TWI354385B - - Google Patents

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Publication number
TWI354385B
TWI354385B TW097102637A TW97102637A TWI354385B TW I354385 B TWI354385 B TW I354385B TW 097102637 A TW097102637 A TW 097102637A TW 97102637 A TW97102637 A TW 97102637A TW I354385 B TWI354385 B TW I354385B
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
layer
luminous efficiency
heat
Prior art date
Application number
TW097102637A
Other languages
English (en)
Chinese (zh)
Other versions
TW200933924A (en
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Priority to TW097102637A priority Critical patent/TW200933924A/zh
Priority to US12/106,277 priority patent/US7635871B2/en
Priority to KR1020080046363A priority patent/KR100981850B1/ko
Publication of TW200933924A publication Critical patent/TW200933924A/zh
Application granted granted Critical
Publication of TWI354385B publication Critical patent/TWI354385B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
TW097102637A 2008-01-24 2008-01-24 Light-emitting diode capable of improving luminous efficiency TW200933924A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW097102637A TW200933924A (en) 2008-01-24 2008-01-24 Light-emitting diode capable of improving luminous efficiency
US12/106,277 US7635871B2 (en) 2008-01-24 2008-04-19 Light emitting diode with higher illumination efficiency
KR1020080046363A KR100981850B1 (ko) 2008-01-24 2008-05-19 더 높은 조명 효율을 갖는 발광 다이오드

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097102637A TW200933924A (en) 2008-01-24 2008-01-24 Light-emitting diode capable of improving luminous efficiency

Publications (2)

Publication Number Publication Date
TW200933924A TW200933924A (en) 2009-08-01
TWI354385B true TWI354385B (https=) 2011-12-11

Family

ID=40898312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097102637A TW200933924A (en) 2008-01-24 2008-01-24 Light-emitting diode capable of improving luminous efficiency

Country Status (3)

Country Link
US (1) US7635871B2 (https=)
KR (1) KR100981850B1 (https=)
TW (1) TW200933924A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8859305B2 (en) 2010-02-10 2014-10-14 Macron Technology, Inc. Light emitting diodes and associated methods of manufacturing
KR100969100B1 (ko) * 2010-02-12 2010-07-09 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US8390010B2 (en) * 2010-03-25 2013-03-05 Micron Technology, Inc. Solid state lighting devices with cellular arrays and associated methods of manufacturing
CN108183160B (zh) * 2018-01-03 2019-07-26 燕山大学 一种高发光效率氮化物led器件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3378465B2 (ja) * 1997-05-16 2003-02-17 株式会社東芝 発光装置
KR20030040851A (ko) * 2001-11-16 2003-05-23 (주)클리어뷰엘씨디 액정디스플레이용 일체형 면발광 장치
JP2003317519A (ja) * 2002-04-18 2003-11-07 Koninkl Philips Electronics Nv 面照明装置及びこれを用いた表示装置
KR20050106292A (ko) * 2004-05-04 2005-11-09 세광테크 주식회사 도광판 모서리의 입광부를 이용한 blu제조방법

Also Published As

Publication number Publication date
KR100981850B1 (ko) 2010-09-13
US20090189172A1 (en) 2009-07-30
TW200933924A (en) 2009-08-01
US7635871B2 (en) 2009-12-22
KR20090082070A (ko) 2009-07-29

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