TWI499893B - Display module and display device containing the same - Google Patents

Description

Display module and display device therewith

The present invention relates to a display module and a display device therewith, and more particularly to a display module in which a display panel is fixed to a back frame by solder and a display device including the same.

The liquid crystal display device or the organic light emitting diode display device is a flat thin display device. Because of its advantages of thin shape, light weight and low power consumption, it has replaced the conventional cathode ray tube display in recent years. One of the most popular display devices.

The display module includes a metal back frame, a display panel, and a printed circuit board (PCB), wherein the display panel and the printed circuit board are respectively assembled on the metal. On the back frame, they are electrically connected to each other by a flexible circuit board (FPC).

In the conventional display module, the printed circuit board is often fixed on the metal back frame with a screw to prevent the displacement of the printed circuit board from causing damage to the flexible circuit board. However, although the type of the display device or the metal back frame is changed, the screws of the printed circuit board and the metal back frame are also changed. Therefore, at this stage, the steps of aligning and locking the screws with the printed circuit board openings are often required to be produced manually. If it is automated, However, it will face the disadvantages of various types of screws, such as failure of locking or scratching of panel glass, high complexity of design of automatic appliances, cost increase, and inability to respond to various types of aircraft.

Therefore, there is an urgent need to develop a new display module that does not require the use of a screw lock to make it easier to achieve automated production.

The main object of the present invention is to provide a display module and a display device including the same, wherein the circuit board electrically connected to the display panel is fixed to the back frame through a non-transmissive screw but through solder, thereby achieving low cost and automatic production. And the effect of yield improvement.

In order to achieve the above object, the display module of the present invention comprises: a back frame comprising a plurality of fixing members; a display panel disposed on the back frame; a circuit board disposed on the back frame and having a plurality of openings The openings are respectively corresponding to the fixing members; a connecting plate electrically connecting the display panel and the circuit board; and a plurality of solders respectively disposed in the openings of the circuit board and covered The fixing member, wherein the interface between the back frame and the circuit board serves as a reference surface, and the projections formed on the reference surface have a projection area greater than 0 and smaller than a surface area of the fixing member.

Compared with the display module in which the circuit board is fixed to the back frame by screws, the display module of the present invention fixes the circuit board to the back frame through solder, in addition to reducing the damage of the display panel caused by the screw locking. In addition, automation can be used to fix the circuit board to the back frame, which can reduce the manufacturing cost of the display module. In addition, in order to increase the fixing force between the solder and the back frame, the solder is prevented from being peeled off from the back frame, and the circuit board is fixed. The display module of the present invention further forms a fixing member on the back frame, and the fixing member forms a projection surface on one surface of the back frame, thereby providing a tensile force by the fixing member. It prevents the solder from peeling off from the back frame. At the same time, since the solder (usually solder) itself is a good conductive material, the grounding function can be achieved through the solder, and the conductivity after the fixing can be even lower than 0.2 Ohm.

In the display module of the present invention, the back frame can selectively have a plurality of punches. In the case where the back frame has a punched hole, the punching holes preferably correspond to a fixing member, respectively. When the back frame of the present invention forms the fixing member and the punching hole by punching, the shape of the punching hole corresponds to the shape of the fixing member, that is, the shape of the punching hole corresponds to the shape of the fixing member, and the fixing member can be regarded as a A sheet unit integrally formed with the back frame.

In the display module of the present invention, each of the openings of the circuit board is respectively provided with an electrical connection pad, and each solder system covers part or all of the electrical connection pads.

In addition, in the display module of the present invention, the material of the back frame may be a material commonly used in the technical field, and is preferably metal, such as an aluminum plated steel plate, a galvanized steel plate, or a stainless steel plate; It is a galvanized steel plate. Meanwhile, the display panel in the display module of the present invention may be a display panel known in the art, such as a liquid crystal display panel or an organic light emitting diode display panel.

In addition, the present invention further provides a display device including the foregoing display module, comprising: the foregoing display module; a driving unit electrically connected to the display module to provide driving information; and an appearance unit covering the Display module and the drive unit. When the display panel of the display module is a liquid crystal display panel, the display device of the present invention further includes a backlight module known in the art.

1‧‧‧ Back frame

11‧‧‧punching

111‧‧‧ surface

12‧‧‧Fixed parts

121‧‧‧ first end

122‧‧‧ second end

2‧‧‧ boards

21‧‧‧Electrical connection pads

22‧‧‧Opening

3‧‧‧Connecting board

4‧‧‧ display panel

5‧‧‧ solder

7‧‧‧Display device

A‧‧‧ angle

D‧‧‧projection surface

1 is a schematic view of a display module according to Embodiment 1 of the present invention before filling a solder.

2 is a partially exploded view of the display module of Embodiment 1 of the present invention before being filled with solder.

Fig. 3A is a cross-sectional view showing the I-I' direction of the display module of the first embodiment of the present invention before filling the solder.

Fig. 3B is a cross-sectional view showing the II-II' direction of the display module of the first embodiment of the present invention before filling the solder.

Fig. 4A is a cross-sectional view showing the I-I' direction of the display module of the first embodiment of the present invention after filling the solder.

Fig. 4B is a cross-sectional view showing the II-II' direction of the display module of the first embodiment of the present invention after filling the solder.

FIG. 5 is a partial schematic view showing the display module of Embodiment 1 of the present invention after being filled with solder.

Fig. 6A is a cross-sectional view showing the II-II' direction of the display module of the second embodiment of the present invention before filling the solder.

Fig. 6B is a cross-sectional view showing the II-II' direction of the display module of the third embodiment of the present invention before filling the solder.

Figure 7 is a schematic view showing a display device of Embodiment 4 of the present invention.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. The present invention may be embodied or applied in various other specific embodiments. The details of the present invention can be variously modified and changed without departing from the spirit and scope of the invention.

Example 1

1 and 2 are respectively a schematic view and a partially exploded view of the display module of the present embodiment before being filled with solder.

First, as shown in FIG. 1, the display module of the present embodiment includes a back frame 1; a circuit board 2 is disposed on the back frame 1; and a display panel 4 is disposed on the back frame 1. In addition, a connecting board 3 is further disposed between the circuit board 2 and the display panel 4 of the display module of the present embodiment for electrical connection. In this embodiment, the material of the back frame 1 may be an aluminum plated steel plate, a galvanized steel plate, or a stainless steel plate; and preferably a galvanized steel plate. In this embodiment, the circuit board 2 may be a printed circuit board (PCB), and the connecting board 3 may be a flexible printed circuit board (FPC). Herein, the display panel 4 is known in the art, so the detailed component structure will not be described here; and the display panel 4 may be packaged in a tape carrier package (TCP, Tape Carrier Package), a film. A chip on film (COF) or a chip on glass (COG) can be disposed on the back frame 1 by a method known in the art, and thus will not be described herein.

Next, the detailed structure in which the circuit board 2 of the present embodiment is assembled to the back frame 1 will be described. Referring to FIG. 1 and FIG. 2 , the back frame 1 of the embodiment includes a plurality of fixing members 12 , and the circuit board 2 has a plurality of openings 22 , and the openings 22 are disposed on opposite sides of the circuit board 2 .

3A and 3B are schematic cross-sectional views showing the I-I' direction and the II-II' direction before the soldering of the display module of the present embodiment. As shown in FIG. 2, FIG. 3A and FIG. 3B, the openings 22 of the circuit board 2 are respectively corresponding to the fixing members 12 so that the fixing members 12 are disposed in the openings 22. In addition, as shown in FIG. 3B, one surface 111 of the back frame 1 is used as a reference surface, and the reference surface may be the interface between the back frame 1 and the circuit board 2. The fixing member 12 forms a projection surface D on the reference surface. The area of the projection surface D is greater than 0 and smaller than the surface area of the fixture 12. Moreover, in the present embodiment, the angle A between the fixing member 12 and one surface 111 of the back frame 1 is about 30°; however, in other embodiments, the angle A is not limited to 30°, as long as the fixing member 12 is A reference surface D (area greater than 0) may be formed on the reference surface; for example, the angle A may be between more than 0° and less than 90° (0°<A<90°), preferably between 10° and 70°. Between, and more preferably between 20 ° and 60 °. In this embodiment, a fixing member 12 is formed on the back frame 1, and the fixing member 12 is formed on the surface 11 (ie, the reference surface) of the back frame 1 to form a projection surface D. A tensile force is provided to prevent the subsequently formed solder from being peeled off from the back frame 1.

In addition, in the embodiment, the fixing member 12 on the back frame 1 is formed by metal stamping, so the back frame 1 of the embodiment has a punching hole 11, and the fixing member 12 is a metal piece formed by stamping. Each punching hole 11 corresponds to a fixing member 12, and the shape of the punching hole 11 is fixed to the fixing member. The shapes of 12 correspond to each other as shown in Figs. 2, 3A and 3B. Since the fixing member 12 of the present embodiment is formed by metal stamping, the manufacturing cost of the back frame 1 of the present embodiment is the same as that of the conventional metal back frame without the fixing member. In addition, in the embodiment, the shape of the fixing member 12 is a braid shape; but in other embodiments, the shape of the fixing member 12 may be other shapes, such as a rectangle, a trapezoid, a triangle, etc., as long as the fixing member 12 is in the back frame. A projection surface D may be formed on one of the surfaces 11 (as shown in Fig. 3B).

4A and 4B are schematic cross-sectional views showing the I-I' direction and the II-II' direction of the display module of the present embodiment after soldering. As shown in FIG. 4A and FIG. 4B, after the solder 5 is filled in each of the openings 22 of the circuit board 2, the fixing member 12 of the back frame 1 is covered by the solder 5, so that the circuit board 2 can be assembled on the back. The purpose of box 1. Since the solder 5 may not be easily adhered to the material of the back frame 1, the fixing member 12 may provide an additional attachment surface to increase the adhesion, and may provide an additional hook reaction force (such as a pressure plate) to block the solder 5 from falling outward. Happening. As shown in the schematic diagram of the display module of FIG. 5 after filling the solder.

With reference to FIG. 1 to FIG. 5, the present embodiment provides a display module including: a back frame 1 including a plurality of fixing members 12, wherein a surface 111 of the back frame 1 is used as a reference surface, and is fixed. Each of the components 12 forms a projection surface D on the reference surface; a display panel 4 is disposed on the back frame 1; a circuit board 2 is disposed on the back frame 1 and has a plurality of openings 22, wherein the opening 22 The two holes are respectively disposed on the opposite sides of the circuit board 2, and the openings 22 are respectively corresponding to the fixing members 12 so that the fixing members 12 are disposed in the openings 22; and the plurality of solders 5 are respectively disposed in the openings 22 of the circuit board 2 Medium and covered with the back frame 1 Fixing 12. In addition, the back frame 1 further has a punching hole 11, and the shape and position of the punching hole 11 and the fixing member 12 correspond to each other.

In addition, as shown in FIG. 2, an electrical connection pad 21 is disposed around the opening 22 of the circuit board 2. Therefore, as shown in FIGS. 4A and 4B, when the solder 5 is filled in the opening 22 of the circuit board 2 and covers the fixing member 12 of the back frame 1, the solder 5 is electrically connected to the electrical connection pad 21 and passed through the back. The fixing member 12 of the frame 1 is grounded. In addition, compared with the prior art in which the circuit board is fixed to the metal back frame by screws, the present embodiment can avoid the problem of damage of the display panel caused by the screw lock by using the solder 5. At the same time, the soldering and fixing technology of the solder 5 has the advantages of being able to automatically produce, reducing human abnormality and reducing the manufacturing cost, and can also be designed according to various types of display modules.

Furthermore, in the display module of the embodiment, the display panel 2 can be a liquid crystal display panel or an organic light emitting diode display panel.

Example 2

Fig. 6A is a schematic cross-sectional view showing the II-II' direction (refer to Fig. 1) before the display module of the present embodiment is filled with solder. In the present embodiment, the structure of the display module is the same as that of the first embodiment except that the fixing member 12 of the back frame 1 of the present embodiment is different.

In the first embodiment, the fixing member 12 of the back frame 1 is a flat metal plate (please refer to FIG. 3A); but in the embodiment, the fixing member 12 of the back frame 1 is a stepped metal plate, as shown in the figure. 6A is shown.

However, in other embodiments, the fixing member 12 of the back frame 1 may not be limited to a stepped metal plate, but may also be a corrugated metal plate or the like; The surface 111 of the back frame 1 is used as a reference surface, and the fixing member 12 forms a projection surface D on the reference surface. In addition to being defined by the projection surface, in the embodiment or other embodiments of the present invention, the angle between the line connecting the first end 121 and the second end 122 of the fixing member 12 and the surface 111 of the back frame 1 may be greater than Between 0° and less than 90° (0° < A < 90°), preferably between 10° and 70°, and more preferably between 20° and 60°.

Example 3

Fig. 6B is a schematic cross-sectional view showing the II-II' direction (refer to Fig. 1) before the display module of the present embodiment is filled with solder. In the present embodiment, the structure of the display module is the same as that of the first embodiment except that the back frame 1 of the present embodiment does not have punching holes.

Example 4

FIG. 7 is a schematic diagram of a display device according to the embodiment, which includes the display module as described in the foregoing embodiments. In addition, when the display panel in the display device of the embodiment is a liquid crystal display panel, the display device of the embodiment further includes a backlight module, a driving unit, and an appearance unit (not shown), wherein the driving unit is coupled to The display panel and the backlight module are electrically connected and provide relevant driving information. The appearance unit covers the backlight module, the display panel and the driving unit.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧ Back frame

11‧‧‧punching

12‧‧‧Fixed parts

2‧‧‧ boards

21‧‧‧Electrical connection pads

22‧‧‧Opening

4‧‧‧ display panel

Claims (10)

A display module includes: a back frame including a plurality of fixing members; a display panel disposed on the back frame; a circuit board disposed on the back frame and having a plurality of openings, wherein the openings are respectively Corresponding to the fixing members; a connecting plate electrically connecting the display panel and the circuit board; and a plurality of solders respectively disposed in the openings of the circuit board and covering the fixing members; The back frame and the interface of the circuit board serve as a reference surface, and the fixing surfaces formed by the fixing members on the reference surface are greater than 0 and smaller than the surface area of the fixing member. The display module of claim 1, wherein the back frame material is metal, the back frame further has a plurality of punching holes, and the shapes of the punching holes correspond to shapes of the fixing members. The display module of claim 1, wherein each of the openings of the circuit board is provided with an electrical connection pad, and each of the solder systems covers part or all of the electrical connection. pad. The display module of claim 1, wherein the back frame is an aluminum plated steel plate, a galvanized steel plate, or a stainless steel plate. The display module of claim 1, wherein the display panel is a liquid crystal display panel or an organic light emitting diode display panel. A display device includes: a display module, including: a back frame having a plurality of fixing members; a display panel disposed on the back frame; a circuit board disposed on the back frame and having a plurality of openings, wherein the openings respectively correspond to the fixing members a connecting board electrically connecting the display panel and the circuit board; and a plurality of solders respectively disposed in the openings of the circuit board and covering the fixing members; a driving unit electrically connected to the display module The connection is provided to provide driving information; and an appearance unit covers the display module and the driving unit; wherein the interface of the back frame and the circuit board serves as a reference surface, and the fixing members are formed on the reference surface The projected area is greater than zero and less than the surface area of the fixture. The display device of claim 6, wherein the back frame material is metal, the back frame further has a plurality of punched holes, and the shapes of the punch holes correspond to shapes of the fixing members. The display device of claim 6, wherein each of the openings of the circuit board is respectively provided with an electrical connection pad, and each of the solder systems covers part or all of the electrical connection pad. . The display device of claim 6, wherein the back frame is an aluminum plated steel plate, a galvanized steel plate, or a stainless steel plate. The display device of claim 6, wherein the display panel is a liquid crystal display panel or an organic light emitting diode display panel.