TWI359971B - Manufacturing method of lcd panel - Google Patents

Description

1359971 -m 7.-^8- Years of the month ^ IX. Description of the invention: [Technical Field of the Invention] The present invention relates to a method of manufacturing a liquid crystal panel. More specifically, it relates to the positional control of the pattern when various patterns are formed on the substrate constituting the liquid crystal panel. [Prior Art] In the manufacturing process of a liquid crystal panel, increasing the pixel aperture ratio of the panel is often an important issue. In particular, recently, in order to suppress the manufacturing cost of a liquid crystal display, a low-priced backlight panel has been used, and the demand for a pixel aperture ratio has become strict. In order to increase the pixel aperture ratio, it is necessary to thin the black matrix of the filter substrate constituting the liquid crystal panel. However, among the elements constituting the filter substrate, there are elements which have to be disposed in the line width of the black matrix. With the thinning of the black matrix, the configuration of the aforementioned components is required to have a very high positional accuracy. The formation of each element constituting the liquid crystal panel is generally performed by exposure using a mask (see, for example, Patent Document 1). However, in the exposure of the surface using the reticle, it is easy to cause variations in the pattern position, and it is only possible to increase the influence of the positional deviation of the line width of the black matrix. Therefore, the thinning of the black matrix is difficult in terms of element formation by surface exposure. In recent years, there has been proposed a method of performing substrate exposure using a digital exposure device. For example, Patent Document 2 mentions a digital exposure apparatus capable of correcting a deviation in recording position of an image when the recording medium is skewed. [Patent Document 1] JP-A-2002-350897, No. 1,359,971 100. 7. 2-8----------------------, I Niu Yuejun|_眷 眷 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 2005 The size of the treated glass substrate has exceeded two meters. When the substrate becomes large, the amount of deformation of the glass cannot be ignored even with slight temperature changes. For example, even a glass substrate having a lower coefficient of thermal expansion of 32 e 〃 / ° C has a change in size of 0.1 m under a temperature change of 0.15 degrees as long as there is a glass of two meters. In the process of forming a pattern by exposure to a layer, if such a temperature change occurs, the formed pattern is deviated, and the yield of the product is deteriorated. The device mentioned in Patent Document 2 defines a region on a substrate based on a positioning mark provided on a substrate, and corrects the deviation of the recording position by correcting the image recorded in each region. However, in the case where a pattern is formed at a high density on a large substrate, the position at which the positioning marks are recorded is limited to some extent. Therefore, by arranging the area specified by the symbol, it does not necessarily become an appropriate size field for the unit area for correction. Therefore, the present invention is capable of accurately controlling the exposure position in the liquid crystal panel manufacturing process in which a pattern is formed on a large substrate at a high density, and even if the thinning of the black matrix does not cause the aperture ratio of the liquid crystal panel due to the positional deviation of the pattern. reduce. In addition, it is possible to prevent a decrease in yield due to positional deviation. (Means for Solving the Problem) 1359971 -.-• H --- *...... Year Month Day_Position Replacement Page| —— * The method for manufacturing a liquid crystal panel of the present invention is characterized in that at least a liquid crystal panel is to be formed A construction element is formed by a procedure comprising the following three steps. The first step is a substrate reading step of reading a plurality of objects existing on the substrate and capturing the position coordinates of the respective objects, and the second step is to indicate that the structural elements are to be formed. The image of the pattern, that is, the image of the area recorded in the area specified by the position of the plurality of objects, and the image correction step corrected according to the position coordinates obtained in the substrate reading program; the third step is that the image is corrected according to the composition The number of pixels of the area image corrected in the step is controlled by the image in the area specified by the position coordinates obtained by the substrate reading step by opening and closing the light beam of the scanning substrate. The image recording step of the area image corrected by the step. Specifically, the structural element is a columnar spacer formed on a color filter substrate constituting the liquid crystal panel, a liquid crystal alignment control material, and further a channel portion of the thin film transistor formed on the array substrate, Source portion and/or drain portion, contact hole portion, and the like. Further, the object to be read in the substrate reading step may be an array alignment mark formed by positioning, or may be a structural element for reading a display portion constituting the liquid crystal panel. Advantageous Effects of Invention According to the method for manufacturing a liquid crystal panel of the present invention, when forming each element constituting the substrate, a plurality of positions on the substrate are photographed, and an actual position coordinate of the mark or the pattern existing at the position is obtained, and the position is matched. The deviation deforms or moves the image on which the exposure is recorded on the substrate. Therefore, it is possible to control the gap formed on the black matrix with high accuracy, and to replace the page 丨 _ _ _ _ The location of each component. In particular, if it is possible to recognize not only the alignment marks formed on the end portions of the substrate for the purpose of positional reference but also the black matrix of the color filter substrate or the gate electrode of the array substrate, the alignment marks can be omitted. The interval is set, and the position reference is made in units of small areas, and the position reference can be often performed in units of an appropriate size area regardless of the substrate size or the size of the product panel. [Embodiment] Hereinafter, a method of manufacturing a TFT liquid crystal panel will be described according to an embodiment of the present invention. Fig. 1 shows a summary of the manufacturing process of the liquid crystal panel. The liquid crystal panel is a color filter substrate manufactured in the color filter substrate manufacturing program 1 and a TFT array substrate manufactured in the array substrate manufacturing program 2, and is bonded in the liquid crystal cell manufacturing program 3. The way to manufacture. In the color filter substrate manufacturing program 1 and the array substrate manufacturing program 2, a color filter structure or a TFT array structure in which a plurality of product panel sheets are formed is usually formed on a single transparent substrate. For example, the color filter substrate 4 shown in Fig. 2 is a color filter structure 5 in which 16 numbers of 20-inch liquid crystal panels are formed on a transparent substrate having a width of about two meters. On the transparent substrate, in addition to the color filter structure 5, marks 6a, 6b, 6c, 6d'6e'6f, 6g indicating main positions (four corners, a center, etc.) on the substrate are formed. 6h and 6i. In the same manner as in the TFT array substrate manufacturing process 2, a liquid crystal panel 1359971 100.-7 is formed on a transparent substrate: ^8-----------I is replaced by a cow ;

