CN112563147B - Method, device and system for detecting bag removal of semiconductor chip product - Google Patents
Method, device and system for detecting bag removal of semiconductor chip product Download PDFInfo
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- CN112563147B CN112563147B CN202011430949.7A CN202011430949A CN112563147B CN 112563147 B CN112563147 B CN 112563147B CN 202011430949 A CN202011430949 A CN 202011430949A CN 112563147 B CN112563147 B CN 112563147B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
A method, apparatus and system for inspecting semiconductor chip products for bagging are provided. The method includes acquiring a three-dimensional profile of a semiconductor chip product to be inspected placed in a pocket of a tray; and determining whether the semiconductor chip product is out of the pocket with the top surface of the tray as a reference surface.
Description
Technical Field
The present invention relates generally to the field of semiconductor chips, and more particularly, to a method, apparatus, and system for inspecting semiconductor chip product bag-off.
Background
A semiconductor chip tray is a container provided with a plurality of recesses on a surface thereof for accommodating semiconductor chip products, and the recesses are generally called pockets. In semiconductor chip manufacturing and package inspection, semiconductor chip products (e.g., finished or unfinished semiconductor devices, packages such as PGA and BGA) are typically placed into pockets of a tray, each of which can hold one or more semiconductor chip products, and the tray with the semiconductor chip products placed thereon is then placed on a conveyor belt, which is transported by the conveyor belt to an appropriate location on a production line for processing and package inspection.
However, when the semiconductor chip product is placed in the pocket of the tray, a semiconductor chip product bagging phenomenon may occur. For example, the semiconductor chip product is placed so that a portion thereof is out of the pocket of the tray because it is inclined, or the semiconductor chip product is oversized so that its upper surface is higher than the top surface of the pocket of the tray. In either case, subsequent processing, package inspection and transportation may be negatively affected, for example, may result in reduced yields, breakage of the chip product, and the like.
In order to solve the above problems, an OOP (out of pocket) detection method is proposed to detect the bagging-off phenomenon of semiconductor chip products. As shown in the prior art apparatus for detecting the bag removal of a semiconductor chip product of fig. 1, an image pickup device is provided above a pocket of a tray, a three-dimensional profile of a semiconductor chip product to be detected placed in the pocket of the tray is acquired by the image pickup device, and with a linear scanning platform LSP below the tray as a reference height for OOP detection, whether the semiconductor chip product is bag removed is determined by comparing a height difference (shown as "H" in fig. 1) between the three-dimensional profile of the semiconductor chip product and the linear scanning platform LSP with a threshold value. However, as shown in fig. 2 (a) -2 (b), if the linear scanning stage LSP is bent or the tray is warped, erroneous judgment of the bag removal of the semiconductor chip product may be caused. For example, in a pocket of a tray, even if there is no bag-removing phenomenon, the existing apparatus for detecting the bag-removing of a semiconductor chip product may emit an alarm signal of the bag-removing of the semiconductor chip product, thereby causing a false detection of the bag-removing of the semiconductor chip product. In addition, in the pocket of the tray, even if there is a bag-removing phenomenon, the existing apparatus for detecting the bag-removing of the semiconductor chip product may not emit an alarm signal of the bag-removing of the semiconductor chip product, thereby causing a missed detection of the bag-removing of the semiconductor chip product.
Disclosure of Invention
In view of the above, the present invention provides a method, apparatus and system for inspecting semiconductor chip product bag removal. By using the method, the device and the system, the false detection and the missing detection in the bag removing detection of the semiconductor chip product can be effectively reduced by acquiring the three-dimensional outline of the semiconductor chip product to be detected, which is placed in the pocket of the tray, and determining whether the semiconductor chip product is removed from the bag or not by taking the top surface of the tray as a reference surface.
According to an embodiment of the present disclosure, there is provided a method for detecting a semiconductor chip product removal bag, including: acquiring a three-dimensional profile of a semiconductor chip product to be detected placed in a pocket of a tray; and determining whether the semiconductor chip product is out of the pocket with the top surface of the tray as a reference surface.
In some embodiments, the acquiring the three-dimensional profile of the semiconductor chip product is performed by a three-dimensional laser displacement sensor.
In some embodiments, the determining whether the semiconductor chip product is out of the pocket comprises: determining a height difference between the reference surface and the three-dimensional contour; when the height difference is greater than or equal to zero, determining that the semiconductor chip product does not have bag removal; comparing an absolute value of the height difference with a threshold when the height difference is less than zero; and determining that the semiconductor chip product is out of the pocket when the absolute value of the height difference is greater than the threshold.
