TWI366423B - - Google Patents

Info

Publication number
TWI366423B
TWI366423B TW098138498A TW98138498A TWI366423B TW I366423 B TWI366423 B TW I366423B TW 098138498 A TW098138498 A TW 098138498A TW 98138498 A TW98138498 A TW 98138498A TW I366423 B TWI366423 B TW I366423B
Authority
TW
Taiwan
Application number
TW098138498A
Other versions
TW201026181A (en
Inventor
Tomokazu Segawa
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW201026181A publication Critical patent/TW201026181A/zh
Application granted granted Critical
Publication of TWI366423B publication Critical patent/TWI366423B/zh

Links

TW98138498A 2008-12-03 2009-11-12 Method to mount reinforcing boards in a printed-circuit board TW201026181A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008309155A JP2010135519A (ja) 2008-12-03 2008-12-03 プリント回路基板における補強板取付方法

Publications (2)

Publication Number Publication Date
TW201026181A TW201026181A (en) 2010-07-01
TWI366423B true TWI366423B (zh) 2012-06-11

Family

ID=42346522

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98138498A TW201026181A (en) 2008-12-03 2009-11-12 Method to mount reinforcing boards in a printed-circuit board

Country Status (3)

Country Link
JP (1) JP2010135519A (zh)
CN (1) CN101754582B (zh)
TW (1) TW201026181A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103561548B (zh) * 2013-11-20 2016-09-14 广东生益科技股份有限公司 改善多层板铆钉位置处压板皱纹的方法
KR101788446B1 (ko) * 2016-03-07 2017-10-20 한양대학교 에리카산학협력단 인쇄회로기판 스티프너 부착 시스템
KR101788445B1 (ko) * 2016-03-07 2017-10-20 한양대학교 에리카산학협력단 인쇄회로기판 스티프너 부착 방법
WO2022224413A1 (ja) * 2021-04-22 2022-10-27 エレファンテック株式会社 電子装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154094A (ja) * 1984-12-26 1986-07-12 住友ベークライト株式会社 フレキシブルプリント回路板の製造方法
JPS63178580A (ja) * 1987-01-20 1988-07-22 松下電器産業株式会社 プリント配線板の製造方法
JPH03120063U (zh) * 1990-03-19 1991-12-10
JP3895125B2 (ja) * 2001-04-12 2007-03-22 日東電工株式会社 補強板付フレキシブルプリント回路板

Also Published As

Publication number Publication date
CN101754582B (zh) 2013-05-29
CN101754582A (zh) 2010-06-23
TW201026181A (en) 2010-07-01
JP2010135519A (ja) 2010-06-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees