1362238 九、發明說明 【發明所屬之技術領域】 本發明係有1362238 IX. Description of the invention [Technical field to which the invention pertains] The present invention is related to
V 、但电吟珉的焊接結構與方法，特 有關於-種可自較位且不用額外加焊錫之電路 = 結構與方法。 &接 【先前技術】 在目前大多數主機板産品中，大多是採用拉焊的方式來 焊接一個主軟性電路板（Main FPC)與一個次軟性電路 (Sub FPC)，其中拉焊點的高度約爲〇2公釐。在實施拉焊 時，作業員必須通過焊點旁的定位孔來定位主軟性電路板與 次軟性電路板，再使用加焊錫的方式以手動來進行拉焊。缺 而’此種拉焊方式容易造成空焊、焊點偏移、及所施加之焊 錫量過多或過少的偏差’因而增加了電路板上之綫路產生短 路或斷路的風險。 【發明内容】 因此，本發明一方面就是在提供一種電路板的焊接結構 與方法，藉以克服習知技術之缺點。 .依照本㈣之實施例，本發明之電路板㈣接結構包 3第冑路板'一第二電路板及至少-個痒接凸塊。第 -電路板具有至少—個貫穿孔，而輝接凸塊係設置於第二電 路板士並分別對應地穿過貫穿孔，其中每一個痒接凸塊的高 度係阿於第—電路板的上表面接凸塊係實質為例如：圓 雜而焊接凸塊與第二電路板的連接面積係小於或等於貫 238 穿孔的面積。 依…本發明之實施例’在本發明之電路板的谭接方法 中’首先提供第-電路板和第二電路板。接著，使第一電路 板具有至少—個貫穿孔，並使第二電路板上^置至少—個焊 接凸塊對應至第-電路板之至少_個貫穿孔的位置，置中每 -個焊接凸塊的高度係大於第一電路板的厚度、然後分別 將焊接凸塊對應地穿過貫穿孔接 牙避員芽孔接著，使用焊接凸塊且不額 外使用焊錫’來直接進行焊接製程，錢焊接凸塊產生形變 紹流蓋覆於貫穿孔之外緣，藉以將第—電路板與第二電路 板焊合在一起。 應用上述之電路板的焊接結構與方法，可直接用拉㈣ 做為定位與焊錫之用’因而不用另做定位孔與额外加焊錫， 故可減少電路板上之綫路產生短路或斷路的風險。 【實施方式】 本發明主要是在於增加習知之主軟性電路板上之拉焊 點(焊接凸塊)的高度；幷將拉焊點的形狀變更爲例如圓錐 狀，以直接用拉烊點定位，而不用另做定位孔；幷直接用拉 焊點做焊錫，而不用額外加焊錫。 請參照第1A圖和帛⑺圖，帛1A圖為本發明之實施例 之第一電路板的俯視示意圖；第1B圖為繪示由第ia圖之 切線Α·Α’觀之的剖面示意圖。本實施例之第一電路板丨〇且 有至少一個貫穿孔（焊接孔）12’貫穿孔12的周圍設置有焊 墊（未繪示），以利後續之焊接製程的進行。 請參照帛1Α圖、帛2Α圖和第2Β圖，第2Α圖為本發 1362238 2 =例之第二電路板的俯視示意圖；第⑼圖為繞示本 發月之實施例之第二電路板的側視示意 9n , 忍圖。在第二電路板 〇上，設置有至少一個焊接凸塊22,痒 分別對應於第一電路板〗。的貫穿孔二=22的位置係 暂& ^ π ^ 牙札12。焊接凸塊22係實 ^例如：圓錐體’而焊接凸塊22與第二電路板2〇的連接 積則小於或等於貫穿孔12的面積，以利焊接凸塊Μ 刀別穿過貫穿孔1 2 〇 請參照第3Α圖和第3Β圖’第3α圖為本發明之實施例 之第一電路板與第二電路板焊接前的剖面示意圖；第⑼圖 為繪不本發明之實施例之第—電路板與第二電路板焊接後 的剖面示意圖，其中笫―領 已国，、Υ弟電路板可為例如次軟性電路 板’即面板之軟性電路板；第二電路板2G可為例如主軟性 電路板’即發光二極體之軟性電路板。如第3A圖所示，在 焊接凸塊22分別穿過貫穿孔12後，焊接凸塊22的高度Η 係大：第-電路板的厚度H1。換言之，焊接凸塊22的高度 Η係高於第一電路板1〇的上表面14。如第36圖所示在 進行焊接製程（例如：拉焊製程）後，第二電路板2〇之焊接 凸塊22被熔化後完全蓋住第—電路板1〇之貫穿孔12，並 覆蓋第一電路板10之部分的上表面14，因而將第一電路板 10和第一電路板20焊接在一起。進行焊接製程時焊接凸 塊22產生形變，並溢流蓋覆於貫穿孔12之外緣，使得焊接 凸塊22之頂面積Α2大於第一電路板1〇之貫穿孔12的面 積，其中焊接凸塊22更具有一個固定環緣24，固定環緣24 係蓋覆於貫穿孔12之表面周緣，即焊接凸塊22形變為由圓 柱體23與固定環緣24所組成之一鉚釘態樣。由於焊接凸塊 1362238 22的高度Η係高於第一電路板1〇的上表面i4，即焊接凸 塊22有足夠的份量可完全封住貫穿子⑺，故在進行焊接製 程時’不用額外加焊錫。而且，烊接凸塊22突出第—電路 板1〇的上表面14可使焊接凸塊22精確地對準貫穿孔12, 故在進行焊接製程時’不用另做定位孔來對準焊接 和貫穿孔12。 以下說明本實施例的設計原則。 請參照帛4A圖和帛4B圖，帛4A圖為說明本發明之 施例之焊接凸塊之最小高度的剖面示意圖丨第4B圖為說明 本發明之實_之焊接㈣之最大高度㈣面示意圖。 如第4A圖所不，焊接後露出第一電路板10之焊接凸 =2的形狀爲近似圓柱，並且焊接凸塊22熔化後剛好蓋住 谭接之貫穿孔（焊接孔）12。由於焊接前和谭接後 焊接凸塊22㈣積在理論上應不會變化，故焊接凸塊η 之最小高度Η滿足如下關係式： 由 可得到 1/3 π R2H= π R2x ( Η1+Η2 ) (ι) Η = 3χΗ1+3χΗ2 ⑺ 後之焊接 二Γ ^1,為第—電路板1G之厚度，Η2為進行焊接製程 22高出第一電路板1〇之上表面14的高度差。 塊22 圖所示，嬋接後露出第—電路板1G之焊接凸 路板1〇形狀爲近似圓柱’並且焊接凸塊22熔化蓋住第-電 溢出超過2穿孔（焊接孔）12後n部分焊接凸塊22V, but the welding structure and method of the electric shovel, especially related to a circuit that can be self-aligned without additional soldering = structure and method. & [Prior Art] In most of the current motherboard products, most of them are soldered to a main flexible circuit board (Main FPC) and a sub-soft circuit (Sub FPC), in which the height of the solder joint It is about 公2 mm. When performing the welding, the operator must position the main flexible circuit board and the sub-soft circuit board through the positioning holes beside the solder joints, and then use the soldering method to manually pull the welding. The lack of such a soldering method is likely to cause void welds, solder joint offsets, and excessive or too little deviation in the amount of solder applied. This increases the risk of short circuits or open circuits on the board. SUMMARY OF THE INVENTION Accordingly, one aspect of the present invention is to provide a soldering structure and method for a circuit board that overcomes the shortcomings of the prior art. According to the embodiment of the present invention, the circuit board (4) of the present invention is connected to the structural package 3, the second circuit board and a second circuit board and at least one itching bump. The first circuit board has at least one through hole, and the fused bumps are disposed on the second circuit board and respectively pass through the through holes respectively, wherein the height of each of the itch joints is the same as the first circuit board The upper surface bump is substantially, for example, rounded and the joint area of the solder bump and the second circuit board is less than or equal to the area of the through hole 238. According to an embodiment of the present invention, in the tandem method of the circuit board of the present invention, the first circuit board and the second circuit board are first provided. Then, the first circuit board has at least one through hole, and the second circuit board is disposed with at least one solder bump corresponding to at least one through hole of the first circuit board, and each soldering is performed. The height of the bump is greater than the thickness of the first circuit board, and then the solder bumps are respectively passed through the through holes to the teeth avoiding bud holes. Then, the solder bumps are used and the soldering process is not additionally used to directly perform the soldering process. The solder bumps are deformed to cover the outer edge of the through hole, thereby soldering the first circuit board and the second circuit board together. By applying the above-mentioned soldering structure and method of the circuit board, the pull (4) can be directly used for positioning and soldering', so that no additional positioning holes and additional soldering are required, so that the risk of short circuit or open circuit of the circuit on the circuit board can be reduced. [Embodiment] The present invention mainly aims to increase the height of a solder joint (welding bump) on a conventional main flexible circuit board; and to change the shape of the solder joint to, for example, a conical shape, to directly position it with a pull point. Instead of using another positioning hole; 幷 directly use the solder joint to make solder without additional solder. Referring to Figures 1A and (7), FIG. 1A is a top plan view of a first circuit board according to an embodiment of the present invention; and FIG. 1B is a cross-sectional view showing a tangent line 第·Α' of the ia diagram. In the first circuit board of the embodiment, at least one through hole (welding hole) 12' is provided around the hole 12 with a pad (not shown) for subsequent soldering process. Please refer to the 帛1Α diagram, 帛2Α diagram and the second diagram. The second diagram is a top view of the second board of the example 1362238 2 = example; the (9) diagram is the second board of the embodiment of the present month. The side view shows 9n, forbearance. On the second circuit board, at least one solder bump 22 is provided, the itch corresponding to the first circuit board, respectively. The position of the through hole 2 = 22 is temporarily & ^ π ^ teeth 12 . The solder bump 22 is solid, for example, a cone ', and the joint product of the solder bump 22 and the second circuit board 2 is less than or equal to the area of the through hole 12, so that the solder bump is passed through the through hole 1 2, please refer to FIG. 3 and FIG. 3'. FIG. 3A is a schematic cross-sectional view of the first circuit board and the second circuit board before welding according to the embodiment of the present invention; FIG. 9 is a diagram showing an embodiment of the present invention. - a schematic cross-sectional view of the circuit board and the second circuit board after soldering, wherein the circuit board can be, for example, a sub-flexible circuit board, that is, a flexible circuit board of the panel; the second circuit board 2G can be, for example, a main The flexible circuit board is the flexible circuit board of the light-emitting diode. As shown in Fig. 3A, after the solder bumps 22 respectively pass through the through holes 12, the height of the solder bumps 22 is large: the thickness H1 of the first board. In other words, the height of the solder bumps 22 is higher than the upper surface 14 of the first circuit board 1''. After the soldering process (for example, the soldering process) is performed as shown in FIG. 36, the solder bumps 22 of the second circuit board 2 are melted to completely cover the through holes 12 of the first circuit board 1 and cover the first The upper surface 14 of a portion of the circuit board 10 thus welds the first circuit board 10 and the first circuit board 20 together. When the soldering process is performed, the solder bumps 22 are deformed, and the overflow cover covers the outer edge of the through hole 12, so that the top area Α2 of the solder bumps 22 is larger than the area of the through holes 12 of the first circuit board 1〇, wherein the solder bumps The block 22 further has a fixing rim 24 which covers the periphery of the surface of the through hole 12, that is, the welding projection 22 is formed into a rivet shape composed of the cylindrical body 23 and the fixing rim 24. Since the height of the solder bump 1362238 22 is higher than the upper surface i4 of the first circuit board 1 ,, that is, the solder bump 22 has a sufficient amount to completely seal the through-hole (7), so when the soldering process is performed, no additional Solder. Moreover, the splicing bumps 22 projecting from the upper surface 14 of the first circuit board 1 可使 can precisely align the solder bumps 22 with the through holes 12, so that during the soldering process, no additional positioning holes are used to align the soldering and the through holes. Hole 12. The design principles of this embodiment will be described below. Please refer to FIG. 4A and FIG. 4B, FIG. 4A is a schematic cross-sectional view showing the minimum height of the solder bump of the embodiment of the present invention, and FIG. 4B is a schematic view showing the maximum height (four) plane of the welding (four) of the present invention. . As shown in Fig. 4A, the shape of the solder bump = 2 which exposes the first circuit board 10 after soldering is approximately cylindrical, and the solder bump 22 is just covered to cover the through hole (weld hole) 12 of the tan. Since the welding bump 22 (four) product before welding and after the tan connection should not theoretically change, the minimum height Η of the welding bump η satisfies the following relationship: 1/3 π R2H = π R2x ( Η 1 + Η 2 ) (ι) Η = 3χΗ1+3χΗ2 (7) The solder joint Γ ^1 is the thickness of the first circuit board 1G, and Η2 is the height difference between the soldering process 22 and the upper surface 14 of the first circuit board 1 . As shown in the block 22, after the splicing, the welded slab 1B of the first circuit board 1G is shaped like an approximately cylindrical 'and the solder bump 22 is melted to cover the first-electrical overflow more than 2 perforations (welding holes) 12 after the n-part Welding bump 22
t過貫穿孔1 2。由於捏姐s. LB 1A 由於焊接則和焊接後烊接凸塊22的體 1362238 積在理論上應不會變化，故焊接凸塊22之最大高声 如下關係式： 又 义 由 1/3 7Γ R2H= π R2H1+ ^ (R+r)2H2 可得到 H = [3xR2xHl+3x(R+r)2XH2] + R: (3) (4) ，其中HI為第-電路板1〇之厚度，H2為進行焊接 後之焊接凸塊22高出第—電路板1〇之上表面丨4的高度 差’R為貫穿孔12的半徑，Γ為進行焊接製程後之焊接凸 12覆蓋上表面14所形成之環繞貫穿孔12的寬度。 以下综合說明本發明之電路板的焊接方法。 請參照第3Α圖13Β圖和第5圖，第5圖為本發明 :實施例之電路板的焊接方法的流程示意圖。首先，進行步 驟1〇0’以提供第—電路板1G和第二電路板I接著，進 :步驟uo,以使第—電路板1G具有至少—個貫穿孔η。 ’進行步驟120,以於第二電路板2〇上設置至少一個 凸塊22對應至第一電路板1〇之貫穿孔。的位置其 每個.焊接凸塊的高度於第—電路板W的厚度 Μ接著’進行步驟13G’以分別將焊接凸塊22對應地穿 :孔12 ’其中如第3A圖所示此時之焊接凸塊實 —圓錐體。㈣，進行步驟14G，以使用焊接凸塊22 額外使用焊錫，來直接進行_焊接製I在進行焊接製 ’焊接凸塊22會產生形變並溢流蓋覆於貫穿孔12之外 —叙而由如第3B圖所示之圓錐體形變成如第3B圖所示之 丁〜、樣，其申此鉚釘態樣為包含有圓柱體與環繞圓 杈體23之固定環24,固定環緣24係緊黏於第一電路板ι〇 之貫穿孔12的表面周緣，因而可將第一電路 〇盥 路板20焊合在一起。 /、弟一電 综上所述，本實施例可直接用拉焊點做為定位與焊錫之 用，而不用另做定位孔與额外加焊錫，故可減少電路板上之 殘路產生短路或斷路的風險。 雖然本發明已以較佳實施例揭露如上，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神和範 圍内，當可作各種之更動與潤飾，因此本發明之保護範圍當 視後附之申請專利範圍所界定者為準。 田 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例能 更明顯易懂，所附圓式之詳細說明如下： 圖。第1A圓為本發明之實施例之第一電路板的俯視示意 圖。第圖為繪示由第1A圖之切線Α·Α，觀之的剖面示意 圖。第2Α圖為本發明之實施例之第二電路板的俯視示意 第2Β圖為繪示本發明之實施例之第二電路板的側視示 第3Α圖為本發明之實施例之第一電路板與第二電路 斗接剛的剖面示意圖。 第3 Β痛1 ' _為繪示本發明之實施例之第一電路板與第二電 . 路极埤接後的剖面示意圖。 第4A圖為說明本發明之實施例之焊接凸塊之最小高度 . 的剖面示意圖。 第4B圖為說明本發明之實施例之焊接凸塊之最大高度 的剖面示意圖。 第5圖為本發明之實施例之電路板的焊接方法的流程 示意圖。 % 【主要元件符號說明】 10 第一電路板 12 貫穿孔 14 上表面 20第二電路板 22 焊接凸塊 23 圓柱體 24 固定環緣 % 100提供第一電路板和第二電路板 110第一電路板具有貫穿孔 120第二電路板上設置焊接凸塊對應至貫穿孔的位置 130分別將焊接凸塊對應地穿過貫穿孔 140使用焊接凸塊且不額外使用焊錫進行焊接製程，以 使焊接凸塊產生形變並溢流蓋覆於貫穿孔之外緣 A1連接面積 A2頂面積 Η 尚度 1362238 HI厚度 H2 高度 R 半徑 r 寬度t through the through hole 1 2 . Since the pinch sister s. LB 1A should not change in theory due to welding and the body 1362238 of the spliced bump 22 after welding, the maximum height of the solder bump 22 is as follows: R2H= π R2H1+ ^ (R+r)2H2 can be obtained as H = [3xR2xHl+3x(R+r)2XH2] + R: (3) (4) , where HI is the thickness of the first board, and H2 is The height difference 'R of the solder bump 22 after soldering is higher than the upper surface 丨4 of the first circuit board 1' is the radius of the through hole 12, and the solder bump 12 covers the upper surface 14 after the soldering process. Surrounds the width of the through hole 12. The welding method of the circuit board of the present invention will be collectively described below. Please refer to FIG. 13 and FIG. 5, and FIG. 5 is a schematic flow chart of a soldering method of a circuit board according to an embodiment of the present invention. First, the step 1 〇 0' is performed to provide the first circuit board 1G and the second circuit board I. Next, the step uo is performed so that the first circuit board 1G has at least one through hole η. Step 120 is performed to provide at least one bump 22 on the second circuit board 2 to correspond to the through hole of the first circuit board 1 . The position of each of the solder bumps is greater than the thickness of the first circuit board W. Then, the step 13G is performed to respectively pass the solder bumps 22 correspondingly: the holes 12', as shown in FIG. 3A. Welding bumps - cones. (4) Step 14G is performed to additionally use the solder bumps 22 to directly use the solder to perform the soldering process. The solder bumps 22 are deformed and the overflow covers the through holes 12. The conical shape shown in FIG. 3B is changed to the shape shown in FIG. 3B, and the rivet aspect is a fixing ring 24 including a cylinder and a surrounding circular body 23, and the fixing rim 24 is fastened. The first circuit board 20 is welded to the periphery of the surface of the through hole 12 of the first circuit board. In the above embodiment, the soldering joint can be directly used for positioning and soldering, instead of using another positioning hole and additional soldering, thereby reducing the short circuit of the residual circuit on the circuit board or The risk of breaking the road. While the present invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The 1A circle is a top plan view of the first circuit board of the embodiment of the present invention. The figure is a schematic cross-sectional view showing the tangent 第·Α of Fig. 1A. 2 is a top plan view of a second circuit board according to an embodiment of the present invention. FIG. 2 is a side view showing a second circuit board according to an embodiment of the present invention. FIG. A schematic cross-sectional view of the board and the second circuit. The third pain 1'_ is a schematic cross-sectional view showing the first circuit board and the second electric circuit of the embodiment of the present invention. Fig. 4A is a schematic cross-sectional view showing the minimum height of the solder bump of the embodiment of the present invention. Fig. 4B is a schematic cross-sectional view showing the maximum height of the solder bumps of the embodiment of the present invention. Fig. 5 is a flow chart showing a method of soldering a circuit board according to an embodiment of the present invention. % [Main component symbol description] 10 First circuit board 12 Through hole 14 Upper surface 20 Second circuit board 22 Solder bump 23 Cylindrical body 24 Fixed ring edge % 100 provides first circuit board and second circuit board 110 first circuit The board has a through hole 120. The soldering bump is disposed on the second circuit board. The position corresponding to the through hole is 130. The solder bump is correspondingly passed through the through hole 140, and the soldering process is performed without using additional solder to make the solder bump. The block is deformed and overflows over the outer edge of the through hole A1 connection area A2 top area 尚 degree 1362238 HI thickness H2 height R radius r width