In some embodiments, the threshold value is associated with a structural parameter of the semiconductor chip product to be inspected.
In some embodiments, the method further comprises: and generating alarm information indicating that the semiconductor chip product is out of the bag when the semiconductor chip product is determined to be out of the bag.
In some embodiments, the reference plane is obtained by fitting a plurality of points of four vertex regions of the tray.
In some embodiments, the fit is a multiple linear regression fit.
According to an embodiment of the present disclosure, there is provided an apparatus for detecting a semiconductor chip product removal bag, including: a contour acquisition unit for acquiring a three-dimensional contour of a semiconductor chip product to be inspected placed in a pocket of the tray; and a bag-removal determining unit for determining whether the semiconductor chip product is removed from the bag with the top surface of the tray as a reference surface.
In some embodiments, the profile acquisition unit is a three-dimensional laser displacement sensor.
In some embodiments, the bag removal determination unit is configured to: determining a height difference between the reference surface and the three-dimensional contour; when the height difference is greater than or equal to zero, determining that the semiconductor chip product does not have bag removal; comparing an absolute value of the height difference with a threshold when the height difference is less than zero; and determining that the semiconductor chip product is out of the pocket when the absolute value of the height difference is greater than the threshold.
In some embodiments, the threshold value is associated with a structural parameter of the semiconductor chip product to be inspected.
In some embodiments, the apparatus further comprises an alarm unit for generating alarm information indicating that the semiconductor chip product is out of pocket when it is determined that the semiconductor chip product is out of pocket.
In some embodiments, the reference plane is obtained by fitting a plurality of points of four vertex regions of the tray.
In some embodiments, the fit is a multiple linear regression fit.
According to an embodiment of the present disclosure, there is provided a semiconductor chip product inspection system including: the conveying belt is used for conveying the tray, wherein one or more semiconductor chip products to be detected are placed in the pockets of the tray; and an apparatus for detecting a semiconductor chip product removal bag according to the present invention.
According to an embodiment of the present disclosure, there is provided a computer-readable storage medium having stored thereon program code which, when executed by a processor, causes the processor to perform a method according to the present invention.
Drawings
The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the disclosure and to enable a person skilled in the pertinent art to make and use the disclosure.
Fig. 1 shows a schematic diagram of a prior art apparatus for inspecting a semiconductor chip product bag-off.
Fig. 2 (a) -2 (b) show schematic diagrams of bending of the linear scanning platform LSP and warping of the tray, respectively.
Fig. 3 shows a block diagram of an apparatus for inspecting a semiconductor chip product bag-off according to an embodiment of the present invention;
fig. 4 shows a schematic diagram of an apparatus for inspecting a semiconductor chip product bag-off according to an embodiment of the present invention; and
fig. 5 illustrates an operational flow diagram of a method for inspecting a semiconductor chip product bag-off according to an embodiment of the present invention.
Various embodiments will be described with reference to the accompanying drawings.
Detailed Description
The subject matter described herein will now be discussed with reference to example embodiments. It should be appreciated that these embodiments are discussed only to enable a person skilled in the art to better understand and thereby practice the subject matter described herein, and are not limiting of the scope, applicability, or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, replace, or add various procedures or components as desired. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. In addition, features described with respect to some examples may be combined in other examples as well.
It is noted that references in the specification to "one embodiment," "an embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Also, such phraseology and terminology does not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
An embodiment for detecting a semiconductor chip product take-off pocket according to the present invention will now be described with reference to the accompanying drawings.
Fig. 3 shows a block diagram of an apparatus for inspecting a semiconductor chip product bag-removing according to an embodiment of the present invention. As shown in fig. 3, the apparatus 300 for detecting the bag removal of a semiconductor chip product includes a profile acquisition unit 310, a bag removal determination unit 320, and an alarm unit 330.
The profile acquisition unit 310 is disposed above the semiconductor chip tray, and is used to acquire a three-dimensional profile of a semiconductor chip product to be inspected placed in a pocket of the tray. In one embodiment, the profile acquisition unit 310 may be a three-dimensional laser displacement sensor, such as a high-precision laser displacement sensor, gocator 2340. It is preferable for those skilled in the art to use a three-dimensional profile measuring instrument having a measurement accuracy on the order of micrometers as the profile acquiring unit 310 according to the embodiment of the present invention.
The bag-out determining unit 320 is used for determining whether the semiconductor chip product is bag-out or not with the top surface of the tray as a reference surface. In operation, the conveyor belt conveys the semiconductor chip products in the pockets of the tray, for example, at a predetermined conveyance rate (e.g., in a stepwise manner). When the semiconductor chip products on the conveyor belt pass through the profile-acquisition unit 310, the profile-acquisition unit 310 acquires the complete three-dimensional profile of the tray region. Then, the bag removal determining unit 320 acquires the complete three-dimensional profile of the tray from the profile acquiring unit 310, and analyzes the complete three-dimensional profile of the tray to obtain three-dimensional profiles of four vertex regions of the tray and three-dimensional profiles of semiconductor chip products corresponding to one or more semiconductor chip products placed in pockets of the tray. Here, the connection between the profile acquisition unit 310 and the bag removal determination unit 320 may be made via a wired or wireless manner, so that the bag removal determination unit 320 can acquire the complete three-dimensional profile of the tray from the profile acquisition unit 310 via a wired or wireless manner. In one embodiment, the profile obtaining unit 310 may actively transmit the obtained complete three-dimensional profile to the bag removal determining unit 320 after obtaining the complete three-dimensional profile of the tray. In another embodiment, the bag-out determining unit 320 transmits a request to the profile acquiring unit 310, and then in response to the request, the profile acquiring unit 310 transmits the complete three-dimensional profile of the tray to the bag-out determining unit 320.
In one embodiment, the pouch removal determining unit 320 may further include a storage unit storing information of a placement position of one or more semiconductor chip products in the pocket of the tray, and then the pouch removal determining unit 320 may determine a three-dimensional profile of the semiconductor chip products corresponding to the one or more semiconductor chip products to be tested based on the placement position of the one or more semiconductor chip products to be tested in the storage unit on the tray.
In one embodiment, the profile-acquisition unit 310 may not acquire the complete three-dimensional profile of the tray region as the semiconductor chip products on the conveyor pass the profile-acquisition unit 310. For example, the contour acquiring unit 310 may acquire only the contour of the four vertex regions of the tray and the three-dimensional contour of the semiconductor chip product corresponding to one or more semiconductor chip products placed in the pocket of the tray based on the four vertex position information and pocket position information of the tray.
Unlike the related art apparatus for detecting the bag-off of a semiconductor chip product, the apparatus 300 for detecting the bag-off of a semiconductor chip product according to an embodiment of the present invention selects the top surface of a tray as a reference plane, as shown in fig. 4. That is, the apparatus 300 for detecting the bag removal of a semiconductor chip product according to the embodiment of the present invention does not select the linear scanning platform LSP under the tray as the reference surface for the bag removal detection, but selects the top surface of the tray as the reference surface for detecting the bag removal of the semiconductor chip product. After the top surface of the tray is set as the reference plane, a height difference between the reference plane and the three-dimensional profile of the semiconductor chip product is determined, as shown by "h" in fig. 4.
The bag removal determining unit 320 acquires the outline of the four vertex regions of the tray from the outline acquiring unit 310, and obtains a reference surface for detecting whether the semiconductor chip product in the pocket of the tray is removed from the bag by fitting a plurality of points of the four vertex regions of the tray. For example, coordinates of ten points are selected from each vertex region of the tray, and by fitting a total of forty points to the four vertex regions of the tray, a curved surface can be obtained, which is then used as a reference surface for detecting whether or not the semiconductor chip product in the pocket of the tray is taken out of the pocket. The curved surface obtained by fitting the points of the four vertex areas of the tray is more accurate than by fitting only four vertices. The more points are selected from each vertex region of the tray, the more accurate the fitted surface is.
In one embodiment, the bag-out determining unit 320 fits points of four vertex areas of the tray using a least square curved surface fitting method to obtain a reference surface for detecting whether the semiconductor chip product in the pocket of the tray is out of the bag. In another embodiment, the pouch removal determining unit 320 fits points of four vertex regions of the tray using a multiple linear regression fit method to obtain a reference plane for detecting whether the semiconductor chip product in the pocket of the tray is removed from the pouch. The method of obtaining the reference surface for detecting whether the semiconductor chip product in the pocket of the tray is out of the pocket by fitting a plurality of points of the four vertex regions of the tray is not limited thereto.
The bag-out determining unit 320 is used for determining whether the semiconductor chip product is bag-out or not with the top surface of the tray as a reference surface. Specifically, the bag-off determination unit 320 first determines a height difference between a reference plane obtained by fitting a plurality of points of four vertex regions of the tray and a three-dimensional contour of the semiconductor chip product to be inspected. In one embodiment, the height difference is obtained by subtracting an average height of the three-dimensional profile of the semiconductor chip product from an average height of the reference surface, but is not limited thereto. When the height difference is greater than or equal to zero (i.e., the average height of the reference plane is greater than or equal to the average height of the three-dimensional contour of the semiconductor chip product), the bag-out determining unit 320 determines that the semiconductor chip product does not have bag-out; the bagging determination unit 320 compares an absolute value of the height difference with a threshold value when the height difference is smaller than zero (i.e., an average height of the reference surface is lower than an average height of the three-dimensional profile of the semiconductor chip product), and determines that the semiconductor chip product has a bagging when the absolute value of the height difference is greater than the threshold value.
In one embodiment, the threshold value may be set to a predetermined value associated with a structural parameter of the semiconductor chip product to be inspected for various types of semiconductor chip products to be inspected, prior to performing the bag-out inspection of the semiconductor chip product, empirically or statistically. For example, the threshold value may be set to 3-5% of the height of the semiconductor chip product to be inspected.
The alarm unit 330 is used for generating alarm information indicating that the semiconductor chip product is out of the bag when the semiconductor chip product is determined to be out of the bag. Here, the alarm information may be, for example, text alarm information, picture alarm information, optical alarm information, or audio alarm information, etc. The alert unit 330 may transmit text alert information, picture alert information, optical alert information, or play audio alert information to the user for display at the user device. Preferably, in case that the apparatus 300 for detecting the bag removal of semiconductor chip products is capable of learning the placement position information of one or more semiconductor chip products in the pocket of the tray and the detailed information (e.g., information of a chip model number, a number, etc.) of the corresponding semiconductor chip products, the alarm information may further include the detailed information of the semiconductor chip products in which the bag removal exists, thereby enabling the user to know which semiconductor chip products have the bag removal defect in particular.
Fig. 5 illustrates an operational flow diagram of a method for inspecting a semiconductor chip product bag-off according to an embodiment of the present invention.
As shown in fig. 5, first, in step 510, the profile acquisition unit 310 placed above the conveyor belt for conveying the pallet acquires the complete three-dimensional profile of the pallet conveyed via the conveyor belt. Next, in step 520, the bag removal determining unit 320 acquires the complete three-dimensional profile of the tray from the profile acquiring unit 310, and analyzes the acquired complete three-dimensional profile of the tray to obtain a three-dimensional profile of the semiconductor chip product corresponding to the one or more semiconductor chip products to be inspected. Next, in step 530, it is determined whether a height difference between a reference plane for detecting whether the semiconductor chip product in the pocket of the tray is out of the pocket, which is obtained by fitting a plurality of points of four vertex regions of the tray, and the three-dimensional profile of the semiconductor chip product is greater than or equal to zero. If the determination in step 530 is yes, then in step 540 it is determined that there is no bag removal for the semiconductor chip product; if the determination in step 530 is negative, it is determined in step 550 whether the absolute value of the height difference is greater than a threshold. If the determination in step 550 is yes, it is determined in step 560 that the semiconductor chip product is present in a bag-out. If the determination in step 550 is negative, it is determined in step 570 that the semiconductor chip product is not present to be out of the pocket. Preferably, in an embodiment of the present invention, in case it is determined that the semiconductor chip product has an out-of-bag in step 560, an alarm information indicating that the semiconductor chip product has an out-of-bag may be generated in step 580.
According to the device, the method and the system provided by the embodiment of the invention, the three-dimensional outline of the semiconductor chip product to be detected, which is placed in the pocket of the tray, is acquired, and whether the semiconductor chip product is taken off the bag or not is determined by taking the top surface of the tray as the reference surface, so that false detection and missing detection in the bag-taking detection of the semiconductor chip product can be effectively reduced.
The bag removal determination unit has been described in connection with various apparatuses and methods. The bag removal determination unit may be implemented using electronic hardware, computer software, or any combination thereof. Whether the bag removal determination unit is implemented as hardware or software will depend on the particular application and the overall design constraints imposed on the system. As an example, the bag-out determination units, any portion of the bag-out determination units, or any combination of the bag-out determination units given in this disclosure may be implemented as a microprocessor, microcontroller, digital Signal Processor (DSP), field Programmable Gate Array (FPGA), programmable Logic Device (PLD), state machine, gate logic, discrete hardware circuitry, and other suitable processing components configured to perform the various functions described in this disclosure. The functionality of the bag-out determining unit, any part of the bag-out determining unit, or any combination of the bag-out determining units presented in the present disclosure may be implemented as software executed by a microprocessor, microcontroller, DSP or other suitable platform.
