KR100981850B1 - 더 높은 조명 효율을 갖는 발광 다이오드 - Google Patents
더 높은 조명 효율을 갖는 발광 다이오드 Download PDFInfo
- Publication number
- KR100981850B1 KR100981850B1 KR1020080046363A KR20080046363A KR100981850B1 KR 100981850 B1 KR100981850 B1 KR 100981850B1 KR 1020080046363 A KR1020080046363 A KR 1020080046363A KR 20080046363 A KR20080046363 A KR 20080046363A KR 100981850 B1 KR100981850 B1 KR 100981850B1
- Authority
- KR
- South Korea
- Prior art keywords
- led
- layer
- led chip
- optical layer
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097102637A TW200933924A (en) | 2008-01-24 | 2008-01-24 | Light-emitting diode capable of improving luminous efficiency |
| TW097102637 | 2008-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090082070A KR20090082070A (ko) | 2009-07-29 |
| KR100981850B1 true KR100981850B1 (ko) | 2010-09-13 |
Family
ID=40898312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080046363A Active KR100981850B1 (ko) | 2008-01-24 | 2008-05-19 | 더 높은 조명 효율을 갖는 발광 다이오드 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7635871B2 (https=) |
| KR (1) | KR100981850B1 (https=) |
| TW (1) | TW200933924A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8859305B2 (en) | 2010-02-10 | 2014-10-14 | Macron Technology, Inc. | Light emitting diodes and associated methods of manufacturing |
| KR100969100B1 (ko) * | 2010-02-12 | 2010-07-09 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
| US8390010B2 (en) * | 2010-03-25 | 2013-03-05 | Micron Technology, Inc. | Solid state lighting devices with cellular arrays and associated methods of manufacturing |
| CN108183160B (zh) * | 2018-01-03 | 2019-07-26 | 燕山大学 | 一种高发光效率氮化物led器件 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030040851A (ko) * | 2001-11-16 | 2003-05-23 | (주)클리어뷰엘씨디 | 액정디스플레이용 일체형 면발광 장치 |
| KR20040111520A (ko) * | 2002-04-18 | 2004-12-31 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 표면 조명 장치 및 표면 조명 장치를 이용하는 표시 장치 |
| KR20050106292A (ko) * | 2004-05-04 | 2005-11-09 | 세광테크 주식회사 | 도광판 모서리의 입광부를 이용한 blu제조방법 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3378465B2 (ja) * | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
-
2008
- 2008-01-24 TW TW097102637A patent/TW200933924A/zh unknown
- 2008-04-19 US US12/106,277 patent/US7635871B2/en active Active
- 2008-05-19 KR KR1020080046363A patent/KR100981850B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030040851A (ko) * | 2001-11-16 | 2003-05-23 | (주)클리어뷰엘씨디 | 액정디스플레이용 일체형 면발광 장치 |
| KR20040111520A (ko) * | 2002-04-18 | 2004-12-31 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 표면 조명 장치 및 표면 조명 장치를 이용하는 표시 장치 |
| KR20050106292A (ko) * | 2004-05-04 | 2005-11-09 | 세광테크 주식회사 | 도광판 모서리의 입광부를 이용한 blu제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090189172A1 (en) | 2009-07-30 |
| TW200933924A (en) | 2009-08-01 |
| US7635871B2 (en) | 2009-12-22 |
| TWI354385B (https=) | 2011-12-11 |
| KR20090082070A (ko) | 2009-07-29 |
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