TWI351237B - Circuit board structure - Google Patents

Circuit board structure

Info

Publication number
TWI351237B
TWI351237B TW098103879A TW98103879A TWI351237B TW I351237 B TWI351237 B TW I351237B TW 098103879 A TW098103879 A TW 098103879A TW 98103879 A TW98103879 A TW 98103879A TW I351237 B TWI351237 B TW I351237B
Authority
TW
Taiwan
Prior art keywords
circuit board
board structure
circuit
board
Prior art date
Application number
TW098103879A
Other languages
English (en)
Other versions
TW201031286A (en
Inventor
Shih Chieh Chao
Chih Wen Huang
Chun Lin Liao
Original Assignee
Tatung Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatung Co filed Critical Tatung Co
Priority to TW098103879A priority Critical patent/TWI351237B/zh
Priority to US12/414,659 priority patent/US8093504B2/en
Priority to JP2009146674A priority patent/JP4834131B2/ja
Publication of TW201031286A publication Critical patent/TW201031286A/zh
Application granted granted Critical
Publication of TWI351237B publication Critical patent/TWI351237B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW098103879A 2009-02-06 2009-02-06 Circuit board structure TWI351237B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW098103879A TWI351237B (en) 2009-02-06 2009-02-06 Circuit board structure
US12/414,659 US8093504B2 (en) 2009-02-06 2009-03-30 Circuit board structure employing ferrite element
JP2009146674A JP4834131B2 (ja) 2009-02-06 2009-06-19 回路板構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098103879A TWI351237B (en) 2009-02-06 2009-02-06 Circuit board structure

Publications (2)

Publication Number Publication Date
TW201031286A TW201031286A (en) 2010-08-16
TWI351237B true TWI351237B (en) 2011-10-21

Family

ID=42539456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103879A TWI351237B (en) 2009-02-06 2009-02-06 Circuit board structure

Country Status (3)

Country Link
US (1) US8093504B2 (zh)
JP (1) JP4834131B2 (zh)
TW (1) TWI351237B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10433417B2 (en) * 2016-02-08 2019-10-01 Canon Kabushiki Kaisha Electronic apparatus
CN106102302B (zh) * 2016-06-28 2018-02-27 广东欧珀移动通信有限公司 Pcb板及具有其的移动终端
TWI603654B (zh) * 2017-01-23 2017-10-21 欣興電子股份有限公司 電路板與其製作方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015972A (en) * 1989-08-17 1991-05-14 Motorola, Inc. Broadband RF transformer
US5990417A (en) * 1993-06-07 1999-11-23 Nippon Telegraph And Telephone Corporation Electromagnetic noise absorbing material and electromagnetic noise filter
JPH09298383A (ja) * 1996-04-30 1997-11-18 Tec Corp プリント基板
US5831331A (en) * 1996-11-22 1998-11-03 Philips Electronics North America Corporation Self-shielding inductor for multi-layer semiconductor integrated circuits
US6190509B1 (en) * 1997-03-04 2001-02-20 Tessera, Inc. Methods of making anisotropic conductive elements for use in microelectronic packaging
JP2000269613A (ja) * 1999-03-18 2000-09-29 Matsushita Electric Ind Co Ltd 不要輻射対応プリント基板
US6125044A (en) * 1999-03-23 2000-09-26 Hewlett-Packard Company Suppressing EMI with PCB mounted ferrite attenuator
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
JP2001177289A (ja) * 1999-12-17 2001-06-29 Kyocera Corp 配線基板
JP3494115B2 (ja) * 2000-03-30 2004-02-03 株式会社村田製作所 導電性ペーストおよびこれを用いた積層セラミック電子部品
US6914183B2 (en) * 2002-09-25 2005-07-05 Sumitomo Electric Industries, Ltd. Board for printed wiring
JP2006093485A (ja) * 2004-09-27 2006-04-06 Kyocera Corp ガラスセラミック基板
JP3972951B2 (ja) * 2005-07-04 2007-09-05 オムロン株式会社 スイッチング電源、電源装置および電子機器
KR100847985B1 (ko) * 2007-06-25 2008-07-22 삼성전자주식회사 금속 배선 형성방법
JP2009026875A (ja) * 2007-07-18 2009-02-05 Nitto Denko Corp 配線回路基板
JP5145110B2 (ja) * 2007-12-10 2013-02-13 富士フイルム株式会社 異方導電性接合パッケージの製造方法
JP2009283574A (ja) * 2008-05-20 2009-12-03 Nitto Denko Corp 配線回路基板およびその製造方法

Also Published As

Publication number Publication date
US20100200281A1 (en) 2010-08-12
TW201031286A (en) 2010-08-16
US8093504B2 (en) 2012-01-10
JP4834131B2 (ja) 2011-12-14
JP2010183052A (ja) 2010-08-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees