TWI369583B - Photosensitive polyamic ester composition - Google Patents

Photosensitive polyamic ester composition

Info

Publication number
TWI369583B
TWI369583B TW097112401A TW97112401A TWI369583B TW I369583 B TWI369583 B TW I369583B TW 097112401 A TW097112401 A TW 097112401A TW 97112401 A TW97112401 A TW 97112401A TW I369583 B TWI369583 B TW I369583B
Authority
TW
Taiwan
Prior art keywords
ester composition
photosensitive polyamic
polyamic ester
photosensitive
composition
Prior art date
Application number
TW097112401A
Other languages
English (en)
Other versions
TW200907567A (en
Inventor
Nobuchika Tamura
Motohiro Niwa
Kimiyuki Maruyama
Original Assignee
Asahi Kasei Emd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Emd Corp filed Critical Asahi Kasei Emd Corp
Publication of TW200907567A publication Critical patent/TW200907567A/zh
Application granted granted Critical
Publication of TWI369583B publication Critical patent/TWI369583B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW097112401A 2007-04-04 2008-04-03 Photosensitive polyamic ester composition TWI369583B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007097930 2007-04-04

Publications (2)

Publication Number Publication Date
TW200907567A TW200907567A (en) 2009-02-16
TWI369583B true TWI369583B (en) 2012-08-01

Family

ID=39831047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112401A TWI369583B (en) 2007-04-04 2008-04-03 Photosensitive polyamic ester composition

Country Status (3)

Country Link
JP (1) JP5043932B2 (zh)
TW (1) TWI369583B (zh)
WO (1) WO2008123583A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5747437B2 (ja) * 2009-04-14 2015-07-15 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
JP2015127817A (ja) * 2009-04-14 2015-07-09 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
JP5657414B2 (ja) * 2010-02-16 2015-01-21 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP6261981B2 (ja) * 2011-10-05 2018-01-17 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
JP5875345B2 (ja) * 2011-11-28 2016-03-02 ニッコー・マテリアルズ株式会社 ソルダーレジスト用感光性樹脂組成物、及びこれを用いたソルダーレジスト用フォトレジストフィルム
JP6572770B2 (ja) * 2013-10-09 2019-09-11 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、及びそれを用いた硬化膜の製造方法
WO2015125469A1 (ja) * 2014-02-19 2015-08-27 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、それによって形成される硬化膜及びパターン硬化膜、及びそれらの製造方法
WO2016194769A1 (ja) 2015-05-29 2016-12-08 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
TW201741772A (zh) * 2016-02-26 2017-12-01 富士軟片股份有限公司 積層體的製造方法及半導體元件的製造方法
WO2017204178A1 (ja) * 2016-05-23 2017-11-30 日産化学工業株式会社 剥離層形成用組成物及び剥離層
WO2018037997A1 (ja) * 2016-08-22 2018-03-01 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
CN109814336B (zh) * 2019-01-21 2022-05-17 深圳市道尔顿电子材料有限公司 可碱溶负性光敏聚酰亚胺树脂组合物
CN110431483B (zh) * 2019-01-23 2022-02-11 律胜科技股份有限公司 感光性树脂组合物及其应用
US20220204697A1 (en) * 2020-12-31 2022-06-30 Industrial Technology Research Institute Polymer and resin composition thereof
CN114316263B (zh) * 2022-01-17 2023-02-03 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610815B1 (en) * 1999-01-21 2003-08-26 Asahi Kasei Kabushiki Kaisha Polyamic acid ester
JP2003316002A (ja) * 2002-04-22 2003-11-06 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、これを用いたパターン製造方法及び電子部品
JP2004085637A (ja) * 2002-08-23 2004-03-18 Kyocera Chemical Corp 感光性樹脂組成物およびその製造方法

Also Published As

Publication number Publication date
JPWO2008123583A1 (ja) 2010-07-15
JP5043932B2 (ja) 2012-10-10
WO2008123583A1 (ja) 2008-10-16
TW200907567A (en) 2009-02-16

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