TWI369584B - - Google Patents

Info

Publication number
TWI369584B
TWI369584B TW098120457A TW98120457A TWI369584B TW I369584 B TWI369584 B TW I369584B TW 098120457 A TW098120457 A TW 098120457A TW 98120457 A TW98120457 A TW 98120457A TW I369584 B TWI369584 B TW I369584B
Authority
TW
Taiwan
Application number
TW098120457A
Other versions
TW201007360A (en
Inventor
Junichi Iso
Yoshiki Ajioka
Mitsuru Ishi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201007360A publication Critical patent/TW201007360A/zh
Application granted granted Critical
Publication of TWI369584B publication Critical patent/TWI369584B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW98120457A 2008-06-18 2009-06-18 Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board TW201007360A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008159062 2008-06-18

Publications (2)

Publication Number Publication Date
TW201007360A TW201007360A (en) 2010-02-16
TWI369584B true TWI369584B (zh) 2012-08-01

Family

ID=41434110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98120457A TW201007360A (en) 2008-06-18 2009-06-18 Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board

Country Status (6)

Country Link
JP (1) JP4645776B2 (zh)
KR (1) KR101040475B1 (zh)
CN (2) CN102067037B (zh)
MY (1) MY152017A (zh)
TW (1) TW201007360A (zh)
WO (1) WO2009154194A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101345930B1 (ko) * 2009-03-13 2013-12-27 히타치가세이가부시끼가이샤 감광성 수지 조성물, 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
KR101775206B1 (ko) * 2010-03-19 2017-09-05 히타치가세이가부시끼가이샤 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법
CN102375335B (zh) * 2010-08-10 2015-04-15 日立化成工业株式会社 树脂组合物、感光性元件、抗蚀图形与线路板的制造方法
CN103076719B (zh) * 2011-10-26 2019-08-09 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法
CN103064253B (zh) * 2012-12-05 2015-04-08 北京化工大学常州先进材料研究院 一种含有吖啶类氧化物的感光性组合物
KR101708343B1 (ko) * 2013-12-27 2017-02-20 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
TW201546547A (zh) * 2014-05-13 2015-12-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法
KR102061130B1 (ko) * 2015-05-21 2020-02-20 창저우 트론리 어드벤스드 일렉트로닉 머티어리얼스 컴퍼니, 리미티드 피라졸린계 증감제 및 그 제조방법과 응용

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3843204A1 (de) * 1988-12-22 1990-06-28 Hoechst Ag Photopolymerisierbares gemisch und dieses enthaltendes photopolymerisierbares aufzeichnungsmaterial
US5217845A (en) * 1988-12-22 1993-06-08 Hoechst Aktiengesellschaft Photopolymerizable mixture and photopolymerizable copying material containing same
US6010824A (en) * 1992-11-10 2000-01-04 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition containing a triazine compound and a pre-sensitized plate using the same, and photosensitive resin composition containing acridine and triazine compounds and a color filter and a pre-sensitized plate using the same
US5952153A (en) * 1997-12-01 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility, adhesion and stripping characteristics
JP4524844B2 (ja) * 2000-03-23 2010-08-18 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
MY130867A (en) * 2000-09-20 2007-07-31 Hitachi Chemical Co Ltd Photosensitive element, method of forming resist pattern, and method of making printed circuit board
TWI296738B (zh) * 2001-03-29 2008-05-11 Hitachi Chemical Co Ltd
JP4519356B2 (ja) * 2001-04-26 2010-08-04 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP4315892B2 (ja) * 2004-11-25 2009-08-19 東京応化工業株式会社 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
US20090233230A1 (en) * 2005-07-22 2009-09-17 Yosuke Hata Photosensitive Resin Composition and Laminates
JP4761909B2 (ja) * 2005-10-05 2011-08-31 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
JP5050707B2 (ja) * 2006-10-18 2012-10-17 日立化成工業株式会社 感光性樹脂組成物及び感光性フィルム
JP5252963B2 (ja) * 2007-04-17 2013-07-31 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体

Also Published As

Publication number Publication date
TW201007360A (en) 2010-02-16
WO2009154194A1 (ja) 2009-12-23
CN102067037A (zh) 2011-05-18
CN102067037B (zh) 2013-07-24
MY152017A (en) 2014-08-15
JPWO2009154194A1 (ja) 2011-12-01
KR101040475B1 (ko) 2011-06-09
JP4645776B2 (ja) 2011-03-09
KR20110005914A (ko) 2011-01-19
CN103064250A (zh) 2013-04-24

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