TWI361265B - - Google Patents
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- TWI361265B TWI361265B TW096106405A TW96106405A TWI361265B TW I361265 B TWI361265 B TW I361265B TW 096106405 A TW096106405 A TW 096106405A TW 96106405 A TW96106405 A TW 96106405A TW I361265 B TWI361265 B TW I361265B
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- dissipating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Description
1361265 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種散熱方法及散熱裝置。 【先前技術】 使液狀冷媒流入鄰接散熱對象物之流路，藉由散熱對 象物與冷媒間之熱交換來使散熱對象物冷卻之技術係眾所 周知。前述技術，係藉由電子設備發熱密度之飛躍性增大 及電力轉換用大型半導體之普及等，而更加被要求以來自 大面積之南熱流束來散熱。 第14圖’係先前之散熱用流路50丨中，當用在實施大 面積散熱之流路很長時等，所產生問題之說明圖。在第i 4 圖中，使俯視圖表示於圖紙左側，使俯視圖之y5〇1〜y5〇4 位置中之剖面圖，表示於y5〇1〜y5〇4位置之圖紙右侧。 散熱用流路5 01，如第14圖圖紙左側俯視圖所示，係 往y方向延伸，如箭頭A501所示，液狀冷媒礼係自端部 5 01 a k入政熱對象物（未圖示），係例如配置於散熱用流 路501之z方向負側，如第14圖圖紙右側剖面圖箭頭A5〇2 所示，正在加熱散熱用流路5〇1底面501jb。換言之，散熱 用流路501係藉由底面5〇lb來使散熱對象物散熱。 在y5〇i位置中，液狀冷媒RL係充滿散熱用流路5〇1。 在y502位置_，液狀冷媒RL中之局部係蒸發，藉由氣體 狀冷媒RG而產生氣泡。而且氣泡，係散熱用流路5〇1中產 生於正被加熱之底面側。在y5〇3位置中，氣泡係正在擴大 2197-8674-PF;Ahddub 5 1361265 且結合，底面501b側中之液狀冷媒RL係變少量。而且， 在y504位置中’於底面501b側僅存在氣體狀冷媒rG，液 狀冷媒RL係僅在底面501b相反側之上表面501c上以液膜 狀存在》1361265 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat dissipation method and a heat dissipation device. [Prior Art] A technique for cooling a heat-dissipating object by causing a liquid refrigerant to flow into a flow path adjacent to a heat-dissipating object and exchanging heat between the heat-dissipating object and the refrigerant is well known. The above-mentioned technology is more required to dissipate heat from a large-area south heat stream by the rapid increase in the heat generation density of electronic equipment and the spread of large-scale semiconductors for power conversion. Fig. 14 is an explanatory view showing a problem that occurs when the flow path for performing large-area heat dissipation is long in the heat dissipation passage 50 of the prior art. In the i-th diagram, the top view is shown on the left side of the drawing, and the cross-sectional view in the position of y5〇1~y5〇4 of the top view is shown on the right side of the drawing at the position of y5〇1~y5〇4. The cooling flow path 5 01, as shown in the left side view of the drawing of Fig. 14, extends in the y direction. As indicated by the arrow A501, the liquid refrigerant ceremony is carried out from the end 5 01 ak into the hot object (not shown). For example, it is disposed on the negative side in the z direction of the heat dissipation flow path 501, and as shown in the arrow A5〇2 in the right side sectional view of the drawing of Fig. 14, the bottom surface 501jb of the heat dissipation flow path 5〇 is being heated. In other words, the heat dissipation flow path 501 dissipates the heat radiating object by the bottom surface 5?lb. In the y5〇i position, the liquid refrigerant RL is filled with the heat dissipation flow path 5〇1. At the y502 position _, the local portion of the liquid refrigerant RL evaporates, and bubbles are generated by the gaseous refrigerant RG. Further, the bubble is generated in the heat-dissipating flow path 5〇1 on the bottom surface side to be heated. In the y5〇3 position, the bubble system is expanding 2197-8674-PF; Ahddub 5 1361265 and combined, the liquid refrigerant RL in the bottom surface 501b side becomes a small amount. Further, in the y504 position, only the gaseous refrigerant rG is present on the bottom surface 501b side, and the liquid refrigerant RL is present in the liquid film only on the upper surface 501c on the opposite side of the bottom surface 501b.
亦即’當拉長散熱用流路501時，如y 504位置中所示， 會產生所謂燒壞（burn-out)之現象，散熱對象物無法與液 狀冷媒RL充分實施熱交換’冷卻能力會明顯下降。因此， 在第14圖所示散熱用流路501中，其前提係橫跨散熱用流 路501上游侧至下游側皆能充滿液狀冷媒rl。 在專利文獻1中，係開示有在比作為散熱用流路之主 流路還要離開散熱對象物之位置處，設有沿著主流路延伸 之輔助流路，透過連通主流路與辅助流路之複數連通孔， 使液狀冷媒自輔助流路供給到主流路，藉此，能使自主流 路上游側至下游侧之液狀冷媒溫度均勻之技術。又，在專 利文獻1中，係設有用於破壞產生於主流路之氣泡的破壞 裝置，以防止燒壞現象。 【專利文獻1】日本特開2005-79337號公報 【發明内容】 【發明所欲解決的課題】 第14圖所不先前技術或專利文獻i之技術，係以將液 狀冷媒充滿流入散熱用流路（主流路）為基本，所以，會有 產生種種問題之虞。例如，散熱利用潛熱之冷媒，係僅偶 限於流入主流路之冷媒中的極少部分。因&，熱流束必須 2197-8 67 4-PF;Ahddub 6 1361265 最好，在前述散熱用流路内周面處，施加有粗面加工。 當使用本發明時，能以高熱流束自大面積散熱。 【實施方式】 第1圖係表不本發明實施形態散熱裝置丨之整體構成 圖。散熱裝置1’係包括：儲液槽3,儲留液狀之冷媒RL; 幫浦5,使儲液槽3等之冷媒送出；散熱部12，藉由自繁 浦5送出之冷媒將散熱對象物H〇(第2A圖〜第沉圖）加以 散熱；冷凝部14,使自散熱部12流出之氣體狀冷媒冷凝； 氣液刀相H 19’使自冷凝部14流出之冷媒分離成氣體狀 冷媒及液狀冷媒；以及過冷卻部21，為了防止幫浦5之氣 钮’使自氣液分相器19流出之冷媒過冷卻。藉由過冷卻部 21而被過冷卻之冷媒，係藉由幫浦5送出，或者，儲留在 儲液槽3。 儲液槽3,例如係以蓄液器來構成，使散熱裝置i之 循環系統壓力保持在既定壓力，同時，也使用於對應負荷 變動之流體溫度微調。幫浦5’係以馬達6來驅動，馬達6 之動作係以控制器7來控制。冷凝部14，係例如空冷式， 與冷媒實施熱交換之空氣仙風扇15送人。風扇π係以 馬達16來驅動，馬達16之動作係以控制器17來控制。過 冷卻部21，係例如空冷式，與冷媒實施熱交換之空氣係以 風扇22送入。風扇22係以馬達23來驅動馬㈣之動 作係以控制器24來控制。 在幫浦5與散熱部12之間，設有：流量偵知器9,將 2197-8674-PF;Ahddub 9 流入散熱部1 2之液狀冷媒RL之流量加以檢出；以及溫度 偵知器10，將流入散熱部丨2之液狀冷媒RL之溫度加以檢 出。控制器7係依據流量偵知器9之檢出結果來控制馬達 16之動作，控制器7係依據溫度偵知器1〇之檢出結果來 控制馬達16之動作’控制器7係依據溫度偵知器1〇之檢 出結果來控制馬達23之動作。That is, when the heat dissipation flow path 501 is elongated, as shown in the position of y 504, a so-called burn-out phenomenon occurs, and the heat-dissipating object cannot sufficiently perform heat exchange with the liquid refrigerant RL. Will drop significantly. Therefore, in the heat dissipation flow path 501 shown in Fig. 14, the liquid refrigerant rl can be filled across the upstream side to the downstream side of the heat dissipation flow path 501. Patent Document 1 discloses that an auxiliary flow path extending along the main flow path is provided at a position away from the main flow path of the heat dissipation flow path, and is transmitted through the communication main flow path and the auxiliary flow path. The plurality of communication holes are provided so that the liquid refrigerant is supplied from the auxiliary flow path to the main flow path, whereby the temperature of the liquid refrigerant from the upstream side to the downstream side of the main flow path can be made uniform. Further, in Patent Document 1, a breaking device for destroying bubbles generated in the main flow path is provided to prevent burnout. [Patent Document 1] JP-A-2005-79337 SUMMARY OF INVENTION [Problems to be Solved by the Invention] The technique of the prior art or the patent document i of Fig. 14 is to fill the liquid refrigerant into the heat dissipation flow. The road (mainstream road) is basic, so there will be problems with various problems. For example, the refrigerant that uses heat to dissipate latent heat is only limited to a very small portion of the refrigerant flowing into the main flow path. Since &, the heat flux must be 2197-8 67 4-PF; Ahddub 6 1361265 Preferably, rough surface processing is applied to the inner circumferential surface of the heat dissipation flow path. When the present invention is used, heat can be dissipated from a large area with a high heat flux. [Embodiment] Fig. 1 is a view showing an overall configuration of a heat sink device according to an embodiment of the present invention. The heat dissipating device 1' includes: a liquid storage tank 3 for storing a liquid refrigerant RL; a pump 5 for sending a refrigerant such as the liquid storage tank 3; and a heat dissipating portion 12 for dissipating heat by the refrigerant sent from the pulverizer 5 The material H〇 (Fig. 2A to the sinker) is cooled; the condensing portion 14 condenses the gaseous refrigerant flowing out from the heat radiating portion 12; the gas liquid knife phase H 19' separates the refrigerant flowing out of the condensing portion 14 into a gas state The refrigerant and the liquid refrigerant; and the supercooling unit 21 supercool the refrigerant flowing out of the gas-liquid phase separator 19 in order to prevent the air button of the pump 5. The refrigerant that has been supercooled by the supercooling unit 21 is sent out by the pump 5 or stored in the liquid storage tank 3. The liquid storage tank 3 is constituted, for example, by an accumulator, and maintains the pressure of the circulation system of the heat sink i at a predetermined pressure, and also serves to finely adjust the temperature of the fluid corresponding to the load fluctuation. The pump 5' is driven by a motor 6, and the operation of the motor 6 is controlled by a controller 7. The condensing unit 14 is, for example, an air-cooled type, and the air fan 15 that exchanges heat with the refrigerant is sent. The fan π is driven by a motor 16, and the operation of the motor 16 is controlled by a controller 17. The supercooling unit 21 is, for example, an air-cooled type, and the air that exchanges heat with the refrigerant is fed by the fan 22. The fan 22 is driven by the motor 24 to drive the horse (4) to be controlled by the controller 24. Between the pump 5 and the heat dissipating portion 12, a flow detector 9 is provided to detect the flow of the 2197-8674-PF; the Ahddub 9 flowing into the liquid refrigerant RL of the heat dissipating portion 12; and the temperature detector 10. The temperature of the liquid refrigerant RL flowing into the heat radiating portion 丨2 is detected. The controller 7 controls the action of the motor 16 according to the detection result of the flow detector 9, and the controller 7 controls the action of the motor 16 according to the detection result of the temperature detector 1'. The controller 7 is based on the temperature detection. The detection result of the device 1 is used to control the action of the motor 23.
在散熱部12中’以冷媒來吸收來自散熱對象物H0之 熱而實施散熱，在冷凝部14及過冷卻部21中，以冷媒吸 收之熱量Q1及Q2之熱係分別被散出。而且，當自配管無 散失熱損失時，Q=Q1+Q2。In the heat radiating portion 12, heat is radiated from the heat radiating object H0 by the refrigerant, and the heats of the heats Q1 and Q2 absorbed by the refrigerant are released in the condensing portion 14 and the supercooling portion 21, respectively. Moreover, when there is no loss of heat loss from the piping, Q = Q1 + Q2.
第2A圖〜第2C圖，係表示散熱部12構成之示意圖， 第2A圖係局部透視之立體圖，第2B圖係第2A圖nb_nb 線箭視方向之剖面圖，第2C圖係在第2A圖中以實線包圍 領域E之自X方向觀得的放大剖面圖。而且，雖然為了方 便說明而有時以z方向之上下方向來表現，但是，散熱部 12’係藉由大小等種種條件，在X方向、y方向、z方向之 任意上下方向皆能發揮—定之散熱效果。 散熱部1 2係包括：散熱用流路31，鄰接散熱對象物 H0而設置；以及液體供給用流路32，供給液狀冷媒到散熱 用流路31。而且，液體供給用流路32，或者，包含加上液 體供給用流路32及幫浦5等之冷媒送出系統，係本發明液 體供給部之一例。 散熱用流路31，係例如藉由抵接散熱對象物H0而設 置的第1板狀部34、相向第1板狀部34配置之第2板狀 10 2197-867 4-PF;Ahddub 1361265 部35、及配置於第1板狀部34與第2板狀部35之間，與 散熱用流路31流路方向（冷媒流動、流路縱向、y方向）相 互平行延伸之2支管體36所構成，形成被這些構件包圍之 領域。而且，不僅是第1板狀部34側，第2板狀部35側 也可配置散熱對象物《又，也可以矩形風管等適當剖面形 狀之中空體來取代管體36。散熱用流路31中，流路方向 一端（y方向之向正侧）係有開口，連接到冷凝部14。流路 方向另一端係以未圖示之壁部來阻塞。2A to 2C are schematic views showing the structure of the heat dissipating portion 12, Fig. 2A is a perspective view of a partial perspective view, Fig. 2B is a cross-sectional view of the nb_nb line in the 2A view, and Fig. 2C is at 2A An enlarged cross-sectional view of the field E viewed from the X direction surrounded by a solid line. Further, although it may be expressed in the z-direction in the up-down direction for convenience of explanation, the heat-dissipating portion 12' can be used in any of the X-direction, the y-direction, and the z-direction in any vertical direction by various conditions such as size. heat radiation. The heat radiating portion 12 includes a heat radiating flow path 31 provided adjacent to the heat radiating object H0, and a liquid supply flow path 32 for supplying the liquid refrigerant to the heat radiating flow path 31. Further, the liquid supply flow path 32 or the refrigerant supply system including the liquid supply flow path 32 and the pump 5 is an example of the liquid supply unit of the present invention. The heat dissipation flow path 31 is, for example, a first plate-like portion 34 that is provided by abutting against the heat-dissipating object H0, and a second plate-like shape that is disposed to the first plate-shaped portion 34, and the second plate-shaped 10 2197-867 4-PF; Ahddub 1361265 35. The two tubular bodies 36 disposed between the first plate-shaped portion 34 and the second plate-like portion 35 and extending in parallel with the flow path of the heat-dissipating flow path 31 (refrigerant flow, flow path longitudinal direction, and y direction) Constructed to form a field surrounded by these members. Further, not only the first plate-like portion 34 side but also the heat-dissipating object may be disposed on the second plate-like portion 35 side. Alternatively, the tubular body 36 may be replaced by a hollow body having a suitable cross-sectional shape such as a rectangular duct. In the heat dissipation flow path 31, one end (the positive side in the y direction) of the flow path direction is opened, and is connected to the condensation portion 14. The other end of the flow path is blocked by a wall portion (not shown).
第1板狀部34、第2板狀部35及管體36，係可以金 屬或樹脂等適當材料來形成。第1板狀部34及第2板狀部 35與管體36’可以接著劑或鱲銲來接合，或者，使用熔接 或熔著等來接合。 液體供給用流路32，係藉由管體36，形成於管體36 内部。液體供給用流路32之位置，係自z方向觀之，可以 是重疊散熱對象物H0之位置或不重疊散熱對象物H0之位 置。管體36 —邊端部36b係成開口狀，形成流入口 37 » 端部36b係連接有幫浦5。而且，管體36另一邊端部36c 係被阻塞。又，管體36之中’分隔散熱用流路31與液體 供給用流路32之壁部36a處，在散熱用流路31流路方向 (y方向）之複數位置上，設有連通散熱用流路31與液體供 給用流路32之連通孔38。連通孔38，係本發明冷媒通過 部之一例。複數連通孔38，係例如相同直徑，又，以等間 隔設置。 在第1板狀部34,於形成散熱用流路31内周面之表 2197-8 674-PF;Ahddub 11 1361265 面’形成有在與散熱用流路31流路方向直交方向（寬度方 向、X方向）延伸之凹槽部40。凹槽部40，係在散熱用流 路31流路方向上設置複數個’例如，在與複數連通孔38 相同位置處設置與複數連通孔38相同數量者。 第3圖係說明散熱部12中之散熱方法的之示意圖。在 第3圖中，俯視圖表示於圖面左側’使俯視圖位置 中之剖面圖表示於yl~y3位置之圖面右側。 在散熱部12中，如第2A圖中箭頭A1所示，以幫浦5 送出之液狀冷媒RL係自流入口 37流入液體供給用流路 32。流入液體供給用流路32之液狀冷媒rl，如第2A圖箭 頭A2及第3圖箭.頭A5所示，係自連通孔38流入散熱用流 路31 〇 流入散熱用流路31之液狀冷媒rl，如第3圖圖面右 側剖面圖所示，係在散熱用流路31第i板狀部34側内周 面形成液膜。連通孔38係設於散熱用流路31流路方向上 之複數位置，所以，冷媒RL之液膜，係自散熱用流路Μ 上游側至下游侧橫跨流路全部。 而且，在第3圖圓面右側剖面圖中，如箭頭A6所示， 來自散熱對象物HO之熱係傳遞到第i板狀部34，冷媒虬 之液膜，係蒸發而成為氣體狀冷媒RG。換言之，冷媒係自 散熱對象物HO吸收約相當於潛熱部分之熱。 散熱用流路31氣體狀冷媒RG，如第2A圖箭頭μ所 示，係自開口端部流出而流入冷凝部14。而且，也可以使 排出氣體狀冷媒RG之風扇等排氣機構設於流路内。 2197-8674-PF; Ahddub 12 1361265 為了在散熱用流路31中形成液膜，而可如下地設定各 種參數或實施控制。 在散熱用流路31中，以下之（i)式會成立。 P 1 X dV/dt x(CPix(Ts-Tu)+h，g X …⑴ 在此， Q:每單位時間之散熱量（w)The first plate-like portion 34, the second plate-like portion 35, and the tubular body 36 may be formed of a suitable material such as metal or resin. The first plate-like portion 34 and the second plate-like portion 35 and the tubular body 36' may be joined by bonding or brazing, or may be joined by welding or welding. The liquid supply flow path 32 is formed inside the tubular body 36 by the tubular body 36. The position of the liquid supply flow path 32 is viewed from the z direction, and may be a position where the heat radiation object H0 is overlapped or a position where the heat radiation object H0 is not overlapped. The pipe body 36 has a side end portion 36b formed in an open shape to form an inflow port 37. The end portion 36b is connected to the pump 5. Moreover, the other end portion 36c of the tubular body 36 is blocked. Further, in the pipe body 36, the wall portion 36a for separating the heat dissipation flow path 31 and the liquid supply flow path 32 is provided at a plurality of positions in the flow path direction (y direction) of the heat dissipation flow path 31 for communication heat dissipation. The flow path 31 and the liquid supply flow path 32 communicate with each other. The communication hole 38 is an example of the refrigerant passage portion of the present invention. The plurality of communication holes 38 are, for example, of the same diameter, and are disposed at equal intervals. In the first plate-like portion 34, the surface 2197-8 674-PF of the inner circumferential surface of the heat dissipation flow path 31 is formed; and the Ahddub 11 1361265 surface 'is formed in the direction orthogonal to the flow direction of the heat dissipation flow path 31 (width direction, The groove portion 40 extends in the X direction. The groove portion 40 is provided in plural in the flow path direction of the heat dissipation flow path 31. For example, the same number as the plurality of communication holes 38 is provided at the same position as the plurality of communication holes 38. FIG. 3 is a schematic view showing a heat dissipation method in the heat dissipation portion 12. In Fig. 3, the top view is shown on the left side of the drawing. The cross-sectional view in the top view position is shown on the right side of the drawing at the yl~y3 position. In the heat radiating portion 12, as shown by an arrow A1 in Fig. 2A, the liquid refrigerant RL sent from the pump 5 flows into the liquid supply flow path 32 from the inflow port 37. The liquid refrigerant rl that has flowed into the liquid supply flow path 32 flows into the heat dissipation flow path 31 and flows into the heat dissipation flow path 31 from the communication hole 38 as indicated by the arrow A2 in FIG. 2A and the arrow A head in FIG. The refrigerant rl is formed on the inner peripheral surface of the i-th plate-like portion 34 side of the heat dissipation flow path 31 as shown in the right side sectional view of the third drawing. Since the communication hole 38 is provided at a plurality of positions in the flow path of the heat dissipation flow path 31, the liquid film of the refrigerant RL straddles the flow path from the upstream side to the downstream side of the heat dissipation flow path. Further, in the right side cross-sectional view of the circular surface of Fig. 3, as indicated by an arrow A6, the heat from the heat-dissipating object HO is transmitted to the i-th plate-like portion 34, and the liquid film of the refrigerant is evaporated to become a gaseous refrigerant RG. . In other words, the refrigerant absorbs heat from the heat-dissipating object HO to be equivalent to the heat of the latent heat portion. The heat-dissipating flow path 31, the gaseous refrigerant RG, flows out from the opening end and flows into the condensing portion 14 as indicated by an arrow μ in Fig. 2A. Further, an exhaust mechanism such as a fan that discharges the gaseous refrigerant RG may be provided in the flow path. 2197-8674-PF; Ahddub 12 1361265 In order to form a liquid film in the heat dissipation flow path 31, various parameters or control can be set as follows. In the heat dissipation flow path 31, the following formula (i) holds. P 1 X dV/dt x(CPix(Ts-Tu)+h,g X (1) Here, Q: heat dissipation per unit time (w)
Pi :液狀冷媒之密度（kg/m3)Pi : density of liquid refrigerant (kg/m3)
dV/dt.液狀冷媒每單位時間之往散熱用流路的供給量 (mVs)dV/dt. Supply amount of liquid cooling channel per unit time (mVs)
Cpi :液狀冷媒之定壓比熱（J/kgK)Cpi : constant pressure specific heat of liquid refrigerant (J/kgK)
Ts:散熱用流路中之冷媒飽和溫度（κ) TU:液狀冷媒往散熱用流路供給時之溫度（κ) hfg :冷媒之蒸發潛熱（j/kg)Ts: the refrigerant saturation temperature in the heat dissipation flow path (κ) TU: the temperature at which the liquid refrigerant is supplied to the heat dissipation flow path (κ) hfg : the latent heat of vaporization of the refrigerant (j/kg)
Xout :蒸發流量與散熱用流路冷媒全流量的質量比例。 藉由（1)式，能獲得（2)式。 X dV/dt)-CPix(Ts-Tin))/hfg …⑵ 因此，在散熱裝置1申，當設定各種參數使X(jut為既 定值時，能在散熱用流路31形成液膜。適合形成液膜之 X〇ut範圍一例為〇 2以上且在1以下。 Q係以在散熱對象物H0中必要之散熱量來決定。p ,、 Cm、hfg ’係能藉由冷媒構成成分之選擇或作動壓力之選擇 而調整。dV/dt、Tu、Ts，係能藉由散熱裝置i設計時之各 種機構的構造性態樣來調整，又，能藉由散熱裝置1運轉 中各種機構之動作來調整。 2197-8674-PF; Ahddub 13 1361265 散熱裝置1運轉，之Lut控制係例如如τ述般地實施。 曰dV/d 1係以流1偵知器Θ來檢出《控制器7，係依據流 曰貞知器9之檢出值’透過馬達6控制幫浦5之動作，以 /dt接近既定目標值。亦即，藉由控制器7來實施 之回饋控制，進而實施X〇ut之控制。Xout: The mass ratio of the evaporation flow rate to the total flow rate of the refrigerant for the heat dissipation. With the formula (1), the formula (2) can be obtained. X dV/dt)-CPix(Ts-Tin))/hfg (2) Therefore, in the heat sink 1, when various parameters are set such that X (jut is a predetermined value, a liquid film can be formed in the heat dissipation flow path 31. An example of the X〇ut range in which the liquid film is formed is 〇2 or more and 1 or less. The Q system is determined by the amount of heat dissipated in the heat-dissipating object H0. The selection of p, Cm, hfg ' can be selected from the components of the refrigerant. Or the selection of the operating pressure can be adjusted. dV/dt, Tu, Ts can be adjusted by the structural features of various mechanisms when the heat sink i is designed, and can be operated by various mechanisms in the operation of the heat sink 1 2197-8674-PF; Ahddub 13 1361265 The heat sink 1 is operated, and the Lut control system is implemented, for example, as described in τ. The 曰dV/d 1 system detects the controller 7 by using the stream 1 detector. According to the detected value of the flow finder 9, the action of the pump 5 is controlled by the motor 6, and /dt is close to the predetermined target value. That is, the feedback control is implemented by the controller 7, and then the X〇ut is implemented. Control.
Tin係以溫度偵知器〗〇來檢出。控制器^ 7，係依據溫 又病知器1 〇之檢出值，控制馬達J 6之動作，以使L接近 既定目標值。又，控制器24也係依據溫度備知器1〇之檢 出值’控制馬達23之動作，以使Tu接近既定目標值。亦 I5藉由控制器17及控制器24 ’ Tu被回饋控制，進而實 施Xout之控制。 而且，控制器17(冷凝部14)及控制器24(過冷卻部 21) ’係可以在Tin控制中適當分擔工作。例如，在運轉開 始時，在冷凝部14中，在實施Tin回饋㈣之同時，在過 冷卻部21中之冷卻會停止，#冷媒溫度上升到超過既定溫 度時，在冷凝部14中，使馬達16旋轉維_—定而使冷卻 效率為-定’同時，在過冷卻部21中，實施L之回饋控 制。Tin is detected by the temperature detector 〇. The controller ^7 controls the action of the motor J 6 according to the detected value of the temperature and the disease detector 1 so that L approaches the predetermined target value. Further, the controller 24 controls the operation of the motor 23 in accordance with the detected value of the temperature controller 1 so that Tu approaches a predetermined target value. Also, I5 is fed back by the controller 17 and the controller 24' Tu, thereby implementing the control of Xout. Further, the controller 17 (condensing unit 14) and the controller 24 (supercooling unit 21) can appropriately share the work in the Tin control. For example, at the start of the operation, in the condensing unit 14, while the Tin feedback (four) is being applied, the cooling in the supercooling unit 21 is stopped. When the temperature of the refrigerant rises above a predetermined temperature, the motor is made in the condensing unit 14. In the case where the cooling efficiency is set to "determined", the feedback control of L is performed in the supercooling unit 21.
Ts係以散熱用流路31中之壓力來決定。因此，L係受 風扇15, 22所致之散熱量的影響很大.但是，當藉由= 之調整而改變冷凝部14或過冷卻部21處之熱傳遞時，能 控制冷媒之膨脹率等’間接地能控制Ts。又，例如，也可 以在散熱用流路31設置壓力偵知器，同時，在往△凝部 14之流路上設置壓力調整閥，依據壓力 裔I檢出結 2197-8674-PF;Ahddub 14 1361265 果’來控制壓力調整閥之動作。 當使用以上實施形態時，供給液狀冷媒RL到鄰接散熱 對象物H0設置之散熱用流路31流路方向的複數位置處， 在散熱用流路31内周面橫跨複數位置，形成冷媒rl之液 膜，所以’在橫跨敷熱用流路31上游到下游之大範圍中， 液狀冷媒RL不會乾涸，而且，能使冷媒有效率地蒸發。因 此，與先前相比較下，相對於顯熱所致之散熱量，潛熱所 致散熱量的比例會大幅增加，能以高熱流束自大面積散 熱。冷媒流量（質量）也能降低，能使散熱裝置丨或散熱用 流路31小型化。流量也能被抑低，又，主流路以蒸汽貫穿， 藉此’壓損係比專利文獻 還要小，兩者乘積所致之幫浦 能力會大幅降低。液狀冷媒RL係藉由潛熱來散熱，所以， 與先前之以顯熱或沸騰來散熱時相比較下，熱傳遞非常 好，冷媒RL之溫度，係相對於散熱對象物H〇容許溫度（散 °因此，能降低對冷凝部The Ts is determined by the pressure in the heat dissipation flow path 31. Therefore, the L system is greatly affected by the amount of heat radiation caused by the fans 15, 22. However, when the heat transfer at the condensing portion 14 or the supercooling portion 21 is changed by the adjustment of =, the expansion ratio of the refrigerant can be controlled, and the like. 'Indirectly control Ts. Further, for example, a pressure detector may be provided in the heat dissipation flow path 31, and a pressure adjustment valve may be provided on the flow path to the Δ condensation unit 14, and the junction 2197-8674-PF may be detected according to the pressure I; Ahddub 14 1361265 'To control the action of the pressure regulating valve. When the above embodiment is used, the liquid refrigerant RL is supplied to a plurality of positions in the flow path direction of the heat dissipation flow path 31 provided adjacent to the heat radiation target H0, and the circumferential surface of the heat dissipation flow path 31 is traversed at a plurality of positions to form the refrigerant rl. Since the liquid film is in a wide range from the upstream to the downstream of the heat transfer passage 31, the liquid refrigerant RL does not dry, and the refrigerant can be efficiently evaporated. Therefore, compared with the previous one, the proportion of heat dissipation due to latent heat is greatly increased relative to the amount of heat generated by sensible heat, and heat can be dissipated from a large area with a high heat flux. The refrigerant flow rate (mass) can also be reduced, and the heat sink or the heat dissipation flow path 31 can be miniaturized. The flow rate can also be reduced. In addition, the mainstream road is run through steam, so that the pressure loss is smaller than the patent literature, and the pump capacity caused by the product of both will be greatly reduced. The liquid refrigerant RL is dissipated by latent heat. Therefore, compared with the previous heat dissipation by sensible heat or boiling, the heat transfer is very good. The temperature of the refrigerant RL is relative to the heat-dissipating object H〇. ° Therefore, it can reduce the condensation part
熱後之目標溫度）’不用低太多。E 14或過冷卻部21要求之冷卻能力， 2197-8674-PF;Ahddub 15 1361265 意圖。先前之散熱用流路5〇1中，液狀冷媒RL，係自散熱 用流路501 —端流入（箭頭7A)，往另一端流動。因此，散 熱用流路501流路方向之長度L5(n，係成為冷媒被加熱之 加熱長度。當長度L501超過一定長度時，液狀冷媒肚會 蒸發而成為氣體狀冷媒RG，自散熱用流路5〇丨下游側排出 (箭頭8A)。亦即，在，散熱用流路5〇1下游側中會產生 燒壞現象而内周面會乾涸，冷卻能力會顯著降低。 但疋，如第4B圖所示，在本實施形態之散熱用流路 31中，液狀冷媒虬係自散熱用流路31兩端往與流路方向 直交之方向供給，所以，加熱長度係成為散熱用流路31寬 度之一半長度L1。因此，當僅在流過長度u之時供給冷 媒RL不會乾涸之量時，能橫跨散熱用流路31全部地發揮 冷卻能力。換言之，散熱用流路31流路方向長度對冷媒 RL乾涸之影響會顯著減少，流路方向長度之設定自由度會 提 ifj。The target temperature after the heat is not too low. Cooling capacity required by E 14 or supercooling section 21, 2197-8674-PF; Ahddub 15 1361265 Intent. In the heat dissipation passage 5〇1, the liquid refrigerant RL flows in from the end of the heat dissipation passage 501 (arrow 7A) and flows to the other end. Therefore, the length L5 (n) of the flow path of the heat dissipation flow path 501 is the heating length at which the refrigerant is heated. When the length L501 exceeds a certain length, the liquid refrigerant belly evaporates to become a gaseous refrigerant RG, and the self-heating flow The downstream side of the road 5 is discharged (arrow 8A). That is, the burn-in phenomenon occurs on the downstream side of the heat-dissipating flow path 5〇1, and the inner peripheral surface is dried up, and the cooling capacity is remarkably lowered. As shown in FIG. 4B, in the heat dissipation flow path 31 of the present embodiment, the liquid refrigerant is supplied from both ends of the heat dissipation flow path 31 in a direction orthogonal to the flow path direction, so that the heating length is a heat dissipation flow path. One of the widths of the width 31 and the length L1. Therefore, when the supply of the refrigerant RL does not dry up when the length u flows, the cooling capacity can be fully exhibited across the heat dissipation flow path 31. In other words, the heat dissipation flow path 31 flows. The influence of the length of the road direction on the dryness of the refrigerant RL is significantly reduced, and the degree of freedom in setting the length of the flow path will be increased.
而且’如第4C圖所示，即使在本實施形態之散熱用流 路31中，散熱用流路31之寬度會變大，當相對於液狀冷 媒RL供給量而加熱長度（L2)變長時，在散熱用流路31中 央侧中，液狀冷媒RL會乾涸。因此，必須適當設定散熱用 流路31寬度與液狀冷媒rl供給量。 第5A圖〜第5D圖，係自參照第4A圖〜第4C圖說明 過之加熱長度觀點’說明往散熱用流路之液體供給方法的 變形例。而且，在第5A圖〜第5D圖中，如第5A圖之箭頭 A9所示’係例示散熱用流路自圖面上下方向兩面（相當於 17 2197-8674-PF;Ahddub 1361265 剖面形狀 變形》 供給口之位置及數量之組合 此外也可有種種 第6A圓第⑽圖’係、表示將液體供給到散熱用流路 :供給方法的變形例剖面圖。而且，在第βΑ圖〜第⑽圖 散熱對象物，係設於流路z方向正向侧及負向側中之 邊側，又，散熱用流路之流略方向係丫方向。Further, as shown in Fig. 4C, even in the heat dissipation flow path 31 of the present embodiment, the width of the heat dissipation flow path 31 is increased, and the heating length (L2) becomes longer with respect to the supply amount of the liquid refrigerant RL. At the center side of the heat dissipation flow path 31, the liquid refrigerant RL is dried. Therefore, it is necessary to appropriately set the width of the heat dissipation flow path 31 and the supply amount of the liquid refrigerant rl. 5A to 5D are views showing a modification of the liquid supply method to the heat dissipation flow path from the viewpoint of the heating length described with reference to Figs. 4A to 4C. Further, in FIGS. 5A to 5D, as shown by an arrow A9 in FIG. 5A, the flow path for heat dissipation is illustrated from both sides in the lower direction of the drawing (equivalent to 17 2197-8674-PF; Ahddub 1361265 section shape deformation) In addition to the combination of the position and the number of the supply ports, a cross-sectional view showing a modification of the supply method for supplying the liquid to the heat dissipation flow path may be provided in the sixth embodiment (10). The object to be radiated is disposed on the side of the forward side and the negative side of the flow path z direction, and the flow direction of the heat dissipation flow is in the direction of the turn.
第6A圖，係表示使壁部47設於剖面矩形之流路處， 使前述流路分割成散熱用流路45與液體供給用流路46之 變形例。在壁部4 7處，於散熱用流路4 5流路方向（y方向） 複數位置設置未圖示之連通孔’如箭頭A15所示，液狀冷 媒係自液體供給用流路46透過連通孔供給到散熱用流路 邨。而且，在此變形例中’藉由設置壁部47，能簡單地構 成散熱用流路45及液體供給用流路46。 第6B圖，係表示使喷嘴50設於散熱用流路49兩側之 變形例。喷嘴50,係設於散熱用流路49流路方向㈠方向） 複數位置。液狀冷媒，如箭頭A17所示，係藉由喷嘴5〇供 給到散熱用流路49。在此變形例中，藉由調整喷嘴5〇之 方向，能調整液體供給方向，使喷嘴5〇尖端5〇&之位置， 在與散熱用流路49流路方向直交之方向（χ方向）中調整， 藉此’能調整液體之供給位置。也可使複數噴嘴5〇之方 向、位置、流量設定成不同。因此，能很容易地對應散熱 裝置使用環境等而變更設寒。 第6C圖’係標是在矩形流路内部兩端設置管體5^， 在管體51外側形成散熱用流路52，在管體51内部形成液 2197-8674-PF;Ahddub 19 1361265 流量之流動，無法獲得充分的散 6fc …效果。但是，在本實施 形‘i中，在形成液膜時，僅需要供 八θ .^ 〇充刀罝的冷媒，所以， …須使散熱用流路一端當作液狀冷出 V媒机入口，能將散熱用 流路兩端利用做冷媒流出口。而 且藉由將兩端當作流出 口，自散熱用流路之排氣變迅速，能抑制排氣速度過度增 大0In the sixth embodiment, the wall portion 47 is provided in a flow path having a rectangular cross section, and the flow path is divided into a heat dissipation flow path 45 and a liquid supply flow path 46. In the wall portion 47, a communication hole (not shown) is provided at a plurality of positions in the flow direction (y direction) of the heat dissipation flow path 45 as indicated by an arrow A15, and the liquid refrigerant is transmitted through the liquid supply flow path 46. The hole is supplied to the flow path village for heat dissipation. Further, in this modification, the heat dissipation flow path 45 and the liquid supply flow path 46 can be easily configured by providing the wall portion 47. Fig. 6B shows a modification in which the nozzles 50 are provided on both sides of the heat dissipation flow path 49. The nozzle 50 is disposed at a plurality of positions in the direction (1) of the flow path of the heat dissipation flow path 49. The liquid refrigerant is supplied to the heat dissipation flow path 49 by the nozzle 5A as indicated by an arrow A17. In this modification, by adjusting the direction of the nozzle 5, the liquid supply direction can be adjusted so that the position of the nozzle 5 〇 tip 5 〇 & is in a direction orthogonal to the flow direction of the heat dissipation flow path 49 (χ direction) In the adjustment, the 'can adjust the supply position of the liquid. It is also possible to set the direction, position, and flow rate of the plurality of nozzles to be different. Therefore, it is possible to easily change the cold setting in accordance with the environment in which the heat sink is used. The figure 6C shows that the tube body 5^ is provided at both ends of the rectangular flow path, and the heat dissipation flow path 52 is formed outside the tube body 51, and the liquid 2197-8674-PF is formed inside the tube body 51; Ahddub 19 1361265 flow rate Flowing, unable to get a full dispersion of 6fc ... effect. However, in the present embodiment, in the case of forming a liquid film, only the refrigerant for the occlusion of the knives is required, so that one end of the heat dissipation flow path is required to be liquid-cooled out of the V medium machine inlet. The two ends of the heat dissipation flow path can be used as a refrigerant outlet. Moreover, by using both ends as the outflow port, the exhaust gas from the heat dissipation flow path becomes rapid, and the exhaust gas speed can be suppressed from being excessively increased.
又’如第7D圖所示，使液體供給用流路流入口設於適 當位置，能使液狀冷媒朝向流路方向（7方向）兩側之物件， 係藉由形成於散熱用流路上之液膜的蒸發而散熱，氣體狀 冷媒自散熱用流路排出之物件。#即’ t前係使液狀冷媒 之流動分流成主流路及辅助流路，之後，使其合流之構成， 所以’必須使主流路與辅助流路之流動在同一方向。但是， 在本實施形態中，係在散熱流路中流通氣體狀冷媒，在液 體供給用流路中流通液體狀冷媒之物件，所以，能自由設 定相互的流路方向。 因此’在本實施形態中，可有第7A圖〜第7D圖所示 之種種流動模式，能提高設計之自由度。而且，第7A圖〜 第7D圖之例示，也可以其他種種模式來流通液狀冷媒及氣 體狀冷媒。 在第7A圖〜第7D圖說明過之提高散熱用流路及液體 供給用流路得設計自由度，係可以使液體供給用流路及散 熱用流路中之流動模式做3維擴張。第8A圖〜第8F圖， 係表示使液體供給用流路及散熱用流路中之流動模式做3 維擴張之變形例。在第8A圖〜第8F圖中，實線箭頭係表 2197-8674-PF;Ahddub 23 1361265 示液狀冷媒之流路方向，虛線箭頭係表示氣體狀冷媒之流 路方向。Further, as shown in Fig. 7D, the liquid supply flow path inlet is provided at an appropriate position, and the liquid refrigerant can be formed on the flow path in the flow path direction (7 directions) by the flow path formed on the heat dissipation flow path. The liquid film evaporates and dissipates heat, and the gaseous refrigerant is discharged from the heat dissipation flow path. In the first step, the flow of the liquid refrigerant is split into the main flow path and the auxiliary flow path, and then the flow is combined. Therefore, the flow of the main flow path and the auxiliary flow path must be in the same direction. However, in the present embodiment, since the gaseous refrigerant flows through the heat dissipation passage and the liquid refrigerant flows through the liquid supply passage, the mutual flow direction can be freely set. Therefore, in the present embodiment, various flow patterns shown in Figs. 7A to 7D can be provided, and the degree of freedom in design can be improved. Further, as exemplified in Figs. 7A to 7D, the liquid refrigerant and the gas refrigerant may be distributed in other modes. In the seventh embodiment to the seventh drawing, the degree of freedom in designing the flow path for the heat dissipation and the liquid supply flow path is increased, and the flow pattern in the liquid supply flow path and the heat dissipation flow path can be three-dimensionally expanded. 8A to 8F are modifications showing a three-dimensional expansion of the flow pattern in the liquid supply flow path and the heat dissipation flow path. In Figs. 8A to 8F, the solid arrows are shown in Table 2197-8674-PF; Ahddub 23 1361265 shows the flow direction of the liquid refrigerant, and the dotted arrow indicates the flow direction of the gaseous refrigerant.
第8A圖’係加上第7D圖所示變形例，在與散熱對象 物直交之方向（z方向）中，供給冷媒之變形例的俯視圖， 第8B圖，係自第8A圖圖面下方觀得之剖面圖。在本變形 例中’在第8B圖圖面下方側設置有散熱對象物。在散熱用 流路76寬度方向中央位置處’設有沿著散熱用流路73流 路方向延伸之液體供給用流路79。液體供給用流路79，係 例如與液體供給用流路77相同形狀，但是尺寸略小，在圖 面上方側設有供給液狀冷媒之流入口 79a，同時，在圖面 下方側，用於使液狀冷媒供給到散熱用流路76之複數連通 孔（未圖示）係沿著散熱用流路76設置。前述變形例，係與 第6F圖所示變形例相同地，能有效防止散熱用流路76中 央之乾涸。 第8C圖，係使第8A圖所示液體供給用流路79複數配8A is a plan view showing a modification of the refrigerant in a direction orthogonal to the object to be radiated (z direction) in a direction orthogonal to the object to be radiated, and FIG. 8B is a view from the bottom of FIG. 8A. Get the profile. In the present modification, 'the object to be radiated is provided on the lower side of the plane of Fig. 8B. A liquid supply flow path 79 extending in the flow direction of the heat dissipation flow path 73 is provided at a central position in the width direction of the heat dissipation flow path 76. The liquid supply flow path 79 has the same shape as the liquid supply flow path 77, but is slightly smaller in size, and is provided with an inflow port 79a for supplying a liquid refrigerant on the upper side of the drawing, and is used for the lower side of the drawing. A plurality of communication holes (not shown) for supplying the liquid refrigerant to the heat dissipation flow path 76 are provided along the heat dissipation flow path 76. In the above-described modification, as in the modification shown in Fig. 6F, it is possible to effectively prevent the center of the heat dissipation flow path 76 from drying up. In Fig. 8C, the liquid supply flow path 79 shown in Fig. 8A is plurally matched.
% 列於散熱用流路81寬度方向之變形例，第8D圖係自第8C 圖圖面下方侧觀得之剖面圖。在此變形例中’與第6G圖所 示變形例相同地，其係可往散熱用流路81寬度方向擴張之 物件。而且，由第8C圖可知，本發明之散熱用流路係流路 方向也可不為縱向。 第8E圖係在散熱用流路縱向及與橫向直交之方向上 s史置排出氣體狀冷媒之排出口 83a的變形例，第卯圖係自 第8E圖圖面下方觀得之剖面圖 物係設於第8F圖圖面下方側， °在此變形例中，散丨熱對象 排出口 83a，係在散熱用流 24 2197-8674-PF;Ahddub 1361265 • 83内周面中與散熱對象物相反侧處開口。而且，散熱用 流路83’係縱向(液體供給用流路84之流動方向)兩端被 阻塞，氣體狀冷媒流出口僅有排出口 83a ^排出口 ，係 例如石著液體供給用流路84流動方向設置複數個。在此變 形例中，使蒸發之冷媒不流通在沿著散熱對象物之表面的 其他領域，而能即刻排出。而且，在第8E圖中，流路端面 可說係✓。著散熱對象物配置。換言之，本發明之散熱用流 路，係也可不為氣體狀冷媒流通在沿著散熱對象物之方向 (y方向）上之物件。自排出口 83a排出之氣體狀冷媒，係 例如流入管體或矩形風管而往冷凝部或過冷卻部流通。 第9A圖〜第9E圖，係表示分隔散熱用流路與液體供 給用流路之壁部（參照第6A圖壁部47或第6D圖壁部55等） 或連通孔之變形例的立體圖。 在第9A圖變形例_，在平板狀壁部85形成有複數連 通孔86 »例如，藉由打孔加工在金屬板或樹脂板上形成。 % 在此變形例中，能簡單地形成具有連通孔之壁部，又，連 通孔係能很容易做位置（例如複數連通孔之間隔）、大小或 形狀之設計變更》 在第9B圖變形例中’係以多孔質體來形成壁部88。 多孔質體係例如燒結金屬。多孔質體之過濾直徑，雖然可 因為往散熱用流路之供給量而適當設定，但是，例如可為 〜200/z。而且，在先前之使液狀冷媒流通在散熱用流 路之技術中，即使以多孔質體來分割主流路及辅助流路， 也無法自輔助流路供給充分量的液狀冷媒往主流路。而 2197->8674-PF;Ahddub 25 ·' 變之壓力差ΛΡ，當想定並行流路時，在散熱用流路上游 L ’、’在下游部變大’所以，在上游部之自液體供給用 2路往散熱用流路的供給量會變小，在上游部有時也會很 容易產生燒壞的現象。 為了解決上述問題，關於連通液體供給用流路（32, 77 等）與散熱用流路（31，76等）之流路（冷媒通過部）流動阻 2 ’考慮到改變開口部尺寸或節距等，使散熱用流路上游 %部較小，下游部較大，使對於散熱用流路之液體供給量一 樣。 第16Α圖〜第16F圖，如上所述，係例示使位於液體 供給用流路與散熱用流路之邊界的冷媒通過部流動阻力， 在流路上游部較小，下游部較大。 第16Α圖，係表示以連通孔131來連通第15Α圖液體 供給用流路與散熱用流路之情形。連通孔131，係被設定 成愈往液體供給用流路與散熱用流路上游側（圖面右側）直 ^ 捏愈大’愈往上游側則流動阻力愈小。 第16Β圖，係表示以連通孔133來連通第15Α圖液體 供給用流路與散熱用流路之情形。連通孔133，係被設定 成愈往液體供給用流路與散熱用流路上游側（圖面右側）節 距愈小’愈往上游侧則流動阻力愈小。 第16C圖，係表示以狹縫135來連通第15Α圖液體供 給用流路與散熱用流路之情形。狭缝135,係被設定成愈 往液體供給用流路與散熱用流路上游側（圖面右側）寬度愈 大’愈往上游側則流動阻力愈小。 2197-8674-PF;Ahddub 28 1361265 第16D圖’係表示以連通孔137來連通第15B圖液體 供給用流路與散熱用流路之情形。連通孔137，係被設定 成愈往液體供給用流路與散熱用流路上游侧（液體供給用 流路77中央側）直徑愈大，愈往上游側則流動阻力愈小。% is a modification example in the width direction of the heat dissipation flow path 81, and Fig. 8D is a cross-sectional view seen from the lower side of the 8C figure. In this modification, as in the modification shown in Fig. 6G, it is an object which is expandable in the width direction of the heat dissipation flow path 81. Further, as is understood from Fig. 8C, the flow path of the heat dissipation flow path of the present invention may not be in the longitudinal direction. Fig. 8E is a modification of the discharge port 83a for discharging the gaseous refrigerant in the longitudinal direction of the heat dissipation flow path and the direction orthogonal to the lateral direction, and the second drawing is a sectional view system viewed from the lower side of the 8E figure. It is provided on the lower side of the 8F drawing surface. In this modification, the heat dissipation and discharge port 83a is in the heat dissipation flow 24 2197-8674-PF; Ahddub 1361265 • 83 is the inner circumferential surface opposite to the heat dissipation object. Opening at the side. Further, the heat dissipation flow path 83' is blocked in the longitudinal direction (the flow direction of the liquid supply flow path 84), and the gas refrigerant outlet is only the discharge port 83a. The discharge port is, for example, the stone supply flow path 84. Set a plurality of flow directions. In this modification, the evaporated refrigerant does not flow in other areas along the surface of the object to be radiated, and can be immediately discharged. Moreover, in Fig. 8E, the end surface of the flow path can be said to be ✓. The heat sink object configuration. In other words, the heat dissipation flow path of the present invention may not be an object in which the gas refrigerant flows in the direction (y direction) along the object to be radiated. The gaseous refrigerant discharged from the discharge port 83a flows into the tubular body or the rectangular duct, for example, and flows to the condensing unit or the supercooling unit. 9A to 9E are perspective views showing a modified example in which the wall portion of the heat dissipation flow path and the liquid supply flow path (see the wall portion 47 of FIG. 6A or the wall portion 55 of FIG. 6D) or the communication hole. In the modification of Fig. 9A, a plurality of through holes 86 are formed in the flat wall portion 85. For example, they are formed on a metal plate or a resin plate by punching. % In this modification, the wall portion having the communication hole can be easily formed, and the design of the connection hole system can be easily made (for example, the interval of the plurality of communication holes), the size or the shape of the design change. The middle portion is formed with a porous body to form a wall portion 88. Porous systems such as sintered metals. The filtration diameter of the porous body may be appropriately set in accordance with the supply amount of the heat dissipation flow path, but may be, for example, ～200/z. Further, in the prior art in which the liquid refrigerant flows through the heat dissipation flow path, even if the main flow path and the auxiliary flow path are divided by the porous body, a sufficient amount of liquid refrigerant cannot be supplied from the auxiliary flow path to the main flow path. And 2197->8674-PF; Ahddub 25 ·' change in pressure difference, when parallel flow path is considered, L ', 'larger in the downstream part" upstream of the heat dissipation flow path, so the liquid in the upstream part The supply amount of the two channels for supply to the heat dissipation flow path is small, and the phenomenon of burnout is likely to occur in the upstream portion. In order to solve the above problem, the flow path (refrigerant passage portion) of the fluid supply flow path (32, 77, etc.) and the heat dissipation flow path (31, 76, etc.) is flow-resistant 2' in consideration of changing the opening size or pitch. For example, the upstream portion of the heat dissipation flow path is small, and the downstream portion is large, so that the liquid supply amount to the heat dissipation flow path is the same. In the above-described first embodiment, the flow passage resistance of the refrigerant passing through the boundary between the liquid supply flow path and the heat dissipation flow path is exemplified as being small in the upstream portion of the flow path and large in the downstream portion. Fig. 16 is a view showing a state in which the liquid supply flow path and the heat dissipation flow path are communicated by the communication hole 131. The communication hole 131 is set such that the liquid supply flow path and the upstream side of the heat dissipation flow path (the right side of the drawing) are larger and larger, and the flow resistance is smaller as it goes to the upstream side. In the case of the communication hole 133, the liquid supply flow path and the heat dissipation flow path are communicated by the communication hole 133. The communication hole 133 is set such that the pitch of the liquid supply flow path and the upstream side of the heat dissipation flow path (the right side of the drawing) is smaller, and the flow resistance is smaller toward the upstream side. Fig. 16C shows a case where the liquid supply flow path and the heat dissipation flow path of the 15th drawing are communicated by the slit 135. The slit 135 is set to have a larger width toward the upstream side (the right side of the drawing) of the liquid supply flow path and the heat dissipation flow path, and the flow resistance is smaller as it goes upstream. 2197-8674-PF; Ahddub 28 1361265 Fig. 16D is a view showing a state in which the liquid supply flow path and the heat dissipation flow path of Fig. 15B are communicated by the communication hole 137. The communication hole 137 is set to have a larger diameter as the liquid supply flow path and the upstream side of the heat dissipation flow path (the center side of the liquid supply flow path 77), and the flow resistance becomes smaller toward the upstream side.
第16E圖’係表示以連通孔139來連通第15B圖液體 供給用流路與散熱用流路之情形。連通孔139，係被設定 成愈往液體供給用流路與散熱用流路上游側（液體供給用 流路77中央側）節距愈小，愈往上游側則流動阻力愈小。 第16F圖’係表示以狹縫141來連通第15B圖液體供 給用流路與散熱用流路之情形。狹缝141，係被設定成愈 往液體供給用流路與散熱用流路上游側（圖面右側）寬度愈 大’愈往上游侧則流動阻力愈小。但是，藉由流入液體之 衝突’液體供給用流路在局部壓力變高之中央部.係使流動 阻力相對地稍稍提高》 而且’在產生蒸汽之通過量較多的下游部處，有時也 ^ 會產生燒壞之現象。在此情形時，第9D圖或第9E圖所示 在下游部增大流量的方法係為有效。 第1 0A圖〜第1 OF圖，係說明散熱用流路内周面模式 之圖面。在第10A圖〜第10D圖中’液狀冷媒係自液體供 給用流路等往圖面左右方向（X方向）供給。而且，第 圖係對應第2A圖〜第2C圖所示實施形態之圖面。 在第10B圖之變形例中，加上凹槽部40，設有在與凹 槽部40直交方向上延伸之複數凹槽部96。藉由凹槽部96， 液狀冷媒也很容易往凹槽部96延伸方向擴大，液膜係彳艮容 2197-8674-PF;Ahddub 29 1361265 易橫跨散熱用流路全部而形成。尤其，當液狀冷媒自形成 於液體供給用流路之連通孔被供給等，當液狀冷媒之供給 位置係相互分離時，雖然供給位置間很容易乾涸但是， 藉由凹槽部96，液狀冷媒也會在前述供給位置間擴大，所 以’能防止乾涸產生。Fig. 16E is a view showing a state in which the liquid supply flow path and the heat dissipation flow path of Fig. 15B are communicated by the communication hole 139. The communication hole 139 is set such that the pitch of the liquid supply flow path and the upstream side of the heat dissipation flow path (the center side of the liquid supply flow path 77) becomes smaller, and the flow resistance becomes smaller toward the upstream side. Fig. 16F is a view showing a state in which the liquid supply flow path and the heat dissipation flow path of Fig. 15B are communicated by the slit 141. The slit 141 is set to have a larger width toward the upstream side (the right side of the drawing) of the liquid supply flow path and the heat dissipation flow path, and the flow resistance is smaller as it goes to the upstream side. However, by the inflow of the liquid, the liquid supply flow path is slightly higher in the central portion where the partial pressure is higher, and the flow resistance is relatively increased. ^ There will be a phenomenon of burnout. In this case, the method of increasing the flow rate in the downstream portion as shown in Fig. 9D or Fig. 9E is effective. Fig. 10A to Fig. 1 are diagrams showing the inner peripheral surface mode of the heat dissipation flow path. In the 10A to 10D drawings, the liquid refrigerant is supplied from the liquid supply flow path or the like in the left-right direction (X direction) of the drawing. Further, the drawings correspond to the drawings of the embodiments shown in Figs. 2A to 2C. In the modification of Fig. 10B, the groove portion 40 is provided, and a plurality of groove portions 96 extending in the direction orthogonal to the groove portion 40 are provided. By the groove portion 96, the liquid refrigerant is also easily expanded in the direction in which the groove portion 96 extends, and the liquid film system has a capacity of 2197-8674-PF; Ahddub 29 1361265 is easily formed across the entire heat dissipation flow path. In particular, when the liquid refrigerant is supplied from the communication hole formed in the liquid supply flow path or the like, when the supply positions of the liquid refrigerant are separated from each other, the liquid is easily dried between the supply positions, but the liquid is formed by the groove portion 96. The refrigerant also expands between the above-mentioned supply positions, so it can prevent the occurrence of dryness.
而且’也可以不設置凹槽部40而僅設置凹槽部96’ 也可以設置在流路方向傾斜延伸之凹槽部，藉由前述凹槽 部，液狀冷媒會在流路方向及與流路直交方向之雙方擴 大。也可以設置蛇行之凹槽部。而且，凹槽部4〇或在流路 上傾斜延伸之凹槽部，係橫切流路之凹槽部一例。橫切流 路之凹槽部，也可以自流路一邊侧邊端延伸至另一邊之惻 邊端’也可以在側邊端間中途之適當範圍中延伸。 在第10C圖之變形例中，網狀片體98係在散熱用流路 内周面張開。片體98,係浸透有本發明液狀冷媒片體之一 例。片體98 ’係例如以金屬、陶瓷、樹脂、纖維等來形成。 網目大小或編織形式係可對應冷媒種類等而適當選擇。在 本變形例中，冷媒係被吸入片體98而在散熱用流路内周面 擴大。藉此，液膜會遍佈内周面全部。 在第10D圖之變形例中，以多孔質體形成之片體i 〇〇 係張設於散熱用流路内周面β片體1 〇〇，係浸透有本發明 液狀冷媒片體之一例。片體1〇〇係例如以燒結金屬來構 成。在片體100 _，能獲得與片體98相同之效果。 也可以取代片體100之配置，藉由在散熱用流路内周 面施加塗佈或研磨等粗糖面加工，使内周面粗糙，使其具 2197-8674-PF;Ahddub 30 1361265 *- 有液膜保持功能。 第1〇Ε圓及第l〇F圖，係表示凹槽部40或凹槽部96 剖面形狀之實例。第10E圖所示之凹槽部1〇2係剖面v字 形，第10F圖所示凹槽部103係剖面矩形。第1〇E圖及第 10F圖係例示，凹槽部40或凹槽部96也可以是u字形等 之種種形狀《» 第11A圖〜第11C圖，係表示使散熱用流路往流路寬 度方向擴大之變形例，第11A圖係散熱部1〇5之外觀立體 臀圖’第11B圖係第11A圖xib-xib線箭視方向之剖面圖， 第11C圖係第11A圖XIc-XIc線箭視方向之剖面圖。 第11A圖〜第11C圖之散熱部105，係在剖面矩形中 空體106兩側部及中央插入具有分歧部之管體 107A’ 107B，10 7C(以下，單稱「管體107」，有時不加以區 分）而區分’形成2個散熱用流路i〇9A, 1〇9B(以下，單稱 「散熱用流路109」，有時不加以區分）。又，在管體 107A，107B，107C處，分別在内部形成有液體供給用流路 110A，110B，110C(以下，單稱「液體供給用流路11〇」，有 時不加以區分）。在管體107處，連通散熱用流路1〇9與液 體供給用流路11 〇之未圖示連通孔係沿著散熱用流路1 〇 9 流路方向設有複數個。 在各散熱用流路109中’與第2A圖所示散熱用流路相 同地’液狀冷媒係透過未圖示連通孔自配置於其兩側之液 體供給用流路110供給，形成冷媒液膜。但是，中央之液 體供給用流路11 0B，係使液狀冷媒供給到其兩側之散熱用 31 2197-8674-PF/Ahddub 1361265 流路109A及109B兩者。在各散熱用流路109中蒸發之氣 體狀冷媒，係在自各散熱用流路109排出後合流。Moreover, it is also possible to provide only the groove portion 96' without providing the groove portion 40. It is also possible to provide a groove portion extending obliquely in the direction of the flow path. With the groove portion, the liquid refrigerant will flow in the flow path direction and flow. Both sides of the road are expanding. It is also possible to set the groove portion of the meandering line. Further, the groove portion 4A or the groove portion that extends obliquely on the flow path is an example of a groove portion that crosses the flow path. The groove portion of the cross-cut flow path may extend from the side end of the flow path to the side edge of the other side, or may extend in an appropriate range midway between the side ends. In the modification of Fig. 10C, the mesh sheet body 98 is opened on the inner peripheral surface of the heat dissipation flow path. The sheet 98 is impregnated with an example of the liquid refrigerant sheet of the present invention. The sheet 98' is formed, for example, of metal, ceramic, resin, fiber, or the like. The mesh size or the knitting form can be appropriately selected depending on the type of the refrigerant or the like. In the present modification, the refrigerant is sucked into the sheet body 98 and enlarged in the inner peripheral surface of the heat dissipation flow path. Thereby, the liquid film spreads over the entire inner peripheral surface. In the modification of the 10th view, the sheet body i formed of the porous body is stretched over the inner peripheral surface of the heat dissipation flow path β sheet body 1 , and is impregnated with the liquid refrigerant sheet body of the present invention. . The sheet 1 is made of, for example, a sintered metal. In the sheet 100 _, the same effect as the sheet 98 can be obtained. Instead of the arrangement of the sheet body 100, the inner peripheral surface may be roughened by applying a rough sugar surface such as coating or grinding on the inner peripheral surface of the heat dissipation flow path to have a 2197-8674-PF; Ahddub 30 1361265 *- Liquid film retention function. The first round and the first FIG. F are examples showing the cross-sectional shape of the groove portion 40 or the groove portion 96. The groove portion 1〇2 shown in Fig. 10E has a v-shaped cross section, and the groove portion 103 shown in Fig. 10F has a rectangular cross section. In the first and third embodiments, the groove portion 40 or the groove portion 96 may have various shapes such as a U-shape, etc. "»11A to 11C, which means that the heat dissipation flow path is made to the flow path. In the modification example in which the width direction is enlarged, the 11A is the appearance of the heat dissipating portion 1〇5, and the 11A is the cross-sectional view of the xib-xib line arrow direction, and the 11C is the 11A chart XIc-XIc. A cross-sectional view of the line arrow. The heat radiating portion 105 of the 11A to 11C is inserted into the tubular body 107A' 107B, 10 7C having a branching portion at both sides and the center of the rectangular hollow body 106. (hereinafter, simply referred to as "tube 107", sometimes In order to distinguish between the two heat dissipation channels i〇9A and 1〇9B (hereinafter, simply referred to as “heat dissipation flow path 109”, there is no distinction). Further, liquid supply channels 110A, 110B, and 110C are formed inside the tubes 107A, 107B, and 107C (hereinafter, simply referred to as "liquid supply channels 11", and sometimes they are not distinguished). In the pipe body 107, a plurality of communication holes (not shown) that communicate the heat dissipation flow path 1〇9 and the liquid supply flow path 11 are provided along the flow path direction of the heat dissipation flow path 1 〇 9 . In each of the heat dissipation flow paths 109, 'the same as the heat dissipation flow path shown in FIG. 2A', the liquid refrigerant is supplied from the liquid supply flow path 110 disposed on both sides through a communication hole (not shown) to form a refrigerant liquid. membrane. However, the central liquid supply flow path 11 0B supplies both the heat dissipation 31 2197-8674-PF/Ahddub 1361265 flow paths 109A and 109B to the both sides of the liquid refrigerant. The gas-like refrigerant evaporated in each of the heat dissipation passages 109 is discharged from the respective heat dissipation passages 109 and merged.
第11A圖〜第lie圖之變形例中，係散熱用流路在流 路寬度方向中被分割成複數散熱用流路1〇9，所以，寬度 方向之加熱長度會變短’能防止液狀冷媒乾涸。換言之， 有可能使散熱用流路往寬度方向擴張。在2個散熱用流路 10 9A及10 9B中’係共用液體供給用流路11〇B，能減少零 件數量。2個散熱用流路i〇9A及i〇9B係被液體供給用流 路110B分隔’散熱用流路1〇9人及109B之相互影響會緩和。 第12A圖〜第12C圖，係表示使散熱用流路往流路方 向擴大之變形例’第12A圖係散熱部112之外觀立體圖， 第12B圖係第12A圖XI Ib-XI lb線箭視方向之剖面圖，第 12C圖係第12A圖XIIc-XIIc線箭視方向之刮面圖。 第12A圖〜第12C圖之散熱部112’係在剖面矩形中 空體114兩側部及中央插入具有分歧部之管體 115A，115B，115C(以下’單稱「管體115」，有時不加以區 分）而區分’形成2個散熱用流路ιΐ6Α，116B(以下，單稱 「散熱用流路.116」’有時不加以區分）。又，在管體 115A，115B，115C處’分別在内部形成有液體供給用流路 117A，117B，117C(以下’單稱「液體供給用流路Η?」，有 時不加以區分）。在管體115處，連通散熱用流路116與液 體供給用流路11 7之未圖示連通孔係沿著散熱用流路116 流路方向設有複數個。 散熱用流路116’係在流路方向（y方向）中，被分隔成 2197-8674-PF;Ahddub 32 1361265 複數區塊Dl，D2, D3。在複數區塊D1〜D3處，流路側邊， 例如分別設有往散熱對象物H0相反側開口而使氣體狀冷 媒排出之排出口 119A，119B，119C。在各區塊中，藉由供給 自液體供給用流路117之冷媒而形成液臈，蒸發後之冷媒 係自排出口 119A〜119C排出。而且，液體供給用流路117， 如第12B圖所示’可以橫跨全區參D1〜D3而連通，也可以 與散熱用流路116相同地分隔成複數個。 在此變形例中，使散熱用流路116在流路方向中分 隔’藉此’能使蒸發後之冷媒早些排出而提高各區塊Μ〜 D3之散熱效率，同時，能緩和各區塊間之相互影響。換言 之’此使散熱用流路（亦即散熱面）無限增長。但是，液體 供給用流路117無須配合區塊D1〜D3而分隔，無須設計變 更。而且’在如先前之使液狀冷媒流動的技術中，當使散 熱用流路在流路方向中分隔時，壓力損失會變大幫浦負 擔會增大，冷卻效率會降低，所以，很難往流路方向擴張。 第13圖係表示散熱裝置全體構成變形例之圖面。而 且關於第1圖散熱裝置i共通部分係賦予相同編號。第 13圖之敢熱裝置中，係省略氣液分相器Μ及過冷卻部2卜 因此’蒸發冷媒係在冷凝部14内部完全回復到液體，來自 散…' 對象物之熱量Q’係、全部在冷凝部14中往大氣排出。 第π圖係表示本發明應用例之圖面。 π車151’係具有作為散熱對象物之動力控制器153 及散熱裝置155。 散熱裝置155’係具有也L >+> λ， JL. π丹有興上述散熱裝置1類似之構成。 2197-8674-PF；Ahddub 1361265 具體說來，散熱裝置155係具有：輔助液體槽157(對應儲 液槽3) ’儲留液狀冷媒；幫浦159(對應幫浦5)，使液狀 冷媒送出’散熱部161(對應散熱部12)，以藉由幫浦159 送出之液狀冷媒來使動力控制器153散熱；冷凝器163(對 應冷凝部14) ’使自散熱部161流出之冷媒冷凝；以及氣 液/刀相器165(對應氣液分相器19)，使自冷凝器163流出 之冷媒为離成氣體狀冷媒及液狀冷媒。以氣液分相器165 分離之液狀冷媒，係以幫浦159送出。以幫浦159送出之 液狀冷媒，係藉由流量控制單元16〇來控制往辅助液體槽 157或散熱部161之流量。 散熱部161，雖然未圖示，但是，與散熱部12相同地， 具有與動力控制器153鄰接設置的散熱用流路。在散熱用 流路之既定方向複數位置（既定範圍）中，液狀冷媒係被供 給到散熱用流路内，在散熱用流路内周面橫跨複數位置（既 定範圍）形成有冷媒液膜。藉由液膜之蒸發，動力控制器 15 3被冷卻。 田使用於汽車時，動力控制器之容許溫度（丨左右） 與散出廢熱之外氣溫度（3Qt:左右）間之溫度差很小，藉由 液膜蒸發，能使散熱部之期望溫度差抑低到比通常之沸騰 溫度還要小，所以，能提高冷卻系統全體之散熱能力。 第18圖係本發明另一應用例之圖面。 電力轉換系統171，係例如設於發電廠或工廠等，其 為轉換電壓等之系統。電力轉換系統m，係具有作為散 熱對象物之複數功率元件173及散熱裝置175。 34 2197-8674-PF;Ahddub ^61265 散熱震置175 ’係具有與占述散熱裝置121類似之構 成。具體說來，散熱裝置175係具有：幫浦177(對應幫浦 5)’送出液狀冷媒；複數散熱部179(對應散熱部12)，藉 由以幫浦177送出之液狀冷媒來使複數功率元件173散 熱，以及空冷單元181(對應冷凝部14)，使自散熱部179 流出之氣體狀冷媒冷凝。自空冷單元181流出之冷媒係以 幫浦17 7送出。In the modification of the 11th to the lieth diagrams, the heat dissipation flow path is divided into the plurality of heat dissipation flow paths 1〇9 in the flow path width direction, so that the heating length in the width direction is shortened. The refrigerant is dry. In other words, it is possible to expand the heat dissipation flow path in the width direction. In the two heat dissipation passages 10 9A and 10 9B, the liquid supply flow path 11〇B is shared, and the number of parts can be reduced. The two heat dissipation flow paths i〇9A and i〇9B are separated by the liquid supply flow path 110B. The mutual influence of the heat dissipation flow paths 1〇9 and 109B is alleviated. 12A to 12C are external perspective views showing a modified example of the heat dissipation flow path in the flow path direction. FIG. 12A is a perspective view of the heat dissipation portion 112, and FIG. 12B is a 12A diagram XI Ib-XI lb line arrow The cross-sectional view of the direction, Fig. 12C is the scraped surface view of the arrow direction of the XIIc-XIIc line of Fig. 12A. The heat radiating portions 112' of the 12A to 12C are inserted into the tubular bodies 115A, 115B, 115C having the branch portions at the both sides and the center of the rectangular hollow body 114 (hereinafter referred to as "single pipe 115", sometimes not By distinguishing between the two types of heat dissipation flow paths ιΐ6Α, 116B (hereinafter, simply referred to as “heat dissipation flow path.116”) may not be distinguished. Further, liquid supply channels 117A, 117B, and 117C are formed inside the tubes 115A, 115B, and 115C, respectively (hereinafter referred to as "liquid supply flow paths", and are sometimes not distinguished). In the pipe body 115, a plurality of communication holes, which are connected to the heat dissipation flow path 116 and the liquid supply flow path 117, are provided along the flow path direction of the heat dissipation flow path 116. The heat dissipation flow path 116' is divided into a flow path direction (y direction) and is divided into 2197-8674-PF; Ahddub 32 1361265 plural blocks D1, D2, D3. In the plurality of blocks D1 to D3, for example, discharge ports 119A, 119B, and 119C that open to the opposite side of the heat-dissipating object H0 and discharge the gaseous refrigerant are provided on the side of the flow path. In each of the blocks, liquid sputum is formed by the refrigerant supplied from the liquid supply flow path 117, and the evaporated refrigerant is discharged from the discharge ports 119A to 119C. Further, the liquid supply flow path 117 may be connected across the entire area parameters D1 to D3 as shown in Fig. 12B, or may be divided into a plurality of pieces similarly to the heat dissipation flow path 116. In this modification, the heat dissipation flow path 116 is partitioned in the flow path direction to "by this", so that the evaporated refrigerant can be discharged earlier, thereby improving the heat dissipation efficiency of each of the blocks D to D3, and at the same time, all the blocks can be alleviated. The mutual influence. In other words, this allows the heat dissipation flow path (i.e., the heat dissipation surface) to grow indefinitely. However, the liquid supply flow path 117 does not need to be partitioned by the blocks D1 to D3, and no design change is required. Further, in the technique of flowing the liquid refrigerant as in the prior art, when the heat dissipation flow path is partitioned in the flow path direction, the pressure loss becomes large, the burden on the pump increases, and the cooling efficiency is lowered, so that it is difficult Expand in the direction of the flow. Fig. 13 is a view showing a modification of the entire heat dissipating device. Further, the same reference numerals are given to the common portions of the heat sink i of Fig. 1. In the heat treatment device of Fig. 13, the gas-liquid phase separator and the supercooling unit 2 are omitted, so that the 'evaporation refrigerant is completely returned to the liquid inside the condensation portion 14, and the heat Q' of the object is All are discharged to the atmosphere in the condensing unit 14. The πth diagram shows the drawing of the application example of the present invention. The π car 151' has a power controller 153 as a heat sink object and a heat sink 155. The heat sink 155' has a configuration similar to that of the above-described heat sink 1 also having L >+> λ, JL. 2197-8674-PF; Ahddub 1361265 Specifically, the heat sink 155 has an auxiliary liquid tank 157 (corresponding to the liquid storage tank 3) 'reserving liquid refrigerant; and a pump 159 (corresponding to the pump 5) to make the liquid refrigerant The heat radiating portion 161 (corresponding to the heat radiating portion 12) is sent to dissipate the power controller 153 by the liquid refrigerant sent from the pump 159; the condenser 163 (corresponding to the condensing portion 14) 'condenses the refrigerant flowing out from the heat radiating portion 161 And a gas-liquid/phaser 165 (corresponding to the gas-liquid phase separator 19), so that the refrigerant flowing out of the condenser 163 is separated into a gaseous refrigerant and a liquid refrigerant. The liquid refrigerant separated by the gas-liquid phase separator 165 is sent out by the pump 159. The liquid refrigerant sent from the pump 159 is controlled by the flow rate control unit 16 to control the flow rate to the auxiliary liquid tank 157 or the heat radiating portion 161. The heat radiating portion 161 has a heat radiating flow path provided adjacent to the power controller 153, similarly to the heat radiating portion 12, although not shown. In a predetermined position (fixed range) in a predetermined direction of the heat dissipation flow path, the liquid refrigerant is supplied into the heat dissipation flow path, and a refrigerant liquid film is formed across the plurality of positions (fixed range) in the inner circumferential surface of the heat dissipation flow path. . The power controller 153 is cooled by evaporation of the liquid film. When the field is used in a car, the temperature difference between the allowable temperature of the power controller (about 丨) and the temperature of the gas outside the waste heat (3Qt: left and right) is small, and the desired temperature difference of the heat radiating portion can be obtained by evaporation of the liquid film. It is lower than the normal boiling temperature, so it can improve the heat dissipation capacity of the entire cooling system. Figure 18 is a drawing of another application example of the present invention. The power conversion system 171 is, for example, a power plant or a factory, and is a system that converts a voltage or the like. The power conversion system m has a plurality of power elements 173 as a heat radiating object and a heat sink 175. 34 2197-8674-PF; Ahddub ^61265 The heat sinking 175' has a configuration similar to that of the heat sink 121. Specifically, the heat sink 175 has a pump 177 (corresponding to the pump 5) 'sending liquid refrigerant; a plurality of heat radiating portions 179 (corresponding to the heat radiating portion 12), and the liquid refrigerant sent by the pump 177 is used to make the plural The power element 173 dissipates heat, and the air cooling unit 181 (corresponding to the condensing unit 14) condenses the gaseous refrigerant flowing out of the heat radiating portion 179. The refrigerant that has flowed out of the air-cooling unit 181 is sent out by the pump 17 7 .
複數功率元件173及複數散熱部179，係藉由1個散 熱部179與2個功率元件173交互積層，而構成功率元件 冷卻列183。功率元件冷卻列183係複數配列。各功率元 件冷部列183中，功率元件173係配置於i個散熱部179 兩侧’藉由1個散熱部179可使2個功率元件173散熱。 複數功率元件冷卻列183及各功率元件冷卻列183内 之複數散熱17 9，係相互並列連接。亦即，自幫浦17 7 送出之液狀冷媒’係分流而流入各功率元件冷卻列18 3， 而且，在各功率元件冷卻列丨83申分流而流入各散熱部 179。 各散熱部179’雖然未圖示，但是與散熱部12相同地， 具有與功率元件173鄰接設置之散熱用流路。在散熱用流 路既定方向之複數位置（既定範圍）中，液狀冷媒係供給到 散熱用流路内’在液狀冷媒係被供給到散熱用流路内，在 散熱用流路内周面橫跨複數位置（既定範圍）形成有冷媒液 膜。藉由液膜之蒸發，功率元件173被冷卻。 第1 9Α圖及第19Β圖，係說明本發明效果之圖面。第 2197-8674-PF;Ahddub 35 1361265 19A圖係表示在本發明一例散熱裝置中，由實驗所得之熱 傳特性圖。第19B圖係表示將第19A圖熱傳特性與先前技 術中之熱傳特性的比較圖。在第19A圖及第19B圖中橫 軸係表不使散熱對象物散熱對象面（構成散熱用流路之i 個表面）與流入散熱用流路之液狀冷媒的溫度差ΔΤ(Κ)，縱 軸係表不散熱對象物散熱對象面中之熱流束q(w/cm2) ^ 又’在圖中，表示有熱傳率a(w/m2K)。 在第19A圖及第19B圖中，圓形記號M1，係表示本發 明一例之散熱裝置中，散熱用流路流路方向上游且寬度方 向中央位置中之值，矩形記號M2，係表示本發明一例之散 熱裝置中，散熱用流路流路方向中央且寬度方向中央位置 中之值，二角形記號M3,係表示本發明一例之散熱裝置中， 散熱用流路流路方向下游且寬度方向中央位置中之值。 本發明一例散熱裝置之散熱用流路，係在内周面形成 有凹槽之物件。又，無設置熱分離器。在散熱用流路入口 中之液體過冷度（飽和溫度起之差）係15K。液狀冷媒體積 流量，係4. 5公升/分鐘。液體供給用流路之單側，係被關 閉。散熱用流路間隙寬度（與相向於散熱對象物之絕熱面間 之間隙）係5mm。散熱對象面之寬度χ長度（流路方向）係 30mm X 150mm。 由第19A圖及第19B圖可知，在本發明一例之散熱萝 置中，即使不設置熱分離器時，藉由具有熱分離器之水= 方式，也能實現以高一級之熱流束來冷卻。但是，可冷卻 之發熱面積係大2級，能藉由液膜蒸發來獲得很高的熱傳 2197-8674-PF;Ahddub 36 1^01265 率所以，散熱對象物與流體之溫度差非常小β 本發明並不侷限於以上實施形態或變形例，也 種態樣。 散熱對象物，係只要比冷媒之飽和溫度還要高溫即 可，其可為功率元件、馬達、電池等散出熱之發熱體，也 可以為熱分離器等傳遞發熱物之熱的傳熱物。氣體、液體 散熱用流路，只要是鄰接散熱對象物設置即可，可以 適當材質、形狀或尺寸來形成。無論如何，散熱用流路， 係當鄰接散熱對象物時，來自散熱對象物之熱會被傳遞， 所以係成為與散熱對象做熱連接。 液狀冷媒供給往散熱用流路之複數位置，係並不偈限 於配置於流路方向。液狀冷媒係被供給到複數位置，备橫 跨前述複數位置形成液膜時，也可為與流路直交之:向 等。而且，在橫跨複數位置之範圍處，雖然希望不要產生 r酒處所但疋’即使在局部產生乾酒處所，液狀冷媒係 被供到複數位置，而且，當不是如先前流通液狀冷媒之 技術般地在橫跨複數位置之範圍處填充有液狀冷媒之狀 態（液狀冷媒充滿散熱用流路）時，可以說横跨複數位置皆 形成有液膜。 【圖式簡單說明】 第1圖係表示本發明實施形態散熱裝置之整體構成 圖0 37 2197-8674-PF；Ahddub 1361265 第2A圖至第2C圖係表示第i圖散熱裝置散熱部構成 例之示意圖。 口圖係、說明2C圖散熱部構成 孰 方法之示意圖。 "' 第4A圖至第4C圖係以另一觀點捕捉第1圖散熱裝置 效果之說明圖。The plurality of power elements 173 and the plurality of heat radiating portions 179 are alternately laminated by two heat radiating portions 179 and two power elements 173 to constitute a power element cooling column 183. The power element cooling column 183 is a plurality of columns. In each of the power element cold portion columns 183, the power elements 173 are disposed on both sides of the i heat radiating portions 179. The two power elements 173 can dissipate heat by the one heat radiating portion 179. The plurality of power element cooling columns 183 and the plurality of heat sinks 17 9 in each of the power element cooling columns 183 are connected in parallel with each other. That is, the liquid refrigerant sent from the pump 17 7 is branched and flows into the respective power element cooling columns 183, and flows into the respective heat radiating portions 179 in the respective power element cooling columns 83. Although not shown, each of the heat dissipation portions 179' has a heat dissipation flow path provided adjacent to the power element 173, similarly to the heat dissipation portion 12. In a plurality of positions (fixed ranges) in a predetermined direction of the heat dissipation flow path, the liquid refrigerant is supplied into the heat dissipation flow path, and is supplied to the heat dissipation flow path in the liquid refrigerant, and the inner circumferential surface of the heat dissipation flow path is provided. A refrigerant liquid film is formed across the complex position (established range). Power element 173 is cooled by evaporation of the liquid film. Figures 19 and 19 are diagrams illustrating the effects of the present invention. 2197-8674-PF; Ahddub 35 1361265 19A is a heat transfer characteristic diagram obtained by an experiment in an example of a heat sink of the present invention. Fig. 19B is a view showing a comparison of the heat transfer characteristics of Fig. 19A with the heat transfer characteristics of the prior art. In the case of the horizontal axis, the temperature difference ΔΤ(Κ) between the heat-dissipating object surface (i surface constituting the heat-dissipating flow path) and the liquid-type refrigerant flowing into the heat-dissipating flow path is not shown in FIGS. 19A and 19B. The vertical axis indicates the heat flux q (w/cm2) in the heat-dissipating object surface of the heat-dissipating object. ^ In the figure, the heat transfer rate a (w/m2K) is shown. In the 19A and 19B, the circular symbol M1 is a value in the heat dissipation device according to an example of the present invention in the direction of the flow path in the heat dissipation direction and in the center in the width direction, and the rectangular symbol M2 indicates the present invention. In one example of the heat sink, the center of the flow path in the heat dissipation flow path and the value in the center in the width direction, and the square symbol M3 indicates that the heat dissipation flow path is downstream and the center of the width direction is in the heat sink of an example of the present invention. The value in the location. An example of the heat dissipating flow path of the heat dissipating device of the present invention is an object having a groove formed on the inner peripheral surface. Also, no hot separator is provided. The degree of subcooling of the liquid in the heat transfer passage inlet (the difference between the saturation temperatures) is 15K. 5毫升升/分钟。 The liquid cold medium product flow rate is 4.5 liters / minute. One side of the liquid supply flow path is closed. The flow path gap width for heat dissipation (the gap between the heat insulating surfaces and the heat insulating surface facing the heat radiating object) is 5 mm. The width χ length (flow path direction) of the heat-dissipating object surface is 30mm X 150mm. 19A and 19B, in the case of the heat sink of an example of the present invention, even if the heat separator is not provided, the water having the heat separator can be used to cool the heat stream with a higher temperature. . However, the heat-generating area that can be cooled is 2 levels, and a high heat transfer 2197-8674-PF can be obtained by liquid film evaporation; Ahddub 36 1^01265 rate, the temperature difference between the heat-dissipating object and the fluid is very small β The present invention is not limited to the above embodiment or modification, and is also applicable. The object to be radiated is only required to have a higher temperature than the saturation temperature of the refrigerant, and may be a heat generating body that radiates heat from a power element, a motor, a battery, or the like, or may be a heat transfer device that transfers heat of the heat generating material such as a heat separator. . The gas or liquid heat dissipation flow path may be formed by a suitable material, shape, or size as long as it is disposed adjacent to the heat dissipation object. In any case, when the heat-dissipating flow path is adjacent to the heat-dissipating object, the heat from the heat-dissipating object is transmitted, so that it is thermally connected to the heat-dissipating object. The plurality of positions at which the liquid refrigerant is supplied to the heat dissipation flow path are not limited to being arranged in the flow path direction. The liquid refrigerant is supplied to a plurality of positions, and when a liquid film is formed across the plurality of positions, it may be orthogonal to the flow path. Moreover, in the range across the plural position, although it is desirable not to produce a liquor place, 疋 'even if a dry wine place is locally generated, the liquid refrigerant is supplied to a plurality of positions, and, when it is not a liquid refrigerant as previously flowed When the liquid refrigerant is filled in the range of the complex position (the liquid refrigerant is filled with the heat dissipation flow path), it can be said that a liquid film is formed across the plurality of positions. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an overall configuration of a heat sink according to an embodiment of the present invention. Fig. 0 37 2197-8674-PF; Ahddub 1361265 Fig. 2A to Fig. 2C are diagrams showing an example of a heat radiating portion of the heat sink of Fig. schematic diagram. The port diagram shows the schematic diagram of the 散热 method of the 2C diagram. "' 4A to 4C are diagrams illustrating the effect of the heat sink of Fig. 1 from another point of view.
第5A圖至第5D圖係由加熱長度之觀點來說明往散熱 用流路之液體提供方法變形例之示意圖。 ‘ ' 第6A圖至第6G圖係表示使液體供給到散熱用流路之 變形例剖面圖。 第7A圖至第7D圖係說明液體供給用流路及散熱用流 路中流動模式之示意圖。 第8A圖至第8F圖係表示使液體供給用流路及散熱用 流路中流動模式做3維擴張之變形例的示意圖。 …Figs. 5A to 5D are views showing a modification of the liquid supply method to the heat dissipation flow path from the viewpoint of the heating length. ′′ 6A to 6G are cross-sectional views showing modifications of the liquid supply to the heat dissipation flow path. Figs. 7A to 7D are views showing a flow pattern in the liquid supply flow path and the heat dissipation flow path. 8A to 8F are schematic views showing a modification in which the flow pattern in the liquid supply flow path and the heat dissipation flow path are expanded in three dimensions. ...
第9A圖至第9E圖係表示分隔散熱用流路與液體供 用流路之壁部或連通孔的變形例的立體圖。 第10A圖至第10F圖係說明散熱用流路内周面 例的示意圖。 ' 第11A圖至第11C圖係表示使散熱用流路往流路橫 擴大之變形例的示意圖。 給 式 向 第12A圖至第12C圖俏矣_找也也w + 向 _保表不使散熱用流路往流路方 擴大之變形例的示意圖》 第13圖係表示散熱裝置整體構成變形例之示意圖。 第14圖係表示先前散熱用流路之示意圖。 2197-8674-PF； Ahddub 389A to 9E are perspective views showing modifications of the wall portion or the communication hole separating the heat dissipation flow path and the liquid supply flow path. Figs. 10A to 10F are views showing an example of the inner peripheral surface of the flow path for heat dissipation. 11A to 11C are schematic views showing a modified example in which the heat dissipation flow path is expanded laterally. The pattern of the heat transfer device is shown in FIG. 13A to FIG. 12C. FIG. 13 is a schematic view showing a modification of the entire heat sink device. Schematic diagram. Fig. 14 is a view showing a flow path for the previous heat dissipation. 2197-8674-PF; Ahddub 38
Claims (1)
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| JP2006045558 | 2006-02-22 |
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| TW096106405A TW200739014A (en) | 2006-02-22 | 2007-02-26 | Heat removing method and heat removing apparatus |
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| US (1) | US20090114374A1 (en) |
| JP (1) | JP4269060B2 (en) |
| TW (1) | TW200739014A (en) |
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| CN106714505A (en) * | 2015-11-13 | 2017-05-24 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation system of server |
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| JP4552877B2 (en) * | 2006-03-27 | 2010-09-29 | トヨタ自動車株式会社 | Cooler |
| JP4544187B2 (en) * | 2006-03-29 | 2010-09-15 | トヨタ自動車株式会社 | Cooler |
| JP4986064B2 (en) * | 2008-02-27 | 2012-07-25 | アイシン・エィ・ダブリュ株式会社 | Heating element cooling device |
| FR2993649B1 (en) * | 2012-07-18 | 2014-08-08 | Astrium Sas | THERMAL CONTROL DEVICE |
| KR101474616B1 (en) * | 2012-11-02 | 2014-12-18 | 삼성전기주식회사 | Cooling system of power semiconductor device |
| US10436519B1 (en) * | 2015-10-14 | 2019-10-08 | The Research Foundation For The State University Of New York | Cocurrent loop thermosyphon heat transfer system for sub-ambient evaporative cooling and cool storage |
| JP6321089B2 (en) * | 2016-07-04 | 2018-05-09 | レノボ・シンガポール・プライベート・リミテッド | Vapor chamber and electronic equipment |
| JP2021069993A (en) * | 2019-10-31 | 2021-05-06 | キヤノン株式会社 | Ultrafine bubble generation device and method for controlling the same |
| US11333445B1 (en) * | 2020-08-31 | 2022-05-17 | Mainstream Engineering Corporation | Modular membrane controlled three-phase deployable radiator |
| CN113883925B (en) * | 2021-10-18 | 2022-08-09 | 西安交通大学 | Uniform liquid film evaporation heat exchanger and method |
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| KR100294317B1 (en) * | 1999-06-04 | 2001-06-15 | 이정현 | Micro-cooling system |
| JP4178850B2 (en) * | 2002-06-25 | 2008-11-12 | ソニー株式会社 | COOLING DEVICE, ELECTRONIC DEVICE DEVICE, COOLING DEVICE MANUFACTURING METHOD, AND Evaporator |
| EP1432295B1 (en) * | 2002-12-20 | 2005-04-13 | Innowert GmbH | Cooling device for an electric or electronic unit |
| US6994152B2 (en) * | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
| JP3908705B2 (en) * | 2003-08-29 | 2007-04-25 | 株式会社東芝 | Liquid cooling device and liquid cooling system |
| JP2005259747A (en) * | 2004-03-09 | 2005-09-22 | Sony Corp | Heat transport apparatus and electronic device |
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- 2007-02-22 WO PCT/JP2007/053297 patent/WO2007105450A1/en active Search and Examination
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714505A (en) * | 2015-11-13 | 2017-05-24 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation system of server |
Also Published As
| Publication number | Publication date |
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| WO2007105450A1 (en) | 2007-09-20 |
| JPWO2007105450A1 (en) | 2009-07-30 |
| US20090114374A1 (en) | 2009-05-07 |
| JP4269060B2 (en) | 2009-05-27 |
| TW200739014A (en) | 2007-10-16 |
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