1364089 九、發明說明： 【發明所屬之技術領域】 本發明為一種晶圓破片偵測裝置及其使用方 法’應用於晶圓盒的晶圓破片偵測及移除。 【先前技術】 半導體製程（semiconductor maruifacturing) 中’晶圓會在不同的製程機台（例如蝕刻、化學氣相1364089 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a wafer fragment detecting apparatus and a method of using the same for the wafer fragment detection and removal of a wafer cassette. [Prior Art] In semiconductor manufacturing, wafers are placed on different process machines (eg, etching, chemical vapor phase).
，積、光阻塗佈及曝光等）中轉送以進行不同的製造 流裎。請參閱第一圖所示’晶圓^ i在轉送的過程中 會暫存於一晶圓盒（carrier，buffer 〇r cassette) l ^，然後一傳送單元（transfer unii)會將晶圓i 1從晶圓盒12取出放置於製程機台中。 。月茶考第—圖所示，該傳送單元在將晶圓耳 掩^疋放置於該晶圓盒1 2時，有時會發生晶圓1 1 =晶圓盒1 2而破裂，所以再將晶圓1 1由晶廣 厂 T出後，晶圓盒1 2内會有部分晶圓破片 外㈣^ ragment) 1 1 1殘留在晶圓盒1 2中。當另 存放入晶圓盒12中時，該晶圓破片1 確，m難以放入，或是放入後位置不正 =曰曰圓破片111會刮傷損壞新晶圓。 ” 問題’當每次要放入該新晶圓至晶圓 二！㈡义光感測器(一。一)來感 “2疋否有晶圓破片111殘留，如果有的 1364089 話，會通知使用者將晶圓破片丄丄丄移除。 然而該光感測器常會因為晶圓破片Ί丄丄.的體 積較小或是晶圓破片i i i的位置不在光感測器的 感測範圍，而判斷該晶圓盒工2無晶圓破片工丨工的 情況。此時新晶圓存放至晶圓盒i 2内時，將 晶圓結構或特徵被破壞。 再者，每次該光感測器發現晶圓盒i 2内有晶圓, product, photoresist coating, exposure, etc.) are transferred for different manufacturing flow. Please refer to the first figure, 'wafer ^ i will be temporarily stored in a cassette (carrier, buffer 〇r cassette) l ^, then a transfer unit (transfer unii) will be wafer i 1 It is taken out from the wafer cassette 12 and placed in the processing machine. . The monthly tea test - as shown in the figure, when the transfer unit is placed on the wafer cassette 12, the wafer 1 1 = the wafer cassette 12 may be broken, so After the wafer 11 is discharged from the crystal factory T, there will be some wafer fragments in the wafer cassette 12 (4) ragment) 1 1 1 remains in the wafer cassette 12. When stored in the wafer cassette 12, the wafer fragment 1 is indeed difficult to insert, or the position is not correct. The round fragment 111 will scratch and damage the new wafer. "Problem" when you want to put the new wafer to wafer 2! (2) Sense sensor (1. 1) to feel "2 疋 No wafer fragment 111 remains, if there is 1364089, will notify The user removes the wafer fragment. However, the photosensor is often judged to be a wafer-free 2 chip-free chipmaker because of the small volume of the wafer fragment or the position of the wafer fragment iii is not within the sensing range of the photo sensor. The situation of absenteeism. When the new wafer is deposited into the wafer cassette i 2, the wafer structure or features are destroyed. Furthermore, each time the photo sensor finds a wafer in the wafer cassette i 2
破片1 1 1 % ’無淪晶圓破片工工工體積大小，都仍 需要使用者顧外花費步驟將該晶圓破片丄丄丄取 出’無法有一裝置或方法能夠自動將晶圓破片 移除至晶圓金外1 2。 緣是，本發明人有感上述缺失可以改善，因此提 一種设計合理且有效改善上述缺失之本發明。 【發明内容】 本發明之主要目的在於提供一種Fragment 1 1 1 % 'The size of the flawless wafer chipper, still requires the user to take extra steps to remove the wafer fragment. 'There is no device or method to automatically remove the wafer fragment to Wafer gold outside 1 2 . The reason is that the inventors have felt that the above-mentioned deletion can be improved, and therefore a present invention which is rational in design and effective in improving the above-described deficiency is proposed. SUMMARY OF THE INVENTION The main object of the present invention is to provide a
其使用方法，其利用氣嶋偵測及排除晶S 益内的晶圓破片。 上述目的，本發明提供—種晶圓破片谓測装 ，、叹於晶圓盒中，該晶圓破· 複數個偵測孔，1開〜兮曰阿人/戒罝。栝. 、关.其， 山…開δ又於該日日®盒中丨複數個氣體輸 =e ^各連接㈣測孔；以及複數個氣麼感應 :、:,：：連接於該等氣體輸送管中，各量測該等氣體 輸运官内的氣體壓力值。 、、本發明另提出一種晶圓破片偵測裝置的使用方 法包括有下列步驟：提供一晶圓盒及設於晶.圓盒内 的晶圓破，片偵測裝置，該晶圓破片偵測裝置包括積測 孔:氣體輸送管及氣㈣應器；將氣體通人該氣體輸 C答内然後經由設置於該晶圓盒中的偵測孔喷出至 該晶圓盒内，·以該氣壓感應器量測該氣體輸送管的壓 力是否增加，判斷該晶圓盒是否殘留晶圓破片；當該 氣體輸送管的壓力增加，即為該晶圓盒内有晶圓破 片，以及.當該氣體輪送管的壓力無增加，則為該晶圓 盒内無晶圓破片，新的晶圓可存放入該晶圓盒内。 ▲本發明具有以下有益效果：該偵測孔能喷出氣體 犯將大邛分的晶圓破片直接吹除於該晶圓盒外，如晶 圓破片過大無法吹除時’該氣㈣應器會發出警報訊 息提醒使用者另外移除，可確保存放新的晶圓於晶圓 盒時，該晶圓盒無任何晶圓破月殘留。 為，此更進一步了解本發明之特徵及技術内 容，請參閱以下有關本發明之詳細說明及圖式，缺 而所附H僅供參考與㈣帛，並㈣ 加以限制者。 【實施方式】 請參閱第三圖所示為本發明之晶圓破片偵測裝 置2 0 ’其設於-晶圓盒3 〇中，該晶圓破片偵測 裝置2 0包括複數個偵測孔2丄、複數個氣體輸送 管2 2以及複數個氣壓感應器2 3。 該晶圓盒3 0為一直立地存放晶圓（wafer flank contact)的盒體（如第一圖所示），該等偵測孔2丄均 句分佈地開设於該晶圓盒3 〇中晶圓會接觸之部 分’該等氣It輸送管2 2的-端各連接該㈣孔2 1。 該等氣體輸送管2 2中各通有一氣體，該氣體 由該偵麻2 1噴出至晶圓幻◦中，本實施例中 該氣體為氮氣（nitrogen)。該等氣壓感應器2 3各連 接於該等氣體輸送管2 2 1量測該^輸送管2 2内的氣體壓力值’並且能在氣體壓力值異常時發 出警示訊號於使用者或是其他裝置。 ^晶圓破片偵測裝置2 〇主要是利用氣體輸送 吕2 2内乳體的屢力變化來偵測晶圓盒3 〇内晶圓 留的情況，並且可自動地移除部分情況的晶 ®破片。該晶圓破片偵測裝置2 〇運作的情形如下: 當新的晶圓放入至晶圓盒3〇内前，盔論 破片殘留於晶圓盒3〇中，該晶圓破片_ "20會先將氮氣通入至該等氣體輸送管22 3 後經由該等偵測孔21嘴出至晶圓盒3〇 續喷出-段時間，然後該等氣廢感應 的測此段時間内該等氣體輸送管”内 如果該晶圓盒3 0内無任何晶圓破片殘留時， 該等偵測孔21噴出氣體時不會受到任何晶圓破片 阻擋而使氣體的喷出產生阻力，因此該等氣體輸送 笞2 2的氣壓感應益2 3不會量測到麗力上升的総 化。 …又 請參閱第四圖所示，如果晶圓破片3丄殘留於 該晶圓盒3 0内且該晶圓破片3丄的體積較小時，' 該氮氣噴出的力量可以直接將該晶圓破片3丄吹除 於晶圓盒3 0外，達到晶圓破片3工移除的功用：、 雖然該晶圓破片3 1體積較小，但仍會對氣體的喷 出產生些許阻力，故此時該氣壓感應器2 3會量測 到該氣體輪送管2 2的壓力有稍微上升，但^晶圓 破片3 1吹除後，氣體壓力就會恢復成正常值田。曰曰 …μ苓閱第五圖，如晶圓破片3 1太大而氣體 壓力不足夠將其吹除於該晶圓盒3 0外時，該晶 破片$ 1會阻礙該晶圓破片3丄附近處的偵測孔 上的f體噴出’因此造成連接該偵測孔2丄的氣 官2 2内壓力增加。連接該氣體輪送管2 2 =壓感應器2 3感測該氣體麗力不正常地增加時 會發^訊息提醒使用者，達到晶圓破片制的功用 月 > 閱第十圖所示，並請同時配合參 二 圖’上述之晶圓破片偵測裝置2 〇的使 法可％納為下列步驟： s 1 Ο 1 :提供一晶圓盒3 0及設於晶圓盒3 〇内的晶圓破片偵測裝置2〇，該晶圓破片偵測裝. 置2 0包括上述之偵測孔2 1、氣體輸送管2 2^ 氣壓感應器2 3 ; S 103 :將氣體（氮氣）通入該晶圓破片偵 測裝置2 0的氣體輸送管2 2内，然後經由設置於 晶圓盒3 0中的偵測孔2 1噴出至晶圓盒3 〇内； '—S 1 〇 5 :以該氣壓感應器2 3量測該氣體輪 送管2 2的壓力是否增加’進而判斷該晶圓盒3 〇 疋否殘留晶圓破片3 1。如該氣體輸送管2 2的壓 力無增加，則表示該晶圓盒3 〇内無晶圓破片3 1 ’反之該氣體輸送管22壓力增加則表示該晶圓 盒30内有晶圓破片31 ; S 1 〇 7 :當該晶圓盒3 〇内任何無晶圓破片 3 1時’新的晶圓可存放入該晶圓盒3 〇内； S 109 :如該氣體輸送管22的壓力增加， 進一步判斷一段時間内該壓力值是否無恢復原始 值。如該氣體輸送管2 2的壓力隨即恢復成原始 值，表不該晶圓盒3 〇内的晶圓破片3 1被偵測孔 2 2喷出的氣體吹除。反之，該氣體輸送管2 2的 壓力無恢復成原始值，表示晶圓盒3 〇内的晶圓破 片無法被排除； S 1 1 1 ·該氣體輸送管2 2的壓力無恢復成 1364089 圓破片偵測裝置2 0會發出一警報 ，使用者再利用其他方法移除該晶Its method of use, which utilizes gas enthalpy to detect and exclude wafer fragments within the crystal. In view of the above, the present invention provides a wafer fragmentation device, which is sighed in the wafer cassette, and the wafer is broken and plural detection holes, and the opening is a 兮曰 人 / / 罝 罝.栝., 关. Its, mountain...open δ and in the day ® box, a plurality of gas transmissions = e ^ each connection (four) hole; and a plurality of gas sensors:, :, :: connected to the gas In the delivery pipe, each gas pressure value in the gas transporting officer is measured. The invention further provides a method for using a wafer fragment detecting device, comprising the steps of: providing a wafer cassette and a wafer breaking device disposed in the crystal box, the film detecting device, and the wafer fragment detecting device The device includes a product measuring hole: a gas conveying pipe and a gas (four) device; the gas is passed through the gas and sent to the wafer cassette through a detecting hole disposed in the wafer cassette, and The air pressure sensor measures whether the pressure of the gas delivery pipe increases, and determines whether the wafer cassette remains a wafer fragment; when the pressure of the gas delivery tube increases, the wafer cassette has a wafer fragment, and If the pressure of the gas transfer tube is not increased, there is no wafer fragment in the wafer cassette, and a new wafer can be stored in the wafer cassette. ▲ The invention has the following beneficial effects: the detection hole can eject a gas to directly blow out the wafer fragment of the large enthalpy to the outside of the wafer cassette, such as when the wafer fragment is too large to be blown off, the gas (four) responsive device An alert message will be sent to alert the user to additional removal to ensure that the wafer cassette does not have any wafer breakage when the new wafer is placed in the wafer cassette. For further understanding of the features and technical aspects of the present invention, reference should be made to the following detailed description and drawings of the invention. [Embodiment] Referring to the third embodiment, the wafer fragment detecting device 20 of the present invention is disposed in a wafer cassette 3, and the wafer fragment detecting device 20 includes a plurality of detecting holes. 2丄, a plurality of gas delivery pipes 2 2 and a plurality of gas pressure sensors 23 . The wafer cassette 30 is a box for storing a wafer flank contact (as shown in the first figure), and the detection holes are uniformly distributed in the wafer cassette 3 The portion to which the wafer will contact is connected to the (4) hole 2 1 at the end of each of the gas It pipes 2 2 . A gas is passed through each of the gas delivery tubes 22, and the gas is ejected from the probe 2 to the wafer illusion. In this embodiment, the gas is nitrogen. The gas pressure sensors 23 are connected to the gas delivery tubes 2 2 1 to measure the gas pressure value in the delivery tube 2 2 and can send a warning signal to the user or other device when the gas pressure value is abnormal. . ^Film Fragment Detection Device 2 〇 mainly uses the gas force to transmit the repeated changes of the emulsion in the L2 2 to detect the wafer retention in the wafer cassette 3, and can automatically remove some of the crystals in the case. scrap. The operation of the wafer fragment detecting device 2 is as follows: Before the new wafer is placed in the wafer cassette 3, the mirror fragments remain in the wafer cassette 3, and the wafer fragment _ "20 Nitrogen gas is first introduced into the gas delivery tubes 22 3 and then ejected through the detection holes 21 to the wafer cassette 3 for a period of time, and then the gas waste sensing is measured during the period of time. If there is no wafer fragment remaining in the wafer cassette 30 in the gas delivery tube, the detection holes 21 are not blocked by any wafer fragmentation when the gas is ejected, thereby causing resistance to gas ejection. The gas pressure sensing 22 2 of the gas delivery 22 2 will not measure the rise of the Lili rise. ...Please refer to the fourth figure, if the wafer fragment 3 remains in the wafer cassette 30 When the volume of the wafer fragment is small, the force of the nitrogen gas can be directly blown out of the wafer cassette 30 to achieve the function of the wafer fragment removal: The wafer fragment 3 1 is small in size, but still exerts some resistance to the gas ejection, so the gas pressure sensor 2 3 will It is detected that the pressure of the gas transfer tube 2 2 is slightly increased, but after the wafer fragment 3 1 is blown off, the gas pressure is restored to the normal value field. 曰曰...μ苓 Read the fifth picture, such as wafer fragmentation 3 1 is too large and the gas pressure is not enough to blow it out of the wafer cassette 30, the crystal fragment $1 will block the ejection of the f body on the detection hole near the wafer fragment 3'. The pressure in the gas chamber 2 2 connected to the detecting hole 2 is increased. Connecting the gas wheel tube 2 2 = the pressure sensor 2 3 senses that the gas force is abnormally increased, and a message is sent to remind the user to reach The function of the wafer fragmentation system is as shown in the tenth figure, and please cooperate with the above-mentioned wafer fragment detection device 2 〇 to the following steps: s 1 Ο 1 : provide a wafer cassette 30 and a wafer fragment detecting device 2 disposed in the wafer cassette 3, wherein the wafer fragment detecting device includes the detecting hole 2 1 and the gas conveying tube 2 2 ^ Pneumatic sensor 2 3 ; S 103 : Passing gas (nitrogen) into the gas delivery tube 2 2 of the wafer fragment detecting device 20, and then passing through the wafer The detecting hole 2 1 in the 30 is ejected into the cassette 3; [-S 1 〇 5: measuring whether the pressure of the gas transfer tube 2 2 is increased by the air pressure sensor 23, and then determining the crystal Round box 3 残留 No residual wafer fragment 3 1. If the pressure of the gas delivery tube 2 2 is not increased, it means that there is no wafer fragment 3 1 in the wafer cassette 3 反之, otherwise the pressure of the gas delivery tube 22 is increased. Indicates that there is a wafer fragment 31 in the wafer cassette 30; S 1 〇7: when any waferless chip 3 in the wafer cassette 3 is ', a new wafer can be stored in the wafer cassette 3 ;; S109: If the pressure of the gas delivery pipe 22 increases, it is further determined whether the pressure value has not recovered the original value for a period of time. If the pressure of the gas delivery tube 2 2 is restored to the original value, it is indicated that the wafer fragment 3 1 in the wafer cassette 3 is blown off by the gas ejected from the detection hole 2 2 . Conversely, the pressure of the gas delivery tube 2 2 is not restored to the original value, indicating that the wafer fragments in the wafer cassette 3 无法 cannot be removed; S 1 1 1 · the pressure of the gas delivery tube 2 2 is not restored to 1364089 circular fragments The detecting device 20 sends an alarm, and the user uses other methods to remove the crystal.
