TWI363257B - - Google Patents

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Publication number
TWI363257B
TWI363257B TW095123119A TW95123119A TWI363257B TW I363257 B TWI363257 B TW I363257B TW 095123119 A TW095123119 A TW 095123119A TW 95123119 A TW95123119 A TW 95123119A TW I363257 B TWI363257 B TW I363257B
Authority
TW
Taiwan
Prior art keywords
tester
test
semiconductor integrated
integrated circuit
mentioned
Prior art date
Application number
TW095123119A
Other languages
English (en)
Chinese (zh)
Other versions
TW200712810A (en
Inventor
Satoh Masayuki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200712810A publication Critical patent/TW200712810A/zh
Application granted granted Critical
Publication of TWI363257B publication Critical patent/TWI363257B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318314—Tools, e.g. program interfaces, test suite, test bench, simulation hardware, test compiler, test program languages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31912—Tester/user interface

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095123119A 2005-06-28 2006-06-27 Semiconductor integrated circuit development support system TW200712810A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/011798 WO2007000806A1 (ja) 2005-06-28 2005-06-28 半導体集積回路開発支援システム

Publications (2)

Publication Number Publication Date
TW200712810A TW200712810A (en) 2007-04-01
TWI363257B true TWI363257B (ja) 2012-05-01

Family

ID=37595070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123119A TW200712810A (en) 2005-06-28 2006-06-27 Semiconductor integrated circuit development support system

Country Status (2)

Country Link
TW (1) TW200712810A (ja)
WO (2) WO2007000806A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619955B (zh) * 2012-11-19 2018-04-01 泰瑞達公司 用於在半導體裝置之測試環境中偵錯的非暫態電腦可讀取儲存媒體、方法和測試設備

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8146061B2 (en) 2007-12-12 2012-03-27 Via Technologies, Inc. Systems and methods for graphics hardware design debugging and verification
CN116774990B (zh) * 2023-08-25 2023-11-28 合肥晶合集成电路股份有限公司 一种半导体机台的产品程式管理系统及管理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3569237B2 (ja) * 2001-03-09 2004-09-22 エー・テイー・イー・サービス株式会社 電子機器のテスト手段情報提供システム
JP2002350499A (ja) * 2001-05-30 2002-12-04 Ando Electric Co Ltd 半導体集積回路の試験仲介システム及びその試験仲介方法
JP2003150661A (ja) * 2001-11-15 2003-05-23 Hitachi Ltd 回路シミュレーション方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619955B (zh) * 2012-11-19 2018-04-01 泰瑞達公司 用於在半導體裝置之測試環境中偵錯的非暫態電腦可讀取儲存媒體、方法和測試設備
US9959186B2 (en) 2012-11-19 2018-05-01 Teradyne, Inc. Debugging in a semiconductor device test environment

Also Published As

Publication number Publication date
WO2007000806A1 (ja) 2007-01-04
WO2007000953A1 (ja) 2007-01-04
TW200712810A (en) 2007-04-01

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MM4A Annulment or lapse of patent due to non-payment of fees