j · __I The array structure of several pieces, and the mark indicating the position on the substrate. The color filter substrate and the TFT array substrate are divided into product sizes in the liquid crystal cell manufacturing process 3 before the substrates are bonded to each other or after bonding, thereby completing the liquid crystal panel. Hereinafter, the color filter substrate manufacturing program 1 will be described. Fig. 3 is a detailed flow chart showing the procedure 1 for manufacturing the color filter substrate. The color filter substrate is manufactured by forming the elements shown in the respective steps of the flowchart of Fig. 3 on the substrate. As the transparent substrate, a well-known glass plate such as a soda glass plate having a yttria-coated film on the surface, a low-expansion glass plate, an alkali-free glass plate, and a quartz glass plate, or a plastic film can be used. As shown in the figure, in the color filter substrate manufacturing program 1, first, a black matrix is formed on a transparent substrate (S101). 4A and 4B are views showing a part of the substrate after the black matrix forming process in step S101 is enlarged. Fig. 4A shows the upper surface of the substrate, and Fig. 4B shows the cross section of the substrate. Both of the figures show areas corresponding to the number of pixels of the liquid crystal panel. As shown in Figs. 4A and 4B, in the present embodiment, in step S101, a black matrix pattern 8 having a film thickness of 0.5 to a degree is formed. The black matrix pattern 8' is a plurality of lines extending in parallel in one direction (the vertical direction of the figure), a short line slightly smaller than the line perpendicular to each line in the direction of each line, and a shorter line, formed in A configuration that alternately protrudes at intervals of about 150 in the vertical direction. In this configuration, a pattern of one pixel amount will form a three-row pattern of .E as an English letter. 1359971 脉 7: Miao----------------- i year and month ii® is replacing poverty 1 -- -------- as described later 'in this embodiment In the photosensitive resist containing a black pigment such as graphite black, the black matrix pattern 8 is formed by being subjected to exposure and development into the aforementioned shape. However, the method of forming the black matrix, the pattern shape and the material in the present invention are not particularly limited, and any well-known technique can be used. For example, as described in Japanese Laid-Open Patent Publication No. 2004-361447, a black matrix composed of a photosensitive composition containing metal fine particles can be formed. Further, in the present embodiment, the symbols 6a to 6i shown in Fig. 2 are formed simultaneously with the black matrix pattern 8. That is, the predetermined place ' of the black photosensitive resist' is exposed to the cross-shaped pattern shape shown in Fig. 2. Next, an R (red) colored pixel layer (S102) is formed on the transparent substrate 7. As shown in FIGS. 5A and 5B, the R pixel pattern 9 is formed by a ratio of one line per three lines between the plurality of lines extending in parallel in the black matrix pattern 8 on the transparent substrate 7. . The material of the r pixel pattern 9 is a photopolymerizable compound which is composed of a photopolymerizable monomer or oligomer as a main component of a red coloring agent such as a pigment component and a binder. And other materials. The R pixel pattern 9 is formed by subjecting the above material to exposure and development to process the aforementioned shape. At this time, in the present embodiment, the black matrix pattern 8 and the marks 6 a to 6 i formed in the step S 1 0 1 are observed before the exposure processing. Next, the area where the colored pixel pattern 9 is formed is determined based on the observed pattern. The position reference based on the observation pattern will be described later. Then 'use a material containing green colorant, blue colorant, borrow -10- 1359971 iOO. 7. ------------------... In the same manner, a G (green) colored pixel layer and a B (blue) colored pixel layer are formed on the row of the colored pixel layer in which R is not formed (S103, S104). On Figs. 6A and 6B, The state in which the G pixel pattern 10 and the B pixel pattern 1 1 are formed is displayed. Further, the material of the colored pixel pattern is not particularly limited, and any material known as a material of the color furnace sheet can be used, and it can be used for a position to be described later. In the pattern observation, it is easier to observe the material having higher light transmittance. After forming the colored pixel layer of three colors, a protective film 13 made of a transparent resin covering the pixel colored layer is formed (S105). Further, a transparent electrode 14 (ITO: Indium Tin Oxide) is formed thereon by sputtering (S106). In the present embodiment, the protective film 13 is approximately l#m, and the thickness of the transparent electrode 14 is approximately 800A. For each of the above layers, a well-known protective film or a material of a transparent electrode may be used, which will be described later. When the pattern for reference is observed, the more transparent the material is, the easier it is to observe. Next, the spacer 1 2 (S 1 0 7 ) is formed on the transparent electrode 14. The spacer 1 2 is The interval 'which can control the degree of the gap of the liquid crystal cell on average is overlapped with the line of the black matrix pattern 8. In the present embodiment, as shown in FIGS. 6A and 6B, around the R pixel pattern 9 is surrounded. A rectangular spacer 1 having a height of about 2 to 4 /zm disposed at an intersection of a horizontal line and a vertical line of a short E-type black matrix pattern formed by the like. The spacer 12' is made of a well-known photosensitive resin. It is preferable to use a transparent resin as the material of the spacer 1 2 by exposure and development. In the present embodiment, a material having low light transmittance can also be used. In the present embodiment, at 1359971 Μ 7 ... 28___________________________________ • ' i 牛月曰 _ positive replacement page: *___i ' Before the exposure process, by observing the black matrix pattern 8 and the symbol 6 formed in step S101, the spacer can be correctly arranged in black Moment Further, as a spacer for controlling the gap of the liquid crystal cell, a spacer ball which is spherically dispersed on the substrate in the liquid crystal cell manufacturing process is known, and as described above, In the color filter substrate manufacturing program 1, a columnar element formed by exposing a predetermined position on a substrate is referred to as a spacer. Next, an alignment control material (rib) is formed on the transparent electrode 14. (S108). Fig. 7A and Fig. 7B show the state of the substrate after the alignment control material is formed. In the present embodiment, the alignment control material is a plurality of linear patterns which are formed in parallel in one direction on the colored pixel patterns 9, 10 and 11, as shown in Fig. 7A, and are slightly oriented in this direction. The plurality of linear patterns formed in parallel in the vertical direction are formed. Further, the linear pattern 15 is a projection having a height of about the right as shown in Fig. 7B. After the color filter substrate is bonded to the array substrate, the projection pattern aligns the liquid crystal molecules of the liquid crystal cell in a predetermined direction. As the material of the alignment control material, a known transparent photosensitive resin can be used. Further, even in the forming process of the alignment control material, the observation of the black matrix pattern 8 and the mark 6 formed in the step S 1 0 1 can be performed. Further, it is also possible to cooperate with the observation of the previously formed spacer 1 2 . Then, when the linear pattern 15 is formed, the position at which the pattern is formed is adjusted based on the position of the observed pattern or the like. As described above, in the present embodiment, a color filter substrate -12- 1359971 牛月曰1 meal ^ replacement page will be formed:

Each of the structural elements of J 4 is formed by exposure and development. Therefore, the order of formation of the structural elements produced by exposure development will be described below. Fig. 8 is a flow chart showing the black matrix forming procedure of step S101 of Fig. 3. First, the transparent substrate is washed (S201), and a black negative-type photosensitive resist (S2〇2) is applied to the entire substrate after cleaning or to a region where the color filter structure is formed. Next, the resist material is baked at a suitable temperature (prebaking: S2 〇 3), and the smeared resist layer is exposed to the shape of a black matrix pattern. The exposure is performed by using a digital recording of a DMD exposure apparatus to be described later (S204). Specifically, a double-turn image in which a black matrix pattern is displayed is generated. According to the number of pixels of the double-twist image, the position of the pixel corresponding to the number of pixels is exposed, corresponding to a pixel having a number of 0. The position is not exposed to light, and the illumination of the substrate is controlled. Next, the exposed substrate is developed (S205). In the present embodiment, since the resist is a negative-type resist, the exposed portion remains as a pattern on the substrate. This pattern is again baked (post-baked) and fixed on the substrate (S206). By the above steps, the green matrix pattern 8 described with reference to FIGS. 4A and 4B is formed. Fig. 9 is a view showing an R pixel forming program (S1〇2), a G pixel forming program (S1 0 3 ), a B pixel forming program (S ! 〇 4), and a spacer forming program (S 1 0) in Fig. 3; 7) A flow chart of a component forming program common to the alignment control material forming program (s 1 〇 8 ).

First, the substrate after patterning is washed (S301). For example, in R 1359971 100. Niu Yuezhen 4) is replacing the substrate of the Gongga pixel forming process after washing the tantalum matrix. Further, in the alignment control material forming program, the substrate on which the black matrix pattern, the colored pixel layer, and the spacer are formed is washed. Next, a resist (S3 02) which becomes a material for forming the element is applied. In the present embodiment, a negative-type photosensitive resist is applied. Next, baking is performed using a suitable temperature corresponding to the resist material (prebaking: S 3 0 3 ). Thereafter, in order to superimpose the pattern formed on the lower layer and the pattern formed next, the substrate is read (S304) and the image is corrected (S305). This type of processing will be described later. Next, the applied resist is exposed to a pattern shape drawn on the corrected image (S 3 06). The exposure was carried out in the same manner as the formation of a black matrix pattern by using a digital recording of a DMD exposure apparatus. Then, the exposed substrate is developed (S307), and the pattern is left on the substrate after development, and the pattern is again baked (post-baked) and fixed on the substrate (S308). By the above steps, a pattern of each element is formed. Hereinafter, the processing for referring to the position of the pattern, that is, the substrate reading processing in step S304 and the image correction processing in step S305 will be described. The substrate reading process of step S3 04 is to obtain an image obtained by exploratory imaging of the surface of the substrate, and to identify the symbol 6 shown in FIG. 2 or a predetermined pattern formed on the substrate, and obtain the mark after recognition. And the processing of the position coordinates in the established coordinate system of the pattern. The identification of the symbols and the patterns can be performed using all known image recognition methods. In the present embodiment, the pattern comparison method is used for identification. -14- 1359971 μ 7. 28..................... -- yak month replacement page j --! * For example, when the position coordinates of the mark are obtained, In the black matrix forming program S101, a camera is placed at the position of the recording mark 6 to photograph the surface of the substrate. Then, from the center of the photographic image, an area image corresponding to the size of the symbol 6 is cut out, and the image of the area is used for object recognition. If the substrate is not stretched in the program after the program in which the mark 6 is recorded, since the mark 6 exists in the image of the area, the recognition result by the pattern control should be identical. In this case, the coordinates of the center position of the image of the area are obtained as the position coordinates of the current symbol 6. On the other hand, if the substrate is stretched and contracted in the program after the program in which the symbol 6 is recorded, since the symbol 6 is present at a position slightly deviated from the center of the photographic image, the recognition result by the pattern comparison will not occur. Consistent. In this case, the area image is slightly shifted in the photographic image until the comparison result is matched, and the center coordinates of the area image when the comparison result is matched are obtained as the position coordinates of the current symbol 6. Further, when the position coordinates of the pattern formed on the substrate are obtained, the position at which the image is captured on the position coordinates is determined in advance, and the camera is placed at the position to photograph the surface of the substrate. Fig. 10 is a view showing an example of the relationship between the pattern formed on the reading target substrate and the photographing position. The photographing positions are respectively set in a plurality of places in the vertical direction and the horizontal direction of the substrate, and the adjacent photographing positions are the photographing positions 1 6 a, 16b, 16c, and 16d shown in Fig. 10 It is determined by the apex of the rectangle. In the present embodiment, the photographing position is determined such that the length of one side of the rectangle is 30 cm. -15- 1359971 ❹ &" * ***·*****"' * ·_-. <··. i Niuyue. Replacement page丨

L : _I The pattern 'recorded at each photographing position can be specified by the coordinates of the photographing position. Therefore, from the photographic image, the 'specific pattern is recognized, and the position coordinates of the pattern are obtained. Specifically, in the photographic image, an area image corresponding to a specific pattern size is cut out, and the area image is used for object recognition by the pattern comparison. As long as the substrate does not expand and contract in the program after the program recorded by this pattern, since the recognized pattern will exist in the image of the area, it should be consistent with the recognition result by the pattern. In this case, the coordinates of the center coordinates of the area image or the features (vertex, etc.) of the pattern are obtained as the current position coordinates of the pattern. On the other hand, if the substrate is stretched and contracted in the program after the program in which the mark is recorded, the pattern to be recognized may exist at a position slightly deviated from the center of the photographic image, and the pattern is compared. The results will not be consistent. For example, in the photographing position 1 6 a of the first drawing, it is preliminarily assumed that there is a pattern indicated by a solid line in Fig. 11 and then photographing and pattern matching are performed. If the actual pattern shifts to the position indicated by the broken line in Fig. 11 when the substrate is stretched and contracted, the recognition result of the pattern comparison with the area image centered on the photographing position 16 a is inconsistent. In this case, in the photographic image, the region image is repeatedly shifted to repeat the pattern control until the comparison result is consistent, and the center coordinates of the region image when the comparison result is coincident, or the feature portion (vertex, etc.) of the pattern The coordinates 17 are obtained as the current position coordinates of the pattern. Further, in the procedure after step S103, since the colored pixel layer exists in the pattern in which the formation is completed, in addition to the comparison of the pattern shape, 1359971 Μ 7. 28 a 牛 月 癃 癃 正 替换 替换 替换 i i ! ! ! ! ! ! ! ! ! ! For color comparison. Alternatively, the shape is not recognized, but the pattern is recognized only by color. For example, in the present embodiment, as shown in FIG. 6A, the spacers 1 2 are formed only on the black matrix of the row of the R pixel patterns 9 'not formed in the G pixel pattern 1 〇 and the b pixel pattern n On the black matrix. In this case, in the substrate reading processing S 3 4 0 in the spacer forming program S107, the comparison of the color information is performed, and the pattern recognition becomes easy. Next, the image correction processing of step S3 〇 5 will be described with reference to Figs. 12 and 13 . The image correction processing of step S305 is based on the information of the position coordinates acquired in the substrate reading processing of step S3〇4, and the processing of correcting the double-twisted image recorded on the substrate is performed in the subsequent step S306. In the present embodiment, the image is corrected based on the predetermined position of the black matrix pattern 8 and the position coordinates of the symbol 6. For example, as a result of pattern recognition of the photographing positions 16a, 16b, 16c, and 16d in Fig. 10, a pattern shift as in the case of Fig. 1 is observed at each photographing position. Then, from this observation, the areas where the positions 16a, 16b, 16c, and 16d are vertices, and the rectangular area which should be the one shown in Fig. 12(a), actually become the 12th ( b) The skewed area as shown in the figure. In this case, the rectangular image recorded in this rectangular area is combined with the observed skew deformation into a skewed image. The deformation of the image shortens the interval between the photographing positions. In other words, the shorter the unit area when the image is deformed, the more faithful the deformation can be made to the actual skew. However, in the case where the manufacturing efficiency is prioritized, it is preferable to correct the image by using a certain wide area as a unit area. 1359971 For example, as shown in Fig. 1, if the position of the four symbols in the second figure is the rectangular area fi unit area of the vertex, there can be nine field months in one substrate. The image correction can be performed on the four regional images, and the processing time will be shorter. However, the symbol shown in Fig. 2 does not form a pattern for the function of the gray panel, and is also in the display region of the liquid crystal panel. Therefore, in the case where the manufacturing size is small, the positional positional accuracy is performed using only the mark, but if the panel size is large, the reading of the black matrix pattern 8 is not sufficient. Therefore, it is preferable to determine the position coordinates of the black matrix pattern only by acquiring the object of the position coordinate, and to appropriately determine the size and the size of the seesaw according to the manufactured size. Of course, both the number and the black matrix pattern are compared in position. In the case of a rectangular image in which a rectangular image is suitable for skewing, for example, the following method can be considered. The rectangle ABCD ' is taken as the point X in the image ABCD. Further, the poor obtains the square area as the A, Β, C, D, and ^ punctuation points as X ′. The point in which the edge A'B' is divided into t:(lt) is taken as <3, and the point of 1 (1-〇 is divided into the relationship of |1 in the 11' line 〇11 to 3:(1-8) Formula (1) will be established. 100.· 1; -2 ^----------------- 年年月曰1 吏吏^ Replacement page: 1——-__I , Symbols 6 a to 6 i F are photographed for image correction, and the positional comparison is used. As the liquid crystal t, it is impossible to form the ruler I of the J liquid crystal panel, and sufficient F is obtained, and there is a difference in positional accuracy. The $ mark or the liquid crystal panel can also be used as the image by using the t-shaped image to be deformed by the position coordinate 的 in the region of the seat D'C' is divided into U 乍 X, 1359971 100. 7. 28 Niuyue W full [Relationship 1]

G = t(l-A)+A H = t(c-D)+D ...

P = s(H-G)+G

= st(CDB + A)+s(DA)+t(BA)+A With this relation (1), the following equations (2) can be derived. By solving this equation, you can find t and s. . Ast + bs + ct= d fst + gs + ht=e ".(2) (However, a, b, c, d, e, f, g, h are constants) Then, using the obtained t and The s 値, also by the inner division of the square area A'B'C'D' after the rectangular image ABCD is skewed, finds the point X in the rectangular image ABCD corresponding to the point X' in the square area 塽. The 値 of the pixel located at the point X ′ in the square area is determined by the 位于 at the pixel of this point X. The same processing can be performed for all the coordinate points existing on the boundary line of the square area A ′ B ′ C ′ D ′ and the inside, and the 像素 of the pixels constituting the square area A’B'C'D' can be determined. Thereby, an image of the shape and size of the square area A ' B ' C ' D ' can be obtained. Further, it is also conceivable to perform processing of transform processing such as affine transformation or linear transformation. An affine transformation is a method of deforming a pattern by a combination of linear transformation and parallel movement. The relationship between the coordinates (x, y) constituting the point of the original figure and the point (X, Y) constituting the point of the deformed figure is described by the following formula (3). X=ax+by+c Y = dx + ey + f ... ( 3 ) The mark read by the color filter substrate and the black matrix pattern -19 - 1359971 ❹. > _ ί ιΙ &gt ; ιι 1 a * I year month 曰 correction replacement buy 丨

, i___I is marked with this; when the symbol and the coordinate at which the pattern should originally be located (the coordinate at the time of formation) are brought into the equation (3), six expressions can be obtained. The number of a, b, c, d, e, and f is obtained by solving the equations of the six equations. The number of a, b, c, d, e, and f will be replaced by the stomach of each pixel according to the set formula (3). This can be obtained by the symbols and patterns read. A bitmap image of the shape of a particular triangular region. The + 3⁄4 linear transformation is a method also called affine-like transformation, and the equation (3) of the affine transformation is replaced by the following equation (4). X=axy+by+Cy+d Y = exy+ fx + gy + h (4) #The mark read by the color filter and the coordinates of the black matrix pattern and the original of these marks and patterns After the coordinates of the existing position are substituted into the equation (4), eight equations are obtained. The number of a, b, c, d, e, f, g, h is obtained by solving the cubic equation of the eight equations. The number of a, b, C, d, e, f, g, h will be replaced by the coordinates of each pixel according to the set (4). Thus, it is possible to obtain an image that is combined with the shape of the specific square area by the symbols and patterns read. Further, the above-described conversion is a process of deforming the area image, and the pattern image can be corrected by moving the skew of the image matching area of each pixel included in the area image in parallel without deforming the area image. The parallel movement ' at this time may be performed individually for each pixel, or the integration of a plurality of pixels may be used as a moving unit, and parallel movement is performed for each moving unit. In this method, since the movement direction in the area image and the movement amount of -20 - 1359971 can be calculated, the area image change time is performed. 10(1 7*. 28------------.... i year month 曰 replacement page: -——- _! Shape processing can shorten the processing of Figure 14 to illustrate the foregoing A schematic diagram for the effect of image correction. The actual pattern is located at the position indicated by the broken line in Fig. 11, and the image is corrected to form the spacer 1 2 in the position shown by the solid line. The positional relationship between the matrix pattern 8 and the spacers 1 2 does not become the positional relationship shown in Fig. 7A, but becomes the positional relationship exemplified in Fig. 14. That is, it should be formed so as to be superimposed on the black matrix pattern 8. The spacers 1 2 are formed adjacent to the black matrix pattern 8. If formed at this position, the pixel aperture ratio is lowered and thus it is not suitable. Further, if the positional deviation in the horizontal direction is not generated as shown in Fig. 14 When the positional deviation in the vertical direction occurs, the alignment control material 15 and the spacer 1 2 are overlapped, and the height of the spacer 1 2 is higher than the height of the original spacer 1 2. The height of the spacer 1 2 If it is inconsistent, it is impossible to correctly control the interval between the liquid crystal cells. Further, if the positional deviation of the alignment control material 15 affects the viewing angle of the liquid crystal panel, it is not suitable. Therefore, it is apparent that the substrate reading processing of step S304 and the image correction processing of step S3 05 are performed. Decreasing the positional deviation of the lower layer pattern from the upper layer pattern contributes to the improvement of the quality of the product or the improvement of the yield. Here, the substrate for the recording of the black matrix used in step S204 of FIG. 8 and the step S304 of FIG. 9 The reading, the image correction in step S305, and the exposure apparatus on the image recording in step S3 06 are explained. Fig. 15 and Fig. 16 are schematic diagrams showing the schematic configuration of the exposure device 31. Fig. 15 is an exposure device 31. The picture observed from obliquely above, Figure 16 is -21 - 1359971 100. 7. 28 one----------- I Niuyue a replacement to buy i!__——' is from the horizontal direction The exposure device 31 is provided with a plate-shaped mounting table 20, two line-shaped guiding members 2 1 disposed above it, and moving back and forth along the guiding member 21 on the guiding member 21 The platform base 30 and the rotatably mounted platform base 30 A flat plate 22, a platform 22 on which the substrate 2 3 to be exposed is adsorbed and maintained. Above the moving path of the stage 22, a plurality of lines arranged in a direction perpendicular to the moving direction of the stage 22 are disposed. The scanner 25 is composed of an exposure head group. The scanner 25 is provided with a shutter 29a supported by two pillars 24 arranged to hold the two guides 21 at the central portion of the installation table 20. In the embodiment, the exposure heads constituting the scanner 25 are disposed on two lines, and the exposure heads on the first line and the exposure heads on the second line are arranged in an intersecting lattice shape. Each of the exposure heads is internally provided with a digital micromirror device (DMD) manufactured by Texas Instruments. The light beam emitted from a light source (not shown) including the exposure device 31 is guided into the exposure head through a lens system (not shown) to be incident on the DMD. Further, the angle of the reflecting surface of each of the micromirrors constituting the DMD is controlled based on the number of pixels constituting the image recorded by the exposure. Specifically, when the number of pixels 値 is 1, the light beam incident on the DMD is controlled by the substrate 23 reflected on the stage 22 by being reflected by the micro mirror. On the other hand, when the number of pixels is 〇, the incident light beam is controlled by the micro mirror and is not irradiated onto the substrate 23. The exposure of the substrate, after the image recorded on the substrate is divided, will be replaced by -22 - 1359971, ®0r 7: '2^-------1 I Distributing to each of the exposure heads, the platform 22 is moved along the side of the guide while controlling the DMD of each exposure head. The substrate is exposed to a long strip shape in the moving direction of the stage by each of the exposure heads. At this time, since the width of the exposure head is wider than the width of the DMD, although the exposure caused by the exposure heads arranged in a line produces an unexposed area between the exposure heads, the first line is not exposed. The area is exposed by an exposure head of a second line arranged in a crossed grid. Thereby, the entire surface of the substrate 23 can be exposed. In the exposure device 31, two low-magnification cameras 27 capable of capturing the vicinity of the edge of the substrate 2 3 adsorbed on the stage 2 2 are further provided. In addition, the low-magnification camera 27 is a camera in a state in which the shooting magnification is set to a magnification in which the symbol 6 shown in Fig. 2 can be recognized in the captured image. That is to say, the case where the photographing magnification of the camera capable of high-magnification photography is set to a low magnification is included. The camera 2 7 is fixed to a support body 26 composed of a pillar and a gate, and is disposed at a corner of the platform 22 and above the diagonal of the corner. Further, the exposure device 31 is provided with a high-magnification camera 28 in which a plurality of portions other than the edge of the substrate 23 can be imaged. The high-magnification camera 2 8 is a camera that is set to recognize the magnification of each element such as a black matrix pattern, a colored pixel pattern, a spacer, and an alignment control material formed on the substrate by the captured image. The high-magnification camera 2 8 is fixed to the shutter 29b supported by the support 24 at a constant interval. The gate 29b is provided with a track, and the high-magnification camera 28 is fixed to the track, and the interval can be changed as necessary. In the present embodiment, six high-magnification cameras 28 are arranged at intervals of 30 cm -23 - 1359971 f KM), 7 · 2*8 - - * - - - i - day replacement page i t__ i . Fig. 17 is a schematic diagram illustrating the illumination function of the high magnification camera 28. The camera 28 has a light source inside, and the substrate is photographed by epi-illumination as shown by the arrow. For example, in the procedure of forming the spacers, as shown in the figure, the substrate formed in the state of being formed to the transparent electrode 14 is photographed for positional comparison, but as described above, the color filter substrate except for the black matrix pattern 8' Since it is composed of a light-transmitting element, it is possible to obtain an image capable of recognizing the black matrix 8 by photographing by epi-illumination. The platform 22, the exposure head, the low magnification camera 27, and the high magnification camera 28 described above are controlled by the control unit. Figure 18 is a block diagram for the details of the control unit. As shown in the figure, the control unit 32 of the exposure device 31 is provided with a substrate image to be recorded by the exposure device, that is, to control the design of the black matrix pattern, the colored pixel pattern, the spacer, and the alignment control material. The video input control unit 33 for capturing the image data of the CAD/CAM system of the figure, the platform control unit for controlling the movement and rotation of the control platform 22, and the photographing control for controlling the shooting of the low magnification camera 27 and the high magnification camera 28. The portion 36 and the exposure control unit 3 7 that controls the exposure head 25 and the light source supplied to the light beam of the exposure head, and the control unit 32 further includes a control position in which the recording position of the pattern recorded by the exposure does not vary. Position recording position control unit 34. In the present embodiment, the video input control unit 33, the platform control unit 35, the imaging control unit 36, the exposure control unit 37, and the recording position control unit 34 are dedicated to each function of the control board. Controller. However, -24 - 1359971 μ 7. 2Β----------------- I-day-day repair cake Lai* control unit 32, can also be used in general-purpose CPU and memory The memory of the control board is realized by incorporating a program capable of executing the above functions.

Hereinafter, the procedure for forming the gap 'object 12 will be described as an example of the control processing executed by the control unit 32. In addition, in the publicly known documents such as the Japanese Patent Laid-Open Publication No. 2005-055881, the entire disclosure of the present disclosure of . Fig. 19 is a flow chart showing the initialization process for recording position control. In the forming process of the spacers 12, the substrate 2 of the exposure device 31 is placed on the transparent electrode 14 as the substrate 2 3 on which the photosensitive resin as the material of the spacers 1 2 is formed. When the substrate 23 is set, the recording position control unit 34 sends a signal indicating the shooting of the low magnification camera 27 to the shooting control unit 36. As a result, the substrate 2 3 is photographed at a low magnification near the corner (S 4 0 1). The recording position control unit 34 reads the mark on the substrate 23 from the image obtained by photographing (S402). Specifically, the position coordinates of the mark are obtained by performing the aforementioned pattern matching process on the image obtained by photography. For example, here, in the symbol shown in Fig. 2, the symbol 6c and the symbol 6f are read. Next, based on the position coordinates of the read mark, it is determined whether or not the moving direction of the substrate 2 with respect to the stage 22 is straight', that is, whether it is arranged in parallel with the moving direction (S403). Fig. 20A and Fig. 20B are explanatory diagrams for explaining the determination method. As shown in Fig. 20A, in the initial state, the platform 22 is disposed on the platform base 30 in parallel with the moving direction of the platform -25-1359971 100. 7 cattle}. For example, when the position of the symbol 6c is the position 40 and the position of the symbol 6f is the position, the recording position control unit 34 will calculate the board based on the size of the bit plate 23 on which the symbol 6c is obtained and the moving direction of the stage 22. 23 Position 4 1 of the number 6 f that is configured straight for the direction of movement of the platform 22. Further, the recording position control unit 34 can determine the platform 22 0 for the substrate 23 from the relationship of the position 40, i and the position 42. When the tilt angle 0 is 0, it is determined that the substrate 2 3 is on the straight stage 22, and the coordinate system is set on the substrate 23 (S405). As shown in the example, the position 42 of the symbol 6f is used as the origin (〇, 〇), the direction is set to the X-axis, and the direction axis is perpendicular to the direction in which the platform moves. If the inclination angle 0 is other than 0, the recording position determines that the substrate is not arranged straight, and the inclination control angle is 0 to the platform control unit 35. The platform control unit 35 rotates the control unit 30, and as shown in Fig. 20B, the stage 22 adjusts the platform direction by tilting only the 0 angle with respect to the direction (S404). By the processing up to steps S401 to S403, it is confirmed that the substrate 23 is placed in parallel in the horizontal direction, and then the coordinate 设定 is set in step S405, and in the second 〇A diagram and the second 〇B diagram, in order to facilitate tilting An increase in the angle 0 indicates that the tilt angle of 0 is actually the angle at which the platform 22 is not moved even if the platform 22 is rotated as shown. .28------------------ " Miscellaneous Pages to the reading of 42 cases set 40, base, to find the base case record. Stand 4 1 or so The tilt angle is arranged in a flat shape. For example, as shown in the figure, the movement of the platform is set to y. The control unit 3 4 is supplied by the platform. The platform is moved by the repeating step moving side I. Therefore, the processing of the recording position control unit 34 in which the coordinate system is set is described with reference to Fig. 21, and the processing of the recording position control unit 34 is described. The recording position control unit 34 calculates the coordinates of the object or the black matrix pattern based on the set coordinate system. However, in the present embodiment, as described with reference to Fig. 15, the high-magnification camera 28 is fixed to the shutter 29b perpendicular to the moving direction of the stage at an interval of 30 cm, and the y coordinate of the photographing position (and The coordinates of the direction in which the platform 22 moves in the vertical direction are fixed in advance. Therefore, as long as the X coordinate of the photographing position is calculated, the coordinates of the six photographing positions can be simultaneously obtained. The position represented by the coordinates obtained by the calculation is set as the photographing position (S 4 Ο 1 ). Next, the recording position control unit 34 instructs the platform control unit 35 to move the platform 22, and each high-magnification camera 28 moves the platform 22 in the moving direction as it is placed above the set shooting position (S 402). Then, the recording position control unit 34 instructs the photographing control unit 36 to photograph the high magnification camera 28 (S403). Next, the recording position control unit 34 searches for the image obtained by the high-magnification camera 28 by the pattern or symbol existing in the set shooting position by repeating the pattern matching processing (S 404). . Then, when the pattern is recognized, the predetermined coordinates of the pattern are acquired (for example, the center coordinates KS405 of the pattern) - the recording position control unit 34' will process the steps from 3401 to S405 for the pattern or mark of the predetermined full shooting position. The reading is repeated as of the end. Next, referring to Fig. 22, the image of the obtained coordinate -27 - 1359971 - Μ ---ι . · I year 曰 盐 salt replacement page: I ___^ * Correction process will be explained. The recording position control unit 3 4 ' reads the area image recorded in the area defined as the vertex at the position set as the shooting position, and reads it into the memory in accordance with the unit area (S501). On the other hand, 'the coordinates obtained by the processing shown in Fig. 21' grasp the actual shape of the area on the substrate on which the image of the area is to be recorded. Then, 'the actual area shape is overlapped with the actual area shape, and the read area image is corrected (S502). That is to say, the image of the region read is deformed or moved as the actual shape of the region on the substrate on which the image is recorded. The image recorded on the substrate is divided into a plurality of area images 'and' defined by a plurality of areas on the substrate. Therefore, the processing of steps S501 and S502 is repeated for each area image. After the processing of the entire area image is completed (S 5 0 3 ), the corrected area images are combined and displayed as a single image showing the entire image recorded on the substrate (S504). Thereafter, the recording position control unit 34 instructs the exposure control unit 37 to record the substrate of the synthesized image. The recording processing of the exposure control unit 37 is a general processing of the exposure apparatus ‘that is, the same as when the image input by the CAD/C AM system is directly recorded on the substrate. As described above, the color filter substrate manufacturing program 1 will be described. Next, the array substrate manufacturing program 2 shown in Fig. 1 will be described. Fig. 23 is a flow chart showing the detailed procedure of the array substrate manufacturing program 2. The array substrate is manufactured by forming the elements shown in the respective steps of the flowchart of Fig. 23 on the transparent substrate. The transparent substrate is the same as the color light substrate, and a soda glass plate having a cerium oxide film on the surface can be used, -28 - 1359971 7 .......... I cattle. Month replacement page j »- ________ t Low-expansion glass plate, non-alkali glass plate, quartz glass plate and other well-known glass plates or plastic films. Fig. 24A is a view showing that the upper surface of the substrate in a state in which the main elements are formed is enlarged corresponding to the number of pixels of the liquid crystal panel. Fig. 24B is a view showing an enlarged view of the TFT structure portion in the structure shown in Fig. 24A. Further, Fig. 25A, Fig. 25B, Fig. 25C, Fig. 25D, and Fig. 25E are cross-sectional views of the substrate in each of the procedures for forming the TFT structure portion shown in Fig. 24B. As shown in Fig. 23, in the array substrate manufacturing program 2, first, a gate electrode is formed on a transparent substrate (S601). The gate electrode patterns 51 formed on the transparent substrate 50 are formed at equal intervals on the parallel side-by-side line patterns as shown in FIG. 24A to form a pattern shape at the intersection with the source or the drain of the TFT. . In forming the gate electrode pattern 51, first, by sputtering, giant (butyl &), molybdenum (?), tungsten (\¥), titanium (1^), chromium ((:1') or It is a metal such as aluminum (eight 1), and is formed by forming a film thickness of 250 to 300 nm on the transparent substrate 50. Next, a photosensitive resist is applied to the metal film, and the temperature is applied to the resist material at an appropriate temperature. Baking (prebaking), the resist layer is exposed to the pattern shape by the exposure device 31. After the exposed substrate is developed, the exposed portion remains as a pattern on the substrate. Bake (post-baking) again and fix it on the substrate. Next, the fixed resist pattern is used as an etch mask to etch the metal film existing under the resist pattern, and finally by stripping or The resist is peeled off by ashing, etc. The second 5A is after the gate electrode pattern 51 is formed on the transparent substrate 50 by the above procedure at -29 - 1359971 Μ 7. 28 .- i 4 替换A cross-sectional view of the TFT structure portion. Next, as shown in steps S602 and 25B, A gate oxide film 55 having a film thickness of 300 to 400 nm and a semiconductor film 56' having a film thickness of 200 to 300 nm composed of arsenic (a-Si) and a nitrogen film composed of silicon oxide (SiNx) a channel portion 57 formed of ruthenium (SiNx). The channel portion 57' is formed by a chemical vapor deposition method (CVD: Chemical Vapor Deposition) or a ruthenium nitride film having a film thickness of 20 nm on the semiconductor film 56. The sputtering method is formed in the same manner as the formation process of the gate electrode pattern 51, and a photosensitive resist is applied thereon, and the resist layer is subjected to patterning exposure and development by the exposure device 31, and the resist pattern is used as an etching mask. The yttrium nitride is formed by etching. Fig. 25B is a cross-sectional view showing the TFT structure portion after the channel portion 57 is formed. In the present embodiment, when the channel portion 57 is formed, the exposure device 3 1 performs the foregoing. In the control of the recording position, the channel portion 57 and the lower gate electrode pattern 51 can be disposed with high accuracy as in the positional relationship shown in Figs. 24A and 24B. Next, the drain and the source constituting the TFT are formed. (S603). In step S603, first, in forming a TFT structure In the region formed, the pattern of the channel portion 57 and the semiconductor film 56 underneath the film are formed to form an N + -type a-Si layer 58 and an N + film having a total thickness of 40 to 5 Å. The microcrystalline 矽Uc '-Si) layer 59' is formed thereon to form a metal such as giant (T a), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr) or aluminum (A1). membrane. In addition, on the metal film, it is formed in the subsequent contact hole forming process as a function of stopping the uranium layering -30 - 1359971 Μ 7; 28 ---------..- Replace page. _. A _j layer 61. Then, similarly to the formation procedure of the gate electrode pattern 51, a photosensitive resist is applied on the layer 61, and the resist layer is subjected to patterning exposure development by the exposure device 31, and the resist pattern is used as an etching mask. 1. The metal film, layer 58, layer 59, is etched. Thereby, the patterns of the source 52 and the drain 53 as shown in Figs. 24A and 24B are formed on the substrate. Fig. 25C is a cross-sectional view showing the TFT structure portion after the source and the drain are formed. Further, in the present embodiment, when the source electrode 5 2 and the drain electrode 5 3 are formed, the above-described recording position is controlled by the exposure device 31, the pattern of the source electrode 52 and the drain electrode 53 and the gate electrode pattern of the lower layer. The 51 can be configured with good accuracy as in the positional relationship shown in Figs. 24A and 24B. Next, a protective film and a contact hole are formed (S604). In the protective film and the contact hole, tantalum nitride (SiNx) which is a material of the protective film on the source electrode 52 and the drain electrode 53 is deposited by a CVD method or the like to have a film thickness of 300 nm or less. The resist pattern is formed by exposure and development, the resist pattern is used as an etch mask, and a portion of the drain is etched to form the contact hole 54 while the substrate is formed. The peripheral portion is etched to expose the terminals of the lower layer. At this time, the aforementioned layer 6 1 functions as a stop resist layer. Fig. 25D is a cross section showing the TFT structure portion after the protective film 62 and the contact hole 504 are formed. Further, as shown in Fig. 24B, the contact hole 54 must be formed on the upper portion of the drain 5 3 . Therefore, in the present embodiment, the formation of the protective film and the contact hole is also controlled by the exposure device 31 as described above. Finally, a pixel electrode is formed (S605). The pixel electrode 63 is deposited by the 1359971 100. 7. 28 *- i shot ITO 'the same as the gate electrode pattern forming process, and the resist pattern is formed by exposure and development to use the resist pattern as an etch mask. The pattern is formed by the worm. Fig. 25 is a cross-sectional view showing the TFT structure portion after the pixel electrode 63 is formed. At the time of forming the pixel electrode 63, the recording position control is also performed by the exposure device 31. The flowchart shown in FIG. 26 is a procedure for describing the recording position control in the forming procedure of each element of the array substrate manufacturing program 2, specifically, the channel portion 57, the source 52, and the drain 53 are formed. In the program of the contact hole 54, a flowchart of common processing is shown. First, the substrate on which the pattern is formed is washed (S701). Next, the material of the formed element is formed on the substrate by CVD or sputtering (S7〇2). Thereafter, a photosensitive resist is applied to the film (S703), and baked at a suitable temperature in accordance with the resist material (prebaking: S 704). Then, in order to collide the position of the pattern formed on the lower layer with the pattern formed next, the substrate is read (S 7 0 5 ) and the image is corrected (S706). The contents of such processing and the configuration of the exposure device 31 used in the processing are as described in the description of the color filter substrate manufacturing program 1, but in the array substrate manufacturing program 2, the color filter substrate is manufactured. Unlike the procedure 1, there is a procedure for forming a film having no light transmissive property. Specifically, the photosensitive resist, the gate insulating film, the protective film, and the transparent electrode have light transmittance, and the metal such as the gate electrode, the source, and the drain has no light transmittance. For example, in the forming process of the channel portion 57, there is a -32-35997I IQd ^ , ; The shadow gate electrode pattern 51 taken by the falling illumination shown in Fig. 7 may be difficult. Therefore, in the array substrate manufacturing program 2, as shown in Fig. 27, the irradiation light is contacted obliquely upward from the pattern, and in the photographic image, the step of the edge is made to float upward. Thereby, since the shape corresponding to the gate electrode pattern 51 is recognized by the photographic image, the positional comparison of the pattern of the same pattern of the optical sheet manufacturing program 1 can be performed. After correcting the image, the applied resist is then exposed to the pattern shape on the image of the front (S 7 0 7 ). When the channel portion 5 and the drain 5 3 are formed, the resist is exposed in a pattern such as after the exposure and development, and when the contact hole 5 4 is formed, the exposure is performed without exposure, such as a hole shape. . Then, the exposure plate is developed (S7 08), and after the development, the resistance remaining on the substrate is again baked (post-baking) and then fixed on the substrate (S709). Next, the resist pattern to be fixed is etched as a layer formed by the etching mask S702 (S710). Finally, the element is formed by the substrate of the detergent (S71 1). As described above, the array substrate manufacturing program 2 is described. Referring to FIG. 28, the liquid crystal cell manufacturing process shown in FIG. 1 will be described. In the liquid crystal cell manufacturing process 3, the color filter substrate and the array are coated with liquid crystal. The adhesive for the unit cell is maintained (sealing material S804). Next, in the short-circuit application program (S802), a paste for electrically connecting the electrodes of the substrate and the electrodes of the array substrate is applied. 28 bow repair ^ replace 1 ______J image, identify the side image of the arrow pattern, can be painted with the color filter in the repair, after the source shape is developed, the base pattern after blocking, will be in step Net peeling obstruction, finally, preface 3. On the column substrate) (S801, color filter conductive tin-33 - 1359971 - 拠 7 ! years, then 'drop the liquid crystal at the color filter region where the color filter substrate is formed (S803), color filter The substrate and the array are bonded together (S 805). The bonding of the substrates is performed by aligning the alignment marks on the respective shapes (symbols 6 and the like shown in FIG. 2) with each other's TFT array and color filter. The sheet can be temporarily fixed by superimposing pressure and ultraviolet irradiation with high precision. Thereafter, the sealing material is thermally cured by ultraviolet irradiation (S 806). At this time, the distance, that is, the gap of the single crystal, is The spacers 12 formed on the color substrate are controlled with high accuracy. Next, the substrates bonded to each other are cut into product surfaces (S807). Specifically, the glass surfaces are formed along the cut lines. The substrate is cut by a pressure shock, and a good orientation (S 8 0 8 ) is obtained by cooling the single crystal once after heating. Finally, a polarizing plate is provided, and the roller is pressed and adhered (S 8 09) Crystal panel. The system of the above described liquid crystal panel In the manufacturing process, when the components constituting the substrate are formed as before, the actual position coordinates of the marks or patterns on which the plurality of bits are located at the position on the substrate are taken, offset, and the image recorded on the substrate is exposed and deformed. In the color filter substrate manufacturing process, the spacer is formed on the upper spacer, and even if the thinning of the black matrix continues, the liquid crystal alignment control material is prevented from being overlapped with the spacer. It is also possible to arrange without overlapping with the spacers. In addition, even in the array substrate manufacturing process, 'can be 〇 0 . .. « - r - ·· · ι_ 一詹* 丨曰修®Qin replacement page; The substrates are formed on the basis of the respective bases, and the flaws are formed by the pressure or the size of the two substrate color filter plates, thereby obtaining a comparison in the single crystal. Bit or move. Black matrix can be accurate and accurate enough when accurate -34 - 1359971 -100;*7".*28·-..... '--- Year of the month repair ((years of replacement Page 丨[________* Degree control should be configured The channel portion on the upper part of the gate electrode, the source electrode and the drain electrode arranged in a predetermined position relationship with the gate electrode, and the arrangement position of the contact hole on the drain electrode, etc., when the panel size of the product is increased, The interval between the alignment marks formed at the end portions of the substrate is not widened, and there is a case where sufficient accuracy cannot be ensured by the positional comparison using only the alignment marks. In the method of the present embodiment, the method is formed for the purpose of positional comparison. In addition to the alignment marks at the end portions of the substrate, by recognizing the black matrix of the color filter substrate or the gate electrode of the array substrate, the positional comparison can be performed in units of small areas without depending on the arrangement interval of the alignment marks. Therefore, even if the panel size of the product becomes large, or the size of the transparent substrate processed by the manufacturing process becomes large, the positional comparison can be performed in units of appropriate size regions, and the positional relationship between the patterns can be adjusted with high accuracy. In addition, as long as the manufacturer can take into consideration various modifications of the above-described embodiments, even a method different from the above-described embodiment is a method included in the order described in the patent application, and is of course included in the scope of the present invention. . For example, in the above-described embodiment, the low-magnification camera 27 is used for the reading of the end portion of the substrate, and the high-magnification camera 2 is used for the reading of the pattern of the element such as the black matrix, and the plural is provided separately. The various types of cameras in Taiwan can also move a mobile camera and make it possible to change the magnification while taking pictures of the necessary positions. [Simplified description of the drawings] Fig. 1 is a schematic diagram showing a manufacturing procedure of a liquid crystal panel. -35 - 1359971 —__ "* ; I year and month repair replacement page i

!_I Figure 2 is a schematic view of an embodiment of a color filter substrate. Fig. 3 is a flow chart showing the details of the manufacturing process of the color filter substrate. Fig. 4A is an explanatory view showing an enlarged view of a part of the upper surface of the substrate after the black matrix forming process. Fig. 4B is a cross-sectional view corresponding to Fig. 4A. Fig. 5A is an explanatory view showing an enlarged view of a part of the upper surface of the substrate after the R pixel pattern forming process. Fig. 5B is a cross-sectional view corresponding to Fig. 5A. Fig. 6A is an explanatory view showing an enlarged view of a part of the upper surface of the substrate after the full-color pixel pattern forming process. Figure 6B is a cross-sectional view corresponding to Figure 6A. Fig. 7A is an explanatory view showing an enlarged view of a part of the upper surface of the substrate after the alignment control material forming process. Fig. 7B is a cross-sectional view corresponding to Fig. 7A. Figure 8 is a flow chart illustrating the black matrix forming procedure. Figure 9 is a flow chart showing the procedure for forming each component. Fig. 10 is a view showing an example of the relationship between the pattern formed on the substrate to be read and the photographing position. Figure 11 is a schematic diagram illustrating the positional deviation of the pattern. Fig. 12 (a) and (b) are diagrams for explaining image correction processing for each area defined by a black matrix pattern. Fig. 1 is a schematic diagram for explaining image correction processing in units of areas defined by alignment marks. -36 - 1359971 100. 7. 28 ........ ί千Η Hawthorn replacement page. i ! - _ _ τ _ _ _r> Figure 14 is a schematic diagram showing the effect of image correction . Fig. 15 is a schematic view showing the schematic configuration of the exposure apparatus (viewed from above). Fig. 16 is a schematic view showing the outline of the exposure apparatus (a diagram observed from the horizontal direction). Figure 17 is for the illumination of a high-magnification camera; Fig. 18 is a detailed explanatory diagram of a control unit of the exposure apparatus. Fig. 19 is a flow chart showing the initialization process for recording position control. Fig. 20A is an explanatory diagram of a method of determining the direction in which the substrate is disposed. Fig. 20B is an explanatory view for explaining a method of adjusting the substrate setting direction. Fig. 21 is a flow chart showing the image reading processing for recording position control. Fig. 2 is a flow chart showing the image correction processing for recording position control. Fig. 2 is a flow chart showing the detailed procedure of the manufacturing process of the array substrate. Fig. 24A is a view showing the upper surface of the substrate in a state in which the main elements constituting the TFT are formed. Fig. 24B is an enlarged view of the TFT structure portion of Fig. 24A. Fig. 25A is a cross-sectional view of the substrate in each of the processes up to the portion shown in Fig. 24B. Figure 25B is a section of the substrate in the process until the formation of the portion shown in Figure 24B. -37 - 1359971 I. Fig. 25C is a cross-sectional view of the substrate in each of the processes up to the portion shown in Fig. 24B. Fig. 25D is a cross-sectional view of the substrate in each of the processes up to the portion shown in Fig. 24B. Fig. 25E is a cross-sectional view of the substrate in each of the processes up to the portion shown in Fig. 24B. Fig. 26 is a flow chart showing the recording position control process in the array substrate manufacturing process. Figure 27 is a schematic view showing the illumination when the non-transmissive layer is photographed. Figure 28 is a flow chart showing the detailed process of the liquid crystal cell manufacturing process. [Description of component symbols] 4 Color filter substrate 5 Color filter structure 6 a ~ 6 i Symbol 7 Transparent substrate 8 y 1 v \ Color matrix pattern 9 R Pixel pattern 10 G Pixel pattern 11 B Pixel pattern 12 Interstitial 13 Protection. Membrane 1 4 Transparent Electrode 15 Orientation Control Material -38 - 1359971 ιοα ϋϋ________ :

Niuyue Day Replacement F 1 6 a ~ 1 6 d Shooting Position 17 Position 20 Setting Table 2 1 Guide 22 Platform 23 Substrate 24 Pillar 2 5 Scanner 26 Support 27 Low Magnification Camera 28 Still Camera 29 Brake 3 1 Exposure device 5 1 gate electrode pattern 5 2 source 53 drain 54 contact hole 57 channel portion -39 -

Claims (1)

ΙΪ59971, No. 95119303, "Manufacturing Method of Liquid Crystal Panel, Patent Application No. Patent Application No. </ RTI> </ RTI> </ RTI> </ RTI> A method for manufacturing a liquid crystal panel, characterized in that a structural element constituting at least one of the liquid crystal panels is subjected to a procedure including the following steps Forming: a substrate reading step of reading a plurality of objects existing on the substrate from a captured image of the substrate to obtain a position coordinate of each object; and an image correcting step of displaying an image of the pattern shape of the structural element, that is, The area image recorded in the area specified by the position of the plurality of objects is corrected according to the position coordinates obtained in the substrate reading step; the image recording step is corrected according to the configuration in the image correction step After each pixel of the area image, the area image corrected by the image correcting step is recorded by the on/off control of the light beam of the scanning substrate, and is recorded by the position coordinates obtained by the substrate reading step. The area of the liquid crystal panel as claimed in claim 1 The method of manufacturing the liquid crystal panel according to the first or second aspect of the invention, wherein A columnar spacer formed on a color filter substrate. The method of manufacturing a liquid crystal panel according to claim 1, wherein the structural element 'is a liquid crystal alignment formed on a color filter substrate 5. The manufacturing method of the liquid crystal panel of the first application of the patent scope, wherein the first 1359971 Μ 7. 26 ·; the afternoon 朁 朁 ! ! ! ! ! ! ! ! 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造The channel portion of the crystal. 6. The method of manufacturing a liquid crystal panel according to claim 1, wherein the structural element is a source portion and/or a drain portion of a thin film transistor formed on the array substrate. 7. The method of manufacturing a liquid crystal panel according to claim 1, wherein the structural element is a contact hole portion of the thin film transistor formed on the array substrate. 2 1〇α 7.-^8------- Year of the month 03⁄43⁄4 is replacing the page 丨 ! 1359971 * VII. Designation of the representative figure: ' (1) The representative figure of the case is: Figure 9. (2) Brief description of the symbol of the representative figure: S301 Substrate cleaning S302 Smudge resist S303 Pre-bake S304 Read substrate S305 Image correction S306 Image recording (exposure) S307 Development S308 Post-baking 8. If there is a chemical formula in this case , please reveal the chemical formula that best shows the characteristics of the invention: