1 (en) | 2006-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |