TWI350223B - A cutting method for manufactruing targeted objects - Google Patents

A cutting method for manufactruing targeted objects

Info

Publication number
TWI350223B
TWI350223B TW094107247A TW94107247A TWI350223B TW I350223 B TWI350223 B TW I350223B TW 094107247 A TW094107247 A TW 094107247A TW 94107247 A TW94107247 A TW 94107247A TW I350223 B TWI350223 B TW I350223B
Authority
TW
Taiwan
Prior art keywords
manufactruing
cutting method
targeted objects
targeted
objects
Prior art date
Application number
TW094107247A
Other languages
English (en)
Other versions
TW200539978A (en
Inventor
Fumitsugu Fukuyo
Kazuhiro Atsumi
Naoki Uchiyama
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of TW200539978A publication Critical patent/TW200539978A/zh
Application granted granted Critical
Publication of TWI350223B publication Critical patent/TWI350223B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
TW094107247A 2004-03-16 2005-03-10 A cutting method for manufactruing targeted objects TWI350223B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004074993A JP4584607B2 (ja) 2004-03-16 2004-03-16 加工対象物切断方法

Publications (2)

Publication Number Publication Date
TW200539978A TW200539978A (en) 2005-12-16
TWI350223B true TWI350223B (en) 2011-10-11

Family

ID=34975855

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107247A TWI350223B (en) 2004-03-16 2005-03-10 A cutting method for manufactruing targeted objects

Country Status (3)

Country Link
JP (1) JP4584607B2 (zh)
TW (1) TWI350223B (zh)
WO (1) WO2005088689A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514490B2 (ja) * 2004-03-29 2010-07-28 日東電工株式会社 半導体ウエハの小片化方法
JP2007134510A (ja) * 2005-11-10 2007-05-31 Tokyo Seimitsu Co Ltd ウェーハマウンタ装置
JP2008042110A (ja) * 2006-08-10 2008-02-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP5495511B2 (ja) * 2008-05-27 2014-05-21 株式会社ディスコ ウエーハの分割方法
JP5307612B2 (ja) * 2009-04-20 2013-10-02 株式会社ディスコ 光デバイスウエーハの加工方法
KR101365049B1 (ko) * 2012-08-02 2014-02-20 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 롤링 브레이크 장치
KR101795327B1 (ko) 2013-11-14 2017-11-07 미쓰비시덴키 가부시키가이샤 레이저 가공 방법 및 레이저 가공 장치
JP2017112269A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ ウエーハの加工方法
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092776A (ja) * 1996-09-12 1998-04-10 Disco Abrasive Syst Ltd 被加工物用保護部材及びウエーハの研磨方法
JP2002367934A (ja) * 2001-06-13 2002-12-20 Nec Kansai Ltd 半導体素子の製造方法
JP3770820B2 (ja) * 2001-10-03 2006-04-26 日東電工株式会社 保護テープの貼付け方法
ES2377521T3 (es) * 2002-03-12 2012-03-28 Hamamatsu Photonics K.K. Método para dividir un sustrato
JP3624909B2 (ja) * 2002-03-12 2005-03-02 浜松ホトニクス株式会社 レーザ加工方法
US7335578B2 (en) * 2002-04-11 2008-02-26 Sekisui Chemical Co., Ltd. Method for manufacturing semiconductor chip
TWI288438B (en) * 2002-06-12 2007-10-11 Furukawa Electric Co Ltd Method for producing wafer and adhesive tape
JP2004079768A (ja) * 2002-08-19 2004-03-11 Lintec Corp 貼付装置
JP2005222986A (ja) * 2004-02-03 2005-08-18 Disco Abrasive Syst Ltd ウエーハの分割方法

Also Published As

Publication number Publication date
WO2005088689A1 (ja) 2005-09-22
JP2005268325A (ja) 2005-09-29
JP4584607B2 (ja) 2010-11-24
TW200539978A (en) 2005-12-16

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