TWI370107B - Novel methods for making and using halosilylgermanes - Google Patents
Novel methods for making and using halosilylgermanesInfo
- Publication number
- TWI370107B TWI370107B TW097112443A TW97112443A TWI370107B TW I370107 B TWI370107 B TW I370107B TW 097112443 A TW097112443 A TW 097112443A TW 97112443 A TW97112443 A TW 97112443A TW I370107 B TWI370107 B TW I370107B
- Authority
- TW
- Taiwan
- Prior art keywords
- halosilylgermanes
- making
- novel methods
- novel
- methods
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
- C01B33/107—Halogenated silanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/933—Germanium or silicon or Ge-Si on III-V
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Silicon Compounds (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US90950507P | 2007-04-02 | 2007-04-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200904754A TW200904754A (en) | 2009-02-01 |
| TWI370107B true TWI370107B (en) | 2012-08-11 |
Family
ID=40226734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097112443A TWI370107B (en) | 2007-04-02 | 2008-04-02 | Novel methods for making and using halosilylgermanes |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8043980B2 (enExample) |
| EP (1) | EP2139680A4 (enExample) |
| JP (2) | JP5638387B2 (enExample) |
| KR (1) | KR101501700B1 (enExample) |
| CN (1) | CN101678665B (enExample) |
| TW (1) | TWI370107B (enExample) |
| WO (1) | WO2009005862A2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1019439A3 (fr) * | 2010-07-30 | 2012-07-03 | Diarotech | Procede pour synthetiser par depot chimique en phase vapeur une matiere solide, en particulier du diamant, ainsi qu'un dispositif pour l'application du procede. |
| US8945418B2 (en) * | 2011-11-16 | 2015-02-03 | The United States Of America, As Represented By The Secretary Of The Navy | Melt stabilization and vapor-phase synthesis of cesium germanium halides |
| US9214630B2 (en) * | 2013-04-11 | 2015-12-15 | Air Products And Chemicals, Inc. | Method of making a multicomponent film |
| US9299566B2 (en) * | 2014-02-25 | 2016-03-29 | Tsinghua University | Method for forming germanium-based layer |
| CN104362298B (zh) * | 2014-12-03 | 2018-11-06 | 京东方科技集团股份有限公司 | 一种电极片及其制备方法、储能装置 |
| WO2018084878A1 (en) * | 2016-11-03 | 2018-05-11 | Intel Corporation | Quantum dot devices |
| EP3413334B1 (de) * | 2017-06-01 | 2020-09-09 | Evonik Operations GmbH | Neue chlorsilylarylgermane, verfahren zu deren herstellung und deren verwendung |
| EP3653577B1 (de) * | 2018-11-14 | 2021-10-06 | Evonik Operations GmbH | Tris(trichlorsilyl)dichlorogallylgerman, verfahren zu dessen herstellung und dessen verwendung |
| DE102020114994A1 (de) | 2020-06-05 | 2021-12-09 | Johann Wolfgang Goethe-Universität Frankfurt am Main Stiftung des öffentlichen Rechts | Silylierte Oligogermane, Verfahren zur Herstellung derselben sowie die Verwendung derselben zum Herstellen eines Si- und Ge-enthaltenden Festkörpers |
| CN114890385B (zh) * | 2021-07-01 | 2023-09-08 | 中国科学院上海硅酸盐研究所 | 一种高效抗氧化二维氢锗烯纳米片及其制备方法和应用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1204724A (fr) * | 1957-07-17 | 1960-01-27 | Kali Chemie Ag | Procédé d'obtention d'éléments très purs du quatrième groupe du système périodique |
| US4910153A (en) * | 1986-02-18 | 1990-03-20 | Solarex Corporation | Deposition feedstock and dopant materials useful in the fabrication of hydrogenated amorphous silicon alloys for photovoltaic devices and other semiconductor devices |
| EG18056A (en) * | 1986-02-18 | 1991-11-30 | Solarex Corp | Dispositif feedstock materials useful in the fabrication of hydrogenated amorphous silicon alloys for photo-voltaic devices and other semiconductor devices |
| US4777023A (en) * | 1986-02-18 | 1988-10-11 | Solarex Corporation | Preparation of silicon and germanium hydrides containing two different group 4A atoms |
| US4690830A (en) * | 1986-02-18 | 1987-09-01 | Solarex Corporation | Activation by dehydrogenation or dehalogenation of deposition feedstock and dopant materials useful in the fabrication of hydrogenated amorphous silicon alloys for photovoltaic devices and other semiconductor devices |
| US7594967B2 (en) * | 2002-08-30 | 2009-09-29 | Amberwave Systems Corporation | Reduction of dislocation pile-up formation during relaxed lattice-mismatched epitaxy |
| US7540920B2 (en) * | 2002-10-18 | 2009-06-02 | Applied Materials, Inc. | Silicon-containing layer deposition with silicon compounds |
| JP4954448B2 (ja) * | 2003-04-05 | 2012-06-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 有機金属化合物 |
| US7589003B2 (en) * | 2003-06-13 | 2009-09-15 | Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University, A Corporate Body Organized Under Arizona Law | GeSn alloys and ordered phases with direct tunable bandgaps grown directly on silicon |
| EP1807556A4 (en) | 2004-09-14 | 2011-03-02 | Univ Arizona | METHOD OF PULLING SI-GE SEMICONDUCTOR MATERIALS AND COMPONENTS ON SUBSTRATES |
| US7981392B2 (en) | 2004-09-14 | 2011-07-19 | The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University | Hydride compounds with silicon and germanium core atoms and method of synthesizing same |
| US7312128B2 (en) * | 2004-12-01 | 2007-12-25 | Applied Materials, Inc. | Selective epitaxy process with alternating gas supply |
-
2008
- 2008-04-02 CN CN2008800171455A patent/CN101678665B/zh not_active Expired - Fee Related
- 2008-04-02 KR KR1020097022759A patent/KR101501700B1/ko not_active Expired - Fee Related
- 2008-04-02 TW TW097112443A patent/TWI370107B/zh not_active IP Right Cessation
- 2008-04-02 EP EP08826083A patent/EP2139680A4/en not_active Withdrawn
- 2008-04-02 US US12/594,250 patent/US8043980B2/en not_active Expired - Fee Related
- 2008-04-02 JP JP2010502252A patent/JP5638387B2/ja not_active Expired - Fee Related
- 2008-04-02 WO PCT/US2008/059095 patent/WO2009005862A2/en not_active Ceased
-
2013
- 2013-12-04 JP JP2013251335A patent/JP2014112681A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN101678665A (zh) | 2010-03-24 |
| WO2009005862A2 (en) | 2009-01-08 |
| US20100151666A1 (en) | 2010-06-17 |
| EP2139680A2 (en) | 2010-01-06 |
| KR20100016087A (ko) | 2010-02-12 |
| CN101678665B (zh) | 2013-07-10 |
| EP2139680A4 (en) | 2012-01-04 |
| JP2010523458A (ja) | 2010-07-15 |
| US8043980B2 (en) | 2011-10-25 |
| WO2009005862A3 (en) | 2009-02-26 |
| JP2014112681A (ja) | 2014-06-19 |
| JP5638387B2 (ja) | 2014-12-10 |
| KR101501700B1 (ko) | 2015-03-11 |
| TW200904754A (en) | 2009-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |