TWI362994B - - Google Patents

Download PDF

Info

Publication number
TWI362994B
TWI362994B TW96119400A TW96119400A TWI362994B TW I362994 B TWI362994 B TW I362994B TW 96119400 A TW96119400 A TW 96119400A TW 96119400 A TW96119400 A TW 96119400A TW I362994 B TWI362994 B TW I362994B
Authority
TW
Taiwan
Prior art keywords
panel
pressing
component
pressure
press
Prior art date
Application number
TW96119400A
Other languages
English (en)
Chinese (zh)
Other versions
TW200846172A (en
Inventor
Diann Fang Lin
Ying Hsiang Chen
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Priority to TW96119400A priority Critical patent/TW200846172A/zh
Publication of TW200846172A publication Critical patent/TW200846172A/zh
Application granted granted Critical
Publication of TWI362994B publication Critical patent/TWI362994B/zh

Links

Landscapes

  • Control Of Presses (AREA)
  • Automatic Assembly (AREA)
TW96119400A 2007-05-30 2007-05-30 Bonding device for panel and its method TW200846172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96119400A TW200846172A (en) 2007-05-30 2007-05-30 Bonding device for panel and its method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96119400A TW200846172A (en) 2007-05-30 2007-05-30 Bonding device for panel and its method

Publications (2)

Publication Number Publication Date
TW200846172A TW200846172A (en) 2008-12-01
TWI362994B true TWI362994B (de) 2012-05-01

Family

ID=44823081

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96119400A TW200846172A (en) 2007-05-30 2007-05-30 Bonding device for panel and its method

Country Status (1)

Country Link
TW (1) TW200846172A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580558B (zh) * 2014-12-22 2017-05-01 克雷爾科技股份有限公司 壓合機壓力控制裝置與方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580558B (zh) * 2014-12-22 2017-05-01 克雷爾科技股份有限公司 壓合機壓力控制裝置與方法

Also Published As

Publication number Publication date
TW200846172A (en) 2008-12-01

Similar Documents

Publication Publication Date Title
TW473410B (en) Ultrasonic vibration joining device
US11065665B2 (en) Progressive die machine and method for manufacturing laminated iron cores by using same
EP1278232B1 (de) Apparat und Methode zur Kontrolle der Verbindungskraft
WO2016024365A1 (ja) 電子部品の実装装置
CN1332657A (zh) 液体定量排出方法及设备
JP2009027105A (ja) ボンディング装置
CN100333992C (zh) 微结构的制造方法及其制造系统
TWI362994B (de)
JP2011115857A (ja) 摩擦撹拌接合装置
JP2005288673A (ja) 微小構造体の製造装置
WO1990005599A1 (en) Tool position controller of bending machine
WO2002049094A1 (fr) Procédé et dispositif de montage de microcircuit
CN102416424A (zh) 一种无模无铆连接设备
JP3901529B2 (ja) 接合装置
CN106981820B (zh) 大功率激光二极管钯条封焊夹具
JP4854357B2 (ja) 転写装置および転写方法
CN213423635U (zh) 一种显示器双工位膜片贴合机
WO2011120268A1 (zh) 调节固定机构及其操作方法
TW201107139A (en) Alignment device for multi-layer laminate bonding machine
JP2004273688A (ja) 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置
JP2008018444A (ja) 加圧装置およびワークの角部成形装置
JPH10128588A (ja) プレスの駆動装置
CN106042601A (zh) 一种高效触控屏压合机
CN216782695U (zh) 一种可调压合装置
JP2005034863A (ja) 摩擦攪拌接合方法及び装置