According to one embodiment, a computer-readable storage medium is provided, on which program code is stored, which when executed by a processor, enables the processor to perform the various operations and functions of the various embodiments described in this specification in connection with fig. 3-5. In particular, a system or apparatus provided with a readable storage medium having stored thereon software program code implementing the functions of any of the above embodiments may be provided, and a computer or processor of the system or apparatus may be caused to read out and execute instructions stored in the readable storage medium.
Examples of readable storage media include floppy disks, hard disks, magneto-optical disks, optical disks (e.g., CD-ROMs, CD-R, CD-RWs, DVD-ROMs, DVD-RAMs, DVD-RWs), magnetic tapes, nonvolatile memory cards, and ROMs. Alternatively, the program code may be downloaded from a server computer or cloud by a communications network.
It should be noted that not all the steps and units in the above flowcharts and the system configuration diagrams are necessary, and some steps or units may be omitted according to actual needs. The order of execution of the steps is not fixed and may be determined as desired. The apparatus structures described in the above embodiments may be physical structures or logical structures, that is, some units may be implemented by the same physical entity, or some units may be implemented by multiple physical entities, or may be implemented jointly by some components in multiple independent devices.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A method for inspecting a semiconductor chip product for bagging, comprising:
acquiring a three-dimensional profile of a semiconductor chip product to be detected placed in a pocket of a tray; and
determining whether the semiconductor chip product is out of the pocket based on the three-dimensional profile and the top surface of the tray as a reference plane,
wherein the determining whether the semiconductor chip product is out of the pocket comprises:
determining a height difference between the reference surface and the three-dimensional contour;
when the height difference is greater than or equal to zero, determining that the semiconductor chip product does not have bag removal;
when the height difference is less than zero,
comparing the absolute value of the height difference with a threshold value; and
and when the absolute value of the height difference is larger than the threshold value, determining that the semiconductor chip product is in a bag-removing state.
2. The method of claim 1, wherein acquiring the three-dimensional profile of the semiconductor chip product is performed by a three-dimensional laser displacement sensor.
3. The method of claim 1, wherein the threshold value is associated with a structural parameter of the semiconductor chip product to be inspected.
4. The method of claim 1, further comprising:
and generating alarm information indicating that the semiconductor chip product is out of the bag when the semiconductor chip product is determined to be out of the bag.
5. The method of claim 1, wherein the reference plane is obtained by fitting a plurality of points of four vertex regions of the tray.
6. The method of claim 5, wherein the fit is a multiple linear regression fit.
7. An apparatus for inspecting a semiconductor chip product for bagging, comprising:
a contour acquisition unit for acquiring a three-dimensional contour of a semiconductor chip product to be inspected placed in a pocket of the tray; and
a bag-escape determination unit for determining whether the semiconductor chip product is bag-escape or not based on the three-dimensional contour and a top surface of the tray as a reference surface,
wherein the bag removal determination unit is configured to:
determining a height difference between the reference surface and the three-dimensional contour;
when the height difference is greater than or equal to zero, determining that the semiconductor chip product does not have bag removal;
when the height difference is less than zero,
comparing the absolute value of the height difference with a threshold value; and
and when the absolute value of the height difference is larger than the threshold value, determining that the semiconductor chip product is in a bag-removing state.
8. The apparatus of claim 7, wherein the profile acquisition unit is a three-dimensional laser displacement sensor.
9. The apparatus of claim 7, wherein the threshold value is associated with a structural parameter of the semiconductor chip product to be inspected.
10. The apparatus of claim 7, further comprising:
and the alarm unit is used for generating alarm information indicating that the semiconductor chip product is out of the bag when the semiconductor chip product is determined to be out of the bag.
11. The apparatus of claim 7, wherein the reference plane is obtained by fitting a plurality of points of four vertex regions of the tray.
12. The apparatus of claim 11, wherein the fit is a multiple linear regression fit.
13. A semiconductor chip product inspection system, comprising:
the conveying belt is used for conveying the tray, wherein one or more semiconductor chip products to be detected are placed in the pockets of the tray; and
the device according to any one of claims 7-12.
14. A computer readable storage medium having stored thereon program code which, when executed by a processor, causes the processor to perform the method according to any of claims 1 to 6.
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