請參閱第六圖所示為本發明晶圓破片偵測裝置 々2 0的第二實施例’與第一實施例不同之處在於該 等，體輸送管2 2的壓力變化由單一氣壓感應器2 3量測之。第二實施例與第一實施例具有相同效 果，藉由該偵測孔2 i噴出的氣體能將大部分的晶 圓破片3 1直接吹除於該晶圓盒3 〇外。當晶圓破 片3 1過大無法吹除時，該氣壓感應器2 3會發出 警報訊息提醒使用者另外移除，可確保存放新的晶 圓於晶圓盒3 0時，該晶圓盒3 〇無任何晶圓破片 3 1殘留。另外第二實施例只需設置一個氣壓感應 器2 3，可使晶圓破片偵測裝置2 〇的設置較為容 易。Referring to FIG. 6 , the second embodiment of the wafer fragment detecting device 々 20 of the present invention is different from the first embodiment in that the pressure change of the body conveying pipe 22 is controlled by a single gas pressure sensor. 2 3 measured. The second embodiment has the same effect as the first embodiment, and the gas ejected by the detecting hole 2 i can directly blow most of the wafer fragment 3 1 out of the wafer cassette 3 . When the wafer fragment 3 1 is too large to be blown out, the air pressure sensor 23 will send an alarm message to remind the user to additionally remove, which ensures that when the new wafer is stored in the wafer cassette 30, the wafer cassette 3 〇 No wafer fragments 3 1 remain. In addition, in the second embodiment, only one air pressure sensor 23 is provided, which makes the setting of the wafer fragment detecting device 2 较为 easier.
原始值時，則晶 訊號提醒使用者 圓破片3 1。 另外，第二實施例的晶圓破片偵測裝置2 〇於 實際應用時，.其實施方式亦可只設單一偵測孔2 1、單一氣體輸送管2 2及單一氣壓感應器2 3 C圖 未示）。 請參閱第七圖及第八圖所示為本發明晶圓破片 價測裝置2 0的第三實施例，與第一實施例不同之 處在於該晶圓破片偵測裝置2 0設於一水平地存放 晶圓3 2 (wafer plane contact)的晶圓盒3〇中，第三 11 1364089 實施例的晶圓破片偵測裝置2 〇同樣地具有複數個- 偵測孔.2 1、複數個氣體輸送管2 2及複數個氣壓 感應器2 3。 該等偵測孔2 1可以噴出氣體，如果㈣測孔 2 1附近有晶圓破片3丄殘留，則該偵測孔2丄喷 =的氣體能將該晶圓破片3 i直接吹除於該晶圓盒 !〇士外。同樣地’當晶圓破片31過大無法將其吹 :枯，該氣體輸送管2 2内的壓力會因此增加，此 日[氣壓感應H 2 3會感應到壓力不正常地上升而發 =警報訊息’提醒使用者晶圓盒3 〇内可能仍有 日日圓破片3 1殘留。 二參閱第九圖所示為本發明晶圓破片债測裝置 晶實施例，與第三實施例不同之處在於該 =曰 偵測裝置2 〇的複數個氣壓輸送管？ 2 屢力是由單-氣壓感應器23偵測。且第四；= =實際應用時，也可更改成只設單1 貞測孔2 | 早-氣體輸送管22及單一氣麗感應器 :。’使得該晶圓破片僧測裝置20整體架構更為簡 惟以上所述僅為本發明之較佳實施例 侷限本發明之專利伴嘈 非忍欲 明查及文舉凡運用本發明說 曰田工备所為之等效變化，均同理人 本發明之權利保護範圍内’合予陳明。 匕否於 12 丄允4089 【圖式簡單說明】 第一圖係習知晶圓盒存放晶圓之示意圖。 第二圖係習知晶圓破片殘留於晶圓盒内之示意圖。 第三圖係本發明晶圓破片偵測裝置之前視圖。 第四圖係本發明晶圓破片偵測裝置排除晶圓破片之 示意圖。 第五圖係本發明晶圓破片偵測裝置偵測晶圓破片之 示意圖。 第六圖係本發明晶圓破片偵測裝置第二實施例之前 視圖。 第七圖係本發明晶圓破片偵測裝置第三實施例之立 體圖。 第八圖係本發明晶圓破片债測裝置第三實施例之上 視圖。 第九圖係本發明晶圓破片债測裝置第四實施例之上 視圖。 第十圖係本發明晶圓破片偵測裝置之使用方法之流 程圖。 【主要元件符號說明】 〔習知〕 1 1 晶圓 111 晶圓破片 1 2 晶圓盒 13 1364089 〔本發明〕 2 0 晶圓破片债測裝置 2 1 偵測孔 22 氣體輸送管 2 3 氣壓感應器 3 0 晶圓盒 3 1 晶圓破片 3 2 晶圓At the original value, the crystal signal reminds the user to round the fragment 3 1 . In addition, the wafer fragment detecting device 2 of the second embodiment may be used in a practical application. The embodiment may also be provided with only a single detecting hole 2 1 , a single gas conveying pipe 2 2 and a single gas pressure sensor 2 3 C drawing. Not shown). Please refer to the seventh embodiment and the eighth figure for the third embodiment of the wafer fragmentation measuring device 20 of the present invention, which is different from the first embodiment in that the wafer fragment detecting device 20 is set at a level. The wafer fragment detecting device 2 of the third 11 1364089 embodiment has the same plurality of detecting holes. 2 1 , a plurality of gases The conveying pipe 22 and the plurality of air pressure sensors 23 are provided. The detecting holes 2 1 can eject gas, and if (4) the wafer fragments 3 丄 remain in the vicinity of the measuring holes 2 1 , the gas of the detecting holes 2 丄 = can directly blow the wafer fragments 3 i to the Wafer box! Gentleman outside. Similarly, when the wafer fragment 31 is too large to blow it, the pressure in the gas delivery tube 2 2 will increase. On this day [the air pressure sensing H 2 3 will sense that the pressure rises abnormally and the alarm message is sent. 'Remind users that there may still be a Japanese yen fragment 3 1 remaining in the wafer cassette 3. II. Referring to FIG. 9, the embodiment of the wafer fragmentation die-measuring device of the present invention is different from the third embodiment in that the plurality of pneumatic conveying pipes of the detecting device 2 are ?? 2 Repeat force is detected by the single-air pressure sensor 23. And fourth; = = in actual application, can also be changed to only set a single 1 贞 hole 2 | early - gas delivery tube 22 and a single gas sensor:. 'The overall structure of the wafer fragmentation device 20 is made simpler. The above description is only a preferred embodiment of the present invention. The patent of the present invention is not limited to the description of the patent and the use of the present invention. The equivalent changes of the preparations are the same as those of the same person in the scope of protection of the invention.匕No at 12 丄允4089 [Simple description of the diagram] The first figure is a schematic diagram of a conventional wafer cassette storage wafer. The second figure is a schematic diagram of a conventional wafer fragment remaining in a wafer cassette. The third figure is a front view of the wafer fragment detecting device of the present invention. The fourth figure is a schematic diagram of the wafer fragment detecting device of the present invention for eliminating wafer fragments. The fifth figure is a schematic diagram of the wafer fragment detecting device of the present invention for detecting wafer fragments. Figure 6 is a front elevational view of a second embodiment of the wafer fragment detecting apparatus of the present invention. Figure 7 is a perspective view showing a third embodiment of the wafer fragment detecting device of the present invention. Figure 8 is a top view of a third embodiment of the wafer fragmentation test apparatus of the present invention. Figure 9 is a top view of a fourth embodiment of the wafer fragmentation test apparatus of the present invention. Figure 11 is a flow chart showing the use of the wafer fragment detecting device of the present invention. [Major component symbol description] [Authentic] 1 1 Wafer 111 Wafer fragment 1 2 Wafer cassette 13 1364089 [Invention] 2 0 Wafer fragmentation measuring device 2 1 Detection hole 22 Gas delivery tube 2 3 Air pressure sensing 3 0 wafer cassette 3 1 wafer fragment 3 2 wafer
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