TWI365986B - Probe tip, probe card, method of manufacturing a probe tip and method of manufacturing a probe structure - Google Patents

Probe tip, probe card, method of manufacturing a probe tip and method of manufacturing a probe structure

Info

Publication number
TWI365986B
TWI365986B TW096148529A TW96148529A TWI365986B TW I365986 B TWI365986 B TW I365986B TW 096148529 A TW096148529 A TW 096148529A TW 96148529 A TW96148529 A TW 96148529A TW I365986 B TWI365986 B TW I365986B
Authority
TW
Taiwan
Prior art keywords
probe
manufacturing
tip
probe tip
card
Prior art date
Application number
TW096148529A
Other languages
Chinese (zh)
Other versions
TW200827728A (en
Inventor
Choi Woo-Chang
Original Assignee
Phicom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phicom Corp filed Critical Phicom Corp
Publication of TW200827728A publication Critical patent/TW200827728A/en
Application granted granted Critical
Publication of TWI365986B publication Critical patent/TWI365986B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
TW096148529A 2006-12-21 2007-12-18 Probe tip, probe card, method of manufacturing a probe tip and method of manufacturing a probe structure TWI365986B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060131664A KR100830352B1 (en) 2006-12-21 2006-12-21 Probe tip, probe card, method of manufacturing the probe tip and method of manufacturing a probe structure

Publications (2)

Publication Number Publication Date
TW200827728A TW200827728A (en) 2008-07-01
TWI365986B true TWI365986B (en) 2012-06-11

Family

ID=39536486

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148529A TWI365986B (en) 2006-12-21 2007-12-18 Probe tip, probe card, method of manufacturing a probe tip and method of manufacturing a probe structure

Country Status (3)

Country Link
KR (1) KR100830352B1 (en)
TW (1) TWI365986B (en)
WO (1) WO2008075918A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101181519B1 (en) 2010-11-03 2012-09-10 (주)엠투엔 Probe tip and the process of manufacture
KR101309695B1 (en) 2012-05-23 2013-09-17 (주)마이크로컨텍솔루션 Contact pin for testing a bga package
KR101495046B1 (en) * 2013-09-05 2015-02-25 솔브레인이엔지 주식회사 Vertical Probe Card for Micro Bump Probing
JP6337633B2 (en) 2014-06-16 2018-06-06 オムロン株式会社 Probe pin
JP7032167B2 (en) * 2018-02-09 2022-03-08 日置電機株式会社 Probe pins, probe units and inspection equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3190128B2 (en) * 1992-08-07 2001-07-23 富士通オートメーション株式会社 4-terminal resistance measurement probe head
JP3955407B2 (en) 1999-02-05 2007-08-08 株式会社ルネサステクノロジ Element inspection probe, manufacturing method thereof, and semiconductor element inspection apparatus using the same
KR20060082509A (en) * 2005-01-12 2006-07-19 삼성전자주식회사 Multi-tip probe and method of manufacturing the same
KR100653636B1 (en) * 2005-08-03 2006-12-05 주식회사 파이컴 Vertical type probe and methods of fabricating and bonding the same

Also Published As

Publication number Publication date
TW200827728A (en) 2008-07-01
KR100830352B1 (en) 2008-05-19
WO2008075918A1 (en) 2008-06-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees