JP5961948B2 - COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME - Google Patents

Description

  The present invention relates to a cooling device that cools a heat generating member in an electronic device and an electronic device using the same, and in particular, in a low-profile electronic device such as a 1U server, the heat generating member is used by utilizing a phase change of a refrigerant. The present invention relates to a cooling device for cooling and an electronic apparatus using the same.

  In recent years, the amount of heat generated by semiconductor devices and electronic devices has been increased with higher performance and higher functionality. For example, in an electronic device such as a computer equipped with a CPU, the amount of heat generated by a semiconductor element such as a CPU increases as the amount of information and the processing speed increase. Since the semiconductor element itself may be damaged by heat generated from the semiconductor element, an electronic device such as a computer using the semiconductor element includes a cooling device that cools a heating element such as a semiconductor.

  However, in a large electronic device, a sufficient mounting space can be provided for the cooling device. However, in a small electronic device such as a personal computer or a 1U server, the mounting space cannot be sufficiently provided. It is essential to keep the height low. The 1U server is a server having a rack height of 1U (1.75 inches), which is the minimum unit of rack height defined by the US Electronic Industries Alliance.

  Patent Document 1 discloses an electronic device (1U server) equipped with a refrigerant circulation cooling device as a thin electronic device equipped with a cooling device. The cooling device of Patent Document 1 connects an evaporator and a condenser for cooling a CPU by piping, vaporizes the refrigerant by the heat of the CPU and condenses the refrigerant by cooling the condenser with a fan, and is generated from the CPU. Heat transfer and heat dissipation. In this electronic device, the cooling device is mounted on a thin electronic device (1U server) by dividing the condenser of the cooling device into a main condenser and a sub-condenser and installing the sub-condenser on the evaporator. .

  Patent Document 2 discloses an electronic device (1U server) that cools a CPU using a refrigerant circulation cooling device and cools other heat generating members using a fan as a thin electronic device equipped with a cooling device. It is disclosed. The cooling device of Patent Document 2 improves the performance of the radiator by bringing a high-temperature side pipe and a low-temperature side pipe connecting between the radiator (condenser) and the jacket (evaporator) into contact with each other through a thermal joint.

JP 2006-12875 A Japanese Patent Laid-Open No. 2007-10211

  However, since the cooling device of patent document 1 cannot cool the subcondenser arrange | positioned on the evaporator, the cooling efficiency of a cooling device falls. In the cooling device of Patent Document 2, the cooling device is arranged to cool the CPU, so that the flow of the cooling air output from the fan of the electronic device for cooling the other heat generating members is prevented. Therefore, the cooling efficiency of other heat generating members other than the CPU is lowered, and as a result, the cooling efficiency of the entire electronic device is lowered. As described above, when the cooling devices disclosed in Patent Document 1 and Patent Document 2 are mounted on a thin electronic device, there is a problem in that the cooling efficiency of the entire electronic device decreases.

  An object of the present invention is a cooling device that solves the problem that the cooling efficiency of the entire electronic device is reduced when mounted on a thin electronic device in the cooling device using phase change, which is the above-described problem. The object is to provide an electronic device using the.

  In order to achieve the above object, a cooling device according to the present invention includes a refrigerant, a boiling section that absorbs heat by changing the phase of the refrigerant from a liquid phase to a gas phase, and a phase of the refrigerant from the gas phase to the liquid phase. A condensing part that changes heat to dissipate, and a vapor pipe and a liquid pipe that connect the boiling part and the condensing part are provided. Here, the boiling part container which comprises a boiling part comprises the flow path through which the cooling air which cools a condensation part flows.

  In order to achieve the above object, an electronic apparatus according to the present invention includes a first heat generating member that generates heat during operation, a cooling device, and a fan. Here, the cooling device includes a refrigerant, a boiling unit that performs heat absorption by changing the phase of the refrigerant from a liquid phase state to a gas phase state, and a condensation unit that performs heat dissipation by changing the phase of the refrigerant from a gas phase state to a liquid phase state. And a piping connecting the boiling part and the condensing part, and the boiling part container constituting the boiling part constitutes a flow path for flowing cooling air for cooling the condensing part. The fan is arranged to face the condensing part and outputs cooling air.

  The cooling device according to the present invention and an electronic device using the same can improve the cooling efficiency of the entire electronic device even when mounted on a thin electronic device.

It is sectional drawing which shows the internal structure of the electronic device 10 which concerns on the 1st Embodiment of this invention. It is the (a) top view of the boiling part 50 which concerns on the 1st Embodiment of this invention, (b) XX sectional drawing of (a), (c) YY sectional drawing of (a). It is a schematic perspective view of the boiling part 50 which concerns on the 1st Embodiment of this invention. FIG. 3 is a schematic diagram illustrating a flow of cooling air output from a fan 40 in the electronic device 10 according to the first embodiment of the present invention. In 1st Embodiment of this invention, it is a perspective view of (a) boiling part 50B, (b) boiling part 50C, (c) boiling part 50D, (d) boiling part 50E which formed the notch part of the other shape in 1st Embodiment of this invention. is there. In the first embodiment of the present invention, the vapor pipe and the liquid pipe are disposed at other positions in (a) the boiling part 50F, (b) the boiling part 50G, (c) the boiling part 50H, and (d) the boiling part 50I. It is sectional drawing. It is sectional drawing which shows the internal structure of the server 100 which concerns on the 2nd Embodiment of this invention. It is the (a) top view of the chamber 310 which concerns on the 2nd Embodiment of this invention, (b) XX sectional drawing of (a), (c) YY sectional drawing of (a). It is a schematic perspective view of the chamber 310 which concerns on the 2nd Embodiment of this invention. In the server 100 which concerns on the 2nd Embodiment of this invention, (a) sectional drawing which shows the flow of the cooling air output from the fan 500, (b) It is a top view. In the 2nd Embodiment of this invention, it is a perspective view of (a) chamber 310B, (b) chamber 310C, (c) chamber 310D which formed the notch part of the other shape. It is the (a) top view of the chamber 370 which concerns on the 3rd Embodiment of this invention, (b) The XX sectional view taken on the line (a), (c) It is the YY sectional view taken on the line (a). It is a schematic perspective view of the chamber 370 which concerns on the 3rd Embodiment of this invention. It is a top view which shows the flow of the cooling air output from the fan 500 in the server 100B which concerns on the 3rd Embodiment of this invention. (A) Top view of chamber 390 which concerns on the 4th Embodiment of this invention, (b) XX sectional drawing of (a), (c) YY sectional view of (a), (d) (A) Z1-Z1 sectional view taken on the line, (e) Z2-Z2 sectional view taken on the line (a). It is a schematic perspective view of the chamber 390 which concerns on the 4th Embodiment of this invention. In the server 100C which concerns on the 4th Embodiment of this invention, (a) sectional drawing which shows the flow of the cooling air output from the fan 500, (b) It is a top view. In the 4th Embodiment of this invention, it is a perspective view of (a) chamber 390B, (b) chamber 390C, (c) chamber 390D which has arrange | positioned the other arrangement | positioning member.

(First embodiment)
A first embodiment will be described. FIG. 1 shows an internal configuration diagram of an electronic apparatus according to the present embodiment. In FIG. 1, an electronic device 10 according to the present embodiment includes a cooling device 20, a heat generating member 30, a fan 40, and other electronic components, wiring, and the like that are not illustrated.

  The cooling device 20 is thermally connected to the heat generating member 30 and cools the heat generating member 30. The heat generating member 30 is an electronic component or the like in which a plurality of circuits are arranged on a substrate, and generates heat in accordance with the operation. The fan 40 outputs cooling air toward a condensing unit 60 described later of the cooling device 20.

  The cooling device 20 will be further described. In FIG. 1, the cooling device 20 includes a boiling unit 50, a condensing unit 60, a vapor pipe 70, a liquid pipe 80, and a refrigerant 90.

  The boiling part 50 is disposed on the heat generating member 30 and cools the heat generating member 30 by absorbing the heat of the heat generating member 30 to the liquid-phase refrigerant 90 stored inside. Moreover, in this embodiment, the boiling part container which comprises the boiling part 50 comprises the flow path which flows cooling air.

  The condensing unit 60 cools the refrigerant 90 in a gas phase state. The condensing unit 60 includes, for example, a plurality of tubular bodies (not shown) and a heat radiating body arranged along the longitudinal direction of the tubular bodies. The condensing unit 60 dissipates the heat of the gas-phase refrigerant 90 to the outside air through the radiator when the gas-phase refrigerant 90 passes through the tubular body. In the present embodiment, the condensing unit 60 uses metal flat fins as a heat radiator.

  The steam pipe 70 connects the boiling unit 50 and the condensing unit 60. The refrigerant 90 in a gas phase state in the boiling part 50 passes through the vapor pipe 70 and is transported to the condensing part 60.

  The liquid pipe 80 connects the condensing unit 60 and the boiling unit 50. The refrigerant 90 that has become a liquid phase in the condensing unit 60 passes through the liquid pipe 80 and is transported to the boiling unit 50.

  The refrigerant 90 is a medium having a low boiling point. The refrigerant 90 absorbs the heat of the heat generating member 30 in the boiling portion 50 and changes in phase from the liquid phase state to the gas phase state. The refrigerant 90 in the gas phase is transported to the condensing unit 60 via the vapor pipe 70. Further, the refrigerant 90 condenses as heat is dissipated to the outside air in the condensing unit 60, and the phase changes from the gas phase state to the liquid phase state. The liquid-phase refrigerant 90 is transported again to the boiling unit 50 via the liquid pipe 80.

  In the cooling device 20 configured as described above, the refrigerant 90 continues to circulate in the cooling device 20 without using a liquid pump, and the heat generated in the heat generating member 30 is radiated to the outside air, thereby cooling the heat generating member 30. To do. Further, since the cooling device 20 configured as described above constitutes a flow path in which the boiling part container of the boiling part 50 flows the cooling air, the cooling air discharged from the fan 40 is the flow path. And flows to the rear side of the cooling device 20. Therefore, when the cooling device 20 according to this embodiment is mounted on a thin electronic device, the cooling efficiency of the entire electronic device can be improved.

  The boiling part 50 of the cooling device 20 according to the present embodiment will be further described. 2A is a top view of the boiling part 50, FIG. 2B is a cross-sectional view of the boiling part 50 of FIG. 2A taken along the line XX, and FIG. FIG. 2C shows a cross-sectional view taken along line Y-Y. Moreover, the schematic perspective view of the boiling part 50 is shown in FIG. In FIG. 3, the position to which the steam pipe 70 is connected is indicated by a one-dot chain line.

  The boiling part container which comprises the boiling part 50 which concerns on this embodiment consists of the bottom face 51, the upper surface 52, the front surface 53, the rear surface 54, and the two side surfaces 55a and 55b, as shown in FIG. 2 and FIG. Fins 56 are disposed on the bottom surface 51, and the bottom surface 51 is disposed on the heat generating member 30. In addition, a liquid phase refrigerant 90 accumulates in the lower part of the boiling part 50. With this structure, the heat generating member 30 and the fins 56 are thermally connected via the bottom surface 51, and the liquid phase refrigerant 90 is heated by the heat transmitted to the fins 56 to change into a gas phase state.

  Moreover, the boiling part 50 which concerns on this embodiment is provided with the notch part 57 formed by cut | disconnecting in the surface containing the line segment on the upper surface 52 and the side surface 55b, as shown in FIG.2 and FIG.3. That is, the upper surface 52 of the boiling part 50 includes a triangular columnar cutout 57 extending in a predetermined direction from the front surface 53 side. The upper surface 52 of the boiling portion 50 includes an upper surface 52 a that is not in contact with the notch portion 57 and parallel to the bottom surface 51, and an upper surface 52 b that is in contact with the notch portion 57 and is inclined downward toward the side surface 55 b. Here, the upper surface 52a and the upper surface 52b constitute the upper surface portion of the claims, and the upper surface 52b corresponds to the first surface of the claims. The first surface is formed by forming a triangular prism-shaped cutout portion 57 extending in a predetermined direction from the front surface 53 side on the upper surface 52, and the cutout portion 57 constitutes the above-described flow path.

  In the cooling device 20 including the boiling part 50 configured as described above, the flow of the cooling air output from the fan 40 will be described. In FIG. 4, the flow of the cooling air output from the fan 40 in the boiling part 50 is indicated by an arrow. In the electronic device 10 illustrated in FIG. 1, the cooling air output from the fan 40 cools the condensing unit 60 of the cooling device 20 and then reaches the boiling unit 50. As shown in FIG. 4, the cooling air blocked by the front surface 53 of the boiling portion 50 passes through the cutout portion 57 of the upper surface 52 b and flows to the rear side of the boiling portion 50.

  As described above, in the electronic device 10 according to the present embodiment, the flow path is configured by forming the notch portion 57 on the upper surface 52 of the boiling portion 50 of the cooling device 20. With this configuration, the cooling air output from the fan 40 can flow in a predetermined direction by passing through the flow path formed by the cutout portion 57. Therefore, other heat generating members arranged in a predetermined direction of the cooling device 20 can be sub-cooled using the cooling air that cools the condensing unit 60 of the cooling device 20, and mounted on a thin electronic device. Even in this case, the cooling efficiency of the entire electronic device can be improved.

  In the present embodiment, the triangular columnar cutout 57 is formed on the upper surface of the boiling portion 50 by cutting along the plane including the line segment on the upper surface 52 and the side surface 55b. However, the present invention is not limited to this. The cutout 57 may be formed in the predetermined direction from the front surface 53 side on the upper surface 52. The example of the boiling part which formed the notch part of another shape is shown to Fig.5 (a)-(d).

  The boiling part 50B illustrated in FIG. 5A includes a notch that is in contact with only the front surface and the upper surface of the boiling part 50B. The boiling portion 50C shown in FIG. 5B includes two triangular prism-shaped notches. Moreover, the boiling part 50D shown in FIG.5 (c) has two notches which form a part of a cylinder by cut | disconnecting the boiling part 50D by two curved surfaces containing the line segment on an upper surface and two side surfaces, respectively. Part was formed. Furthermore, the boiling part 50E shown in FIG.5 (d) formed two rectangular parallelepiped notches.

  Each of the boiling parts 50B, 50C, 50D, and 50E shown in FIGS. 5A to 5D includes notches extending in a predetermined direction from the front side, and therefore reaches the boiling parts 50B, 50C, 50D, and 50E. The cooling air output from the fan 40 can be sent in a predetermined direction through the notches of the boiling portions 50B, 50C, 50D, and 50E.

  Here, in this embodiment, the vapor pipe 70 is connected to the upper side of the front surface 53 of the boiling part 50 and the liquid pipe 80 is connected to the lower side of the rear surface 54. However, the present invention is not limited to this. The vapor pipe 70 and the liquid pipe 80 can be appropriately connected to a desired surface of the boiling unit 50 according to the arrangement of the components in the electronic device 10. Examples in which the vapor pipe 70 and the liquid pipe 80 are arranged at various positions of the boiling part 50 are shown in FIGS.

  In the boiling part 50F shown in FIG. 6A, a steam pipe 70F is connected to the front of the upper surface of the boiling part 50F, and a liquid pipe 80F is connected to the lower part of the rear surface. The boiling part 50G shown in FIG. 6B is connected so that the vapor pipe 70G and the liquid pipe 80G face the same direction. The boiling part 50H shown in FIG. 6C is formed by connecting the vapor pipe 70H and the liquid pipe 80H so as to face in the same direction. In the boiling portion 50H, a large space is formed on the side where the vapor pipe 70H and the liquid pipe 80H are not connected among the end portions of the internal fins. Furthermore, the boiling part 50I shown in FIG. 6 (d) is connected so that the vapor pipe 70I and the liquid pipe 80I face in the same direction, and this boiling part 50I is connected to the end of the fin inside. A large space is formed on the side where the steam pipe 70I and the liquid pipe 80I are connected.

(Second Embodiment)
A second embodiment will be described. FIG. 7 shows an internal configuration diagram of a server that is an electronic apparatus according to the present embodiment. The server 100 according to the present embodiment is a 1U server, and in FIG. 7, the heat generating member 200, the cooling device 300, the electronic component 400, the cooling fan 500, and other electronic components, wiring, etc. (not shown) are arranged inside. .

  The heat generating member 200 is an electronic component in which a plurality of circuits and the like are arranged on a substrate. In the present embodiment, the heat generating member 200 includes a CPU 210 formed of a semiconductor or the like on a substrate. The CPU 210 generates heat with the operation.

  As shown in FIG. 7, the cooling device 300 includes a chamber 310 and fins 360 that constitute a boiling part, a vapor pipe 320, a liquid pipe 330, a condensing part 340, and a refrigerant 350, and cools the CPU 210.

  The chamber 310 is disposed on the CPU 210 and includes a plurality of fins 360 disposed therein with the refrigerant 350 and the interval d. The CPU 210 is cooled by transferring the heat of the CPU 210 to the refrigerant 350 in the liquid phase state through the plurality of fins 360. In the present embodiment, the chamber 310 forms a channel through which cooling flows by forming a notch in the upper surface. The chamber 310 will be described later.

  The steam pipe 320 connects the chamber 310 and the condensing unit 340. The refrigerant 350 in a gas phase state in the chamber 310 passes through the vapor pipe 320 and is transported to the condensing unit 340.

  The liquid pipe 330 connects the condensing unit 340 and the chamber 310. The refrigerant 350 that has become a liquid phase in the condensing unit 340 passes through the liquid pipe 330 and is transported to the chamber 310 again.

  The condensing unit 340 cools the refrigerant 350 in a gas phase state. In the present embodiment, the condensing unit 340 includes a plurality of tubular bodies (not shown) and a heat radiator stacked along the longitudinal direction of the tubular bodies. The condensing unit 340 dissipates the heat of the gas-phase refrigerant 350 to the outside air through the radiator when the gas-phase refrigerant 350 passes through the tubular body. In the present embodiment, the condensing unit 340 uses metal flat fins as a heat radiator.

  The refrigerant 350 is a medium having a low boiling point. The refrigerant 350 absorbs the heat of the CPU 210 in the chamber 310 and changes in phase from the liquid phase state to the gas phase state. The refrigerant 350 in the gas phase is transported to the condensing unit 340 through the vapor pipe 320. Further, the refrigerant 350 condenses by transferring heat to the outside air in the condensing unit 340, and changes in phase from a gas phase state to a liquid phase state. The liquid phase refrigerant 350 descends in the liquid pipe 330 due to gravity and is transported into the chamber 310 again.

  In the cooling device 300 configured as described above, the refrigerant 350 continues to circulate in the cooling device 300 without using a liquid pump or the like, and the heat generated by the CPU 210 is radiated to the outside air, thereby cooling the CPU 210.

  Returning to the description of FIG. The electronic component 400 is disposed on the lower side of the cooling device 300 opposite to the cooling fan 500 and generates heat in accordance with the operation. Hereinafter, the side on which the cooling fan 500 is disposed with respect to the cooling device 300 is referred to as “front side”, and the side on which the electronic component 400 is disposed with respect to the cooling device 300 is referred to as “rear side”.

  The cooling fan 500 is disposed opposite to the condensing unit 340 of the cooling device 300 and outputs cooling air toward the condensing unit 340 to mainly cool the condensing unit 340 with air. In the present embodiment, the cooling air discharged from the cooling fan 500 passes through a flow path formed by a notch formed in the chamber 310 of the cooling device 300 and is disposed on the rear side of the cooling device 300. The manufactured electronic component 400 is cooled.

  The chamber 310 of the cooling device 300 will be further described with reference to FIGS. 8A is a top view of the chamber 310 of the cooling device 300, FIG. 8B is a cross-sectional view of the chamber 310 of FIG. 8A taken along line XX, and FIG. 8C is FIG. It is sectional drawing which cut | disconnected the chamber 310 of a) by the YY line. FIG. 9 is a schematic perspective view of the chamber 310.

  As shown in FIGS. 8 and 9, the chamber 310 is a boiling part container including a bottom surface 311, a top surface 312, a front surface 313, a rear surface 314, and two side surfaces 315 a and 315 b. A discharge port 317 to which the steam pipe 320 is connected is formed above the front surface 313. On the other hand, an inflow port 318 to which the liquid pipe 330 is connected is formed below the rear surface 314.

  A plurality of fins 360 are disposed on the bottom surface 311 at intervals d in parallel with the side surfaces 315 a and 315 b of the chamber 310, and the bottom surface 311 is disposed on the top surface of the CPU 210. Further, a liquid phase state refrigerant 350 is accumulated in the lower portion of the chamber 310. With this configuration, the CPU 210 and the fins 360 are thermally connected via the bottom surface 311, and the liquid state refrigerant 350 is heated by the heat transmitted to the fins 360 and changes to a gas phase state.

  Note that it is desirable to connect the liquid pipe 330 so that the connection direction of the liquid pipe 330 is parallel to the longitudinal direction of the fin 360 and to arrange the fin 360 so that the central axis of the liquid pipe 330 does not face the fin 360. . Further, as shown in FIG. 8B, the distance L from the top of the fin 360 to the upper surface 312 is preferably larger than the distance d between the fins 360. Specifically, the distance L from the uppermost portion of the fin 360 to the upper surface 312 is desirably set to about 1.1 to 5 times the distance d between the fins 360. The refrigerant 350 increases in pressure due to a phase change between the fins 360, but the distance L from the top of the fins 360 to the upper surface 312 is configured to be larger than the distance d between the fins 360. , And moves toward the upper surface 312 having a large volume.

  8 and 9, the chamber 310 according to the present embodiment is cut along a plane including a line segment on the upper surface 312 of the chamber 310 and a line segment on each of the two side surfaces 315a and 315b. Thus, two triangular pyramid-shaped notches 316a and 316b are formed. The upper surface 312 includes an upper surface 312a inclined downward from the discharge port 317 to the end of the rear surface 314, and upper surfaces 312b and 312c inclined downward from the discharge port 317 toward the two side surfaces 315a and 315b.

  Here, the upper surface 372 corresponds to the upper surface portion of the claims, and the upper surfaces 312a, 312b, and 312c each correspond to the first surface of the claims. Further, the upper space of the upper surface 312a and the notches 316a and 316b constitute the above-described flow path. Further, as shown in FIG. 9, in this embodiment, the upper surfaces 312 a, 312 b, and 312 c constituting the upper surface portion are inclined upward toward the discharge port 317, respectively.

  Next, the cooling air output from the cooling fan 500 will be described. The flow of cooling air output from the cooling fan 500 is indicated by arrows in FIG. 10 (a) cross-sectional view and (b) top view.

  As shown in FIG. 10A, the cooling air output from the cooling fan 500 cools the condensing unit 340 of the cooling device 300 and then reaches the chamber 310. 10A and 10B, the cooling air flows along the notches 316a and 316b and the upper surface 312a formed above the front surface 313 of the chamber 310.

  At this time, since the upper surface 312a of the chamber 310 is inclined downward toward the rear surface 314 side, that is, the electronic component 400 side, the direction of the cooling air is bent downward along the upper surface 312a due to the Coanda effect related to the fluid. . Similarly, since the upper surfaces 312b and 312c of the chamber 310 are inclined downward from the discharge port 317 toward the two side surfaces 315a and 315b, the direction of the cooling air is obliquely downward along the upper surfaces 312b and 312c due to the Coanda effect. To be bent. Accordingly, the cooling air reaches the electronic component 400 disposed below the rear side of the chamber 310. Here, the Coanda effect is a property in which, when an object is placed in the vicinity of a viscous fluid flow, the direction of the fluid flow changes along the object.

  As described above, the server 100 according to this embodiment tilts the upper surface 312a of the chamber 310 of the cooling device 300 and forms the notches 316a and 316b so that the cooling air output from the cooling fan 500 can be obtained. Is guided to the rear side of the chamber 310 along the surface constituted by the upper surface 312a and the notches 316a and 316b. The cooling air for cooling the condensing unit 340 output from the cooling fan 500 can be applied to the cooling of the electronic component 400 disposed on the rear side of the cooling device 300. Therefore, the cooling device 300 is reduced in thickness. Even when mounted on an electronic device, the cooling efficiency of the entire electronic device can be improved.

  Furthermore, the server 100 according to the present embodiment inclines the upper surface 312a of the chamber 310 downward toward the rear surface 314 side (the electronic component 400 side) and the upper surfaces 312b and 312c downwardly incline toward the two side surfaces 315a and 315b, respectively. I let you. In this case, the direction of the cooling air output from the cooling fan 500 is bent along the upper surfaces 312a, 312b, and 312c of the chamber 310 due to the Coanda effect. Therefore, even when the height of the electronic component 400 disposed on the rear side of the cooling device 300 is lower than the height of the chamber 310, the electronic component 400 can be efficiently cooled.

  Here, when the upper surfaces 312 a, 312 b, and 312 c of the chamber 310 are inclined downward, that is, upwardly inclined toward the discharge port 317, the gas-phase refrigerant 350 can be efficiently collected at the discharge port 317. Specifically, the refrigerant 350 in a gas phase state in the chamber 310 increases in pressure, moves to a space having a larger space than between the fins 360, and reaches the upper surfaces 312a, 312b, and 312c. Since the upper surfaces 312a, 312b, and 312c are inclined upward toward the discharge port 317, the refrigerant 350 in the gas phase rises along the upper surfaces 312a, 312b, and 312c and is efficiently collected at the discharge port 317. . The gas-phase refrigerant 350 that has flowed into the discharge port 317 passes through the vapor pipe 320 due to a pressure difference and flows into the condensing unit 340. Therefore, the upper surface 312a, 312b, 312c of the chamber 310 is inclined upward toward the discharge port 317, whereby the refrigerant 350 can be circulated more smoothly.

  In the present embodiment, the upper surface 312 is inclined downward toward the rear, but is not limited thereto. The upper surface 312 may be inclined toward the direction in which the electronic component 400 is disposed. When the height of the electronic component 400 is higher than the height of the chamber 310 or when the electronic component 400 is disposed on the top plate of the server 100. The upper surface 312 can also be inclined upward toward the electronic component 400 side. In this case, in order to collect the refrigerant 350 in a gas phase at the discharge port 317, it is desirable to separately arrange a guide plate that is inclined upward toward the discharge port 317 inside the chamber 310.

  In the present embodiment, the discharge port 317 is formed above the front surface 313 and the inflow port 319 is formed below the rear surface 314. However, the present invention is not limited to this. The discharge port 317 and the inflow port 319 can be formed on an optimal surface of the chamber 310 according to the layout in the server 100.

  Furthermore, in the present embodiment, the upper surface portion of the chamber 310 is formed by the two notches 316a and 316b having a triangular pyramid shape, but the present invention is not limited to this. An example of a chamber provided with the upper surface part of another shape is shown to Fig.11 (a), (b), (c).

  The upper surface portion of the chamber 310B in FIG. 11A is composed of two conical cutout portions. In addition, the upper surface portion of the chamber 310C in FIG. 11B is configured by two triangular pyramid cutout portions formed partway along the side surfaces 315a and 315b and a triangular pyramid cutout portion reaching the rear surface 314. The Furthermore, the upper surface portion of the chamber 310D in FIG. 11C is composed of two cutout portions formed by cutting a part of the front surface 313 along a surface parallel to the bottom surface 311. These chambers 310B, 310C and 310D, like the chamber 310 of FIG. 9, allow the cooling air output from the cooling fan 500 to flow along the surface of the notch and send it to the rear side of the chamber 310. it can.

  Furthermore, the upper surfaces 312 of the chambers 310B, 310C, and 310D in FIGS. 11A, 11B, and 11C are inclined upward toward the discharge port 317. Therefore, the refrigerant 350 in the gas phase can be efficiently flowed into the discharge port 317.

(Third embodiment)
A third embodiment will be described. The server 100B according to the present embodiment has substantially the same configuration as the server 100 according to the second embodiment illustrated in FIG. That is, the heat generating member 200, the cooling device 300B, the electronic component 400, the cooling fan 500, and other electronic components and wiring (not shown) are arranged in the server 100B. In addition, the cooling device 300B according to the present embodiment includes a chamber 370 and fins 360, a vapor pipe 320, a liquid pipe 330, a condensing part 340, and a refrigerant 350 that constitute a boiling part. The difference between the server 100 </ b> B according to the present embodiment and the server 100 according to the second embodiment is that the server 100 </ b> B includes a chamber 370 instead of the chamber 310.

  Since the heat generating member 200, the electronic component 400, the cooling fan 500, the vapor pipe 320, the liquid pipe 330, the condensing unit 340, the refrigerant 350, and the fin 360 have the same functions as those described in the second embodiment, the details The detailed explanation is omitted.

  The chamber 370 will be described. 12A is a top view of the chamber 370 according to the present embodiment, FIG. 12B is a cross-sectional view of the chamber 370 of FIG. 12A taken along line XX, and FIG. A sectional view of the chamber 370 taken along line YY is shown in FIG. A schematic perspective view of the chamber 370 is shown in FIG.

  As shown in FIGS. 12 and 13, the chamber 370 is a boiling portion container including a bottom surface 371, a top surface 372, a front surface 373, a rear surface 374, and two side surfaces 375 a and 375 b. An inflow port 378 to which the liquid pipe 330 is connected is formed below the side surface 375a. In front of the front surface 373, as shown in FIG. 12A, an overhanging portion 380 including a discharge port 377 to which the steam pipe 320 is connected is disposed. The overhang portion 380 is a space where the fin 360 is not disposed. By forming the overhang portion 380, the refrigerant 350 that has become a gas phase between the fins 360 moves toward the overhang portion 380 having a volume larger than the distance between the fins 360, and is easily guided to the discharge port 377. In FIG. 13, the overhanging portion 380 is omitted.

  A fin 360 is disposed on the bottom surface 371, and the bottom surface 371 is disposed on the top surface of the CPU 210. Further, a liquid phase refrigerant 350 (not shown) is stored in the lower portion of the chamber 370. With this configuration, the CPU 210 and the fin 360 are thermally connected to each other through the bottom surface 371, and the liquid state refrigerant 350 is heated by the heat transmitted to the fin 360 to change into a gas phase state.

  Furthermore, as shown in FIGS. 12 and 13, the chamber 370 according to this embodiment is cut in a plane including a diagonal line on the upper surface 372 and a line segment on the front surface 373 and the side surface 375b, thereby forming a triangular pyramid shape. A notch 376 is formed. As shown in FIG. 13, the upper surface 372 of the chamber 370 includes an upper surface 372 a parallel to the bottom surface 371 and an upper surface 372 b inclined downward from the diagonal line of the upper surface 372 toward the front surface 373 and the side surface 375 b.

  Here, the upper surface 372 constitutes the upper surface portion of the claims, and the upper surface 372b corresponds to the first surface of the claims. The first surface is a slope of a triangular pyramid-shaped notch 376 formed by cutting the upper surface 372 with a surface including a line segment on the front surface 373 and the side surface 375b. A flow path is configured to flow.

  Next, the cooling air output from the cooling fan 500 will be described. The flow of the cooling air output from the cooling fan 500 is indicated by an arrow in FIG. As shown in FIG. 14, the cooling air output from the cooling fan 500 reaches the chamber 370 and then flows into the notch 376 from the front surface 373 side of the chamber 370, and the side surface 375 b along the upper surface 372 b due to the Coanda effect. Guided side down.

  Here, in this embodiment, since the upper surface 372a is arranged in parallel with the bottom surface 371, the cooling air flowing into the notch 376 hits the upper surface 372a and is guided downward on the side surface 375b side. Accordingly, the cooling air can be intensively guided in a desired direction, and the electronic component 400 can be effectively cooled.

  As described above, the server 100B according to the present embodiment forms the upper surface portion of the chamber 370 of the cooling device 300B by the notch 376, so that the cooling air output from the cooling fan 500 passes through the notch 376. , Guided to the side surface 375b side of the chamber 310 along the upper surface 372b. Furthermore, in this embodiment, since the upper surface 372a is disposed in parallel with the bottom surface 371, the cooling air strikes the upper surface 372a and is guided downward on the side surface 375b side. Therefore, the electronic component 400 can be effectively cooled by inclining the upper surface 372b toward the target electronic component 400.

  Since a part of the upper surface 372b of the chamber 370 is inclined upward toward the discharge port 377, the refrigerant 350 that has become a gas phase in the chamber 370 efficiently gathers at the discharge port 377. Therefore, the refrigerant 350 can be circulated smoothly.

  Here, the shape of the notch 376 can be appropriately designed according to the arrangement position, shape, and the like of the electronic component 400 to be secondarily cooled. Further, the discharge port 377 and the inflow port 378 can be formed at an optimal position of the chamber 370 according to the layout in the server 100B.

(Fourth embodiment)
A fourth embodiment will be described. In the server 100 </ b> C according to the present embodiment, the cooling device 300 </ b> C includes a chamber 390 instead of the chamber 310 in the server 100 according to the second embodiment. Since the heat generating member 200, the electronic component 400, the cooling fan 500, the vapor pipe 320, the liquid pipe 330, the condensing unit 340, the refrigerant 350, and the fin 360 have the same functions as those described in the second embodiment, the details The detailed explanation is omitted.

  The chamber 390 will be described. 15A is a top view of the chamber 390 according to the present embodiment, FIG. 15B is a cross-sectional view of the chamber 390 of FIG. 15A taken along the line XX, and FIG. A sectional view of the chamber 390 taken along line YY is shown in FIG. 15 (c), a sectional view of the chamber 390 taken along line Z1-Z1 in FIG. 15 (a) is shown in FIG. 15 (d), and FIG. FIG. 15E is a cross-sectional view of the chamber 390 taken along line Z2-Z2 in FIG. A schematic perspective view of the chamber 390 is shown in FIG.

  As shown in FIGS. 15 and 16, the chamber 390 is a boiling portion container including a bottom surface 391, an upper surface 392, a front surface 393, a rear surface 394, and two side surfaces 395a and 395b. In front of the front surface 393, an overhanging portion 380B including a discharge port 397 to which the steam pipe 320 is connected is disposed. In FIG. 16, the overhang portion 380B is omitted. An inflow port 398 to which the liquid pipe 330 is connected is formed below the rear surface 394.

  A fin 360 is disposed on the bottom surface 391, and the bottom surface 391 is disposed on the top surface of the CPU 210. Further, a liquid phase refrigerant 350 (not shown) is collected in the lower portion of the chamber 390. With this configuration, the CPU 210 and the fin 360 are thermally connected to each other through the bottom surface 391, and the liquid state refrigerant 350 is heated by the heat transmitted to the fin 360 to change into a gas phase state.

  Further, in the chamber 390 according to the present embodiment, as shown in FIGS. 15 and 16, the upper surface 392 is inclined downward from the front surface 393 side to the rear surface 394 side. Accordingly, as shown in FIGS. 15D and 15E, in the chamber 390 according to the present embodiment, the distance between the upper end of the fin 360 and the upper surface 392 becomes smaller as going backward.

  Furthermore, in the chamber 390 according to the present embodiment, as shown in FIGS. 15 and 16, a quadrangular pyramid-shaped arrangement member 399 is arranged on an upper surface 392 that is inclined downward. In FIG. 15D and FIG. 15E, the proportion of the arrangement member 399 on the upper surface 392 increases toward the rear of the chamber 390. By disposing a quadrangular pyramid-shaped disposing member 399 on an upper surface 392 that is inclined downward toward the rear surface 394, a region 396 constituting a flow path for flowing cooling air is formed above the chamber 390. The upper surface 392 corresponds to the upper surface portion of the claims, and the upper surface 392 in contact with the region 396 and the side surface of the arrangement member 399 correspond to the first surface of the claims.

  Next, the cooling air output from the cooling fan 500 will be described. The flow of the cooling air output from the cooling fan 500 is indicated by an arrow in FIG. 17 (a) cross-sectional view and (b) top view. As shown in FIGS. 17A and 17B, the cooling air output from the cooling fan 500 and reaching the chamber 390 branches along the left and right side surfaces of the arrangement member 399 and flows.

  Here, since the upper surface 392 is inclined downward from the front surface 393 side to the rear surface 394 side and the two side surfaces of the quadrangular pyramid-shaped arrangement member 399 extend from the center of the chamber 390 toward the left and right end portions, Is bent to the lower right side and lower left side of the chamber 390 by the Coanda effect. Therefore, due to the Coanda effect, the cooling air flowing to the right rear and left rear of the chamber 390 can efficiently cool the electronic components 400B and 400C disposed on the right rear and left rear of the chamber 390.

  Furthermore, in this embodiment, the upper surface of the arrangement member 399 is inclined upward from the front side toward the rear side. In this case, the cooling air that has flowed into the upper surface of the placement member 399 hits the top plate of the server 100 </ b> C and returns to the lower side of the placement member 399. Accordingly, as shown in FIG. 17B, the cooling air is guided in the direction of the electronic components 400B and 400C, and the electronic components 400B and 400C can be intensively cooled.

  On the other hand, in this embodiment, the upper surface 392 is inclined downward from the front surface 393 side to the rear surface 394 side, that is, upwardly inclined toward the discharge port 397. In this case, the refrigerant 350 that has become a gas phase in the chamber 390 moves upward and reaches the inner surface of the upper surface 392, and is then efficiently collected at the discharge port 397 along the inner surface of the upper surface 392. The gas-phase refrigerant 350 that has flowed into the discharge port 397 passes through the vapor pipe 320 due to the pressure difference and flows into the condensing unit 340. Therefore, the cooling device 300C according to this embodiment can smoothly circulate the refrigerant 350.

  As described above, the chamber 390 according to the present embodiment has the cooling fan 500 by disposing the quadrangular pyramid-shaped disposing member 399 on the upper surface 392 inclined downward from the front surface 393 side to the rear surface 394 side. The cooling air output from can be made to flow along the side surface of the arrangement member 399. That is, by inclining the upper surface 392 and the side surfaces of the arrangement member 399 in a desired direction, the cooling air can be guided in a desired direction using the Coanda effect. Therefore, it is possible to efficiently cool the electronic components 400B and 400C arranged at predetermined positions using the cooling air for cooling the condensing unit 340 output from the cooling fan 500.

  Furthermore, by inclining the upper surface 392 of the chamber 390 upward toward the discharge port 397, the refrigerant 350 in the gas phase can be efficiently guided to the discharge port 397, and the refrigerant 350 can be circulated smoothly.

  Therefore, the server 100C according to the present embodiment can improve the cooling efficiency of the entire server 100C by mounting the cooling device 300C therein.

  In the present embodiment, the region 396 is formed by disposing the quadrangular pyramid-shaped disposing member 399 on the upper surface 392 inclined downward from the front surface 393 side to the rear surface 394 side, but the present invention is not limited to this. The arrangement member arranged on the upper surface 392 can be appropriately designed depending on the arrangement position and height of the electronic components 400B and 400C arranged on the server 100C. An example of a chamber in which other arrangement members are arranged is shown in FIGS. 18 (a), (b), and (c).

  In the chamber 390B of FIG. 18A, a quadrangular pyramid-shaped disposing member is disposed on one region bordered by a diagonal line on the upper surface. In the chamber 390C of FIG. 18B, an arrangement member having a trapezoidal curved surface is arranged at the center of the upper surface. Furthermore, the chamber 390D of FIG. 18C is obtained by disposing a quadrangular pyramid-shaped disposing member having a trapezoidal cross section at the center of the upper surface.

  In the chambers 390B, 390C, and 390D shown in FIGS. 18A, 18B, and 18C, a space for allowing cooling air to pass is formed by disposing the disposing member 399 on the upper surface 392. . Further, by tilting the upper surface of the arrangement member 399 upward, the cooling air output from the cooling fan 500 can be efficiently guided in a desired direction. Further, since the upper surfaces 392 of the chambers 390B, 390C, and 390D are all inclined upward toward the discharge port 397, the refrigerant 350 that has become a gas phase in the chambers 390B, 390C, and 390D is placed on the inner surface of the upper surface 392. And can be efficiently collected at the discharge port 397. Therefore, the refrigerant 350 can be circulated smoothly.

  While the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. Any design change or the like within a range not departing from the gist of the present invention is also included in the present invention.

DESCRIPTION OF SYMBOLS 10 Electronic device 20 Cooling device 30 Heat generating member 40 Fan 50 Boiling part 51 Bottom surface 52 Upper surface 53 Front surface 54 Rear surface 55a, 55b Side surface 56 Fin 57 Notch 60 Condensing part 70 Steam pipe 80 Liquid pipe 90 Refrigerant 100, 100B, 100C Server 200 Heat generation Member 210 CPU
300, 300B, 300C Cooling device 310, 370, 390 Chamber 311, 371, 391 Bottom surface 312, 372, 392 Top surface 313, 373, 393 Front surface 314, 374, 394 Rear surface 315a, 315b, 375a, 375b, 395a, 395b Side surface 316a 316b, 376 Notch 317, 377, 397 Discharge port 318, 378, 398 Inlet port 320 Vapor pipe 330 Liquid tube 340 Condensing part 350 Refrigerant 360 Fin 380, 380B Overhang part 396 Area 399 Arrangement member 400 Electronic component 500 For cooling fan

Claims (7)

Refrigerant,
A boiling part that absorbs heat by changing the phase of the refrigerant from a liquid state to a gas phase; and
A condensing unit that radiates heat by changing the phase of the refrigerant from a gas phase to a liquid phase; and
A pipe connecting the boiling part and the condensing part;
With
The boiling part container constituting the boiling part is:
An upper surface portion, and an arrangement member that is arranged on the upper surface portion and extends in a predetermined direction,
By flowing along the first surface cooling air for cooling the condenser portion is formed by the surface of a part and the placement member of the top portion, it constitutes a flow path for flowing the cooling air,
The arrangement member includes a surface inclined upward.
Cooling system. The pipe includes a vapor pipe that transports the refrigerant from the boiling section to the condensing section, and a liquid pipe that transports the refrigerant from the condensing section to the boiling section,
The cooling device according to claim 1, wherein the upper surface portion includes a surface that is inclined with a connection portion side with the steam pipe as an upper side. The boiling part includes a plurality of fins arranged inside the boiling part container,
The cooling device according to claim 1 or 2 , wherein a distance between an upper end of the fin and the upper surface portion is larger than an arrangement interval of the plurality of fins. The condensing part is
A tubular body through which the refrigerant flows;
A plurality of radiators disposed around the tubular body;
The provided cooling device according to any one of claims 1 to 3. A first heat generating member that generates heat during operation, a cooling device, and a fan;
The cooling device is
Refrigerant,
A boiling part that absorbs heat by changing the phase of the refrigerant from a liquid state to a gas phase; and
A condensing unit that radiates heat by changing the phase of the refrigerant from a gas phase to a liquid phase; and
A pipe connecting the boiling part and the condensing part;
The boiling part container constituting the boiling part includes an upper surface part, and an arrangement member arranged on the upper surface part and extending in a predetermined direction, and the cooling air for cooling the condensing part is the upper surface part. A flow path for flowing the cooling air by flowing along a first surface formed by a part of the surface of the arrangement member and the surface of the arrangement member, and the arrangement member includes a surface inclined upward ,
The fan is arranged to face the condensing unit and outputs the cooling air.
Electronics. A second heat generating member that generates heat in accordance with the operation;
The second heat generating member is disposed in the flow path.
The electronic device according to claim 5 . The condensing part is
A tubular body through which the refrigerant flows;
A plurality of radiators disposed around the tubular body;
An electronic apparatus according to claim 5 or 6, comprising:

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