TWI350132B - Linear split axis wire bonder - Google Patents
Linear split axis wire bonderInfo
- Publication number
- TWI350132B TWI350132B TW094114601A TW94114601A TWI350132B TW I350132 B TWI350132 B TW I350132B TW 094114601 A TW094114601 A TW 094114601A TW 94114601 A TW94114601 A TW 94114601A TW I350132 B TWI350132 B TW I350132B
- Authority
- TW
- Taiwan
- Prior art keywords
- wire bonder
- axis wire
- split axis
- linear split
- linear
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56853004P | 2004-05-05 | 2004-05-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610456A TW200610456A (en) | 2006-03-16 |
TWI350132B true TWI350132B (en) | 2011-10-01 |
Family
ID=35353136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094114601A TWI350132B (en) | 2004-05-05 | 2005-05-05 | Linear split axis wire bonder |
Country Status (4)
Country | Link |
---|---|
US (1) | US7320424B2 (zh) |
CN (1) | CN100452334C (zh) |
SG (1) | SG116614A1 (zh) |
TW (1) | TWI350132B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7320423B2 (en) * | 2002-11-19 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | High speed linear and rotary split-axis wire bonder |
US7320424B2 (en) * | 2004-05-05 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | Linear split axis wire bonder |
US7536233B1 (en) * | 2006-01-30 | 2009-05-19 | Advanced Micro Devices, Inc. | Method and apparatus for adjusting processing speeds based on work-in-process levels |
US7654436B2 (en) * | 2007-09-20 | 2010-02-02 | Asm Assembly Automation Ltd. | Wire bonding system utilizing multiple positioning tables |
US20100072262A1 (en) * | 2008-09-23 | 2010-03-25 | Kabushiki Kaisha Shinkawa | Wire bonding method |
US20120132695A1 (en) * | 2010-11-30 | 2012-05-31 | Yue Zhang | Wire feeding apparatus for wire bonders |
US11121115B2 (en) * | 2018-09-20 | 2021-09-14 | Asm Technology Singapore Pte Ltd. | Y-theta table for semiconductor equipment |
CN112122851B (zh) * | 2020-09-24 | 2022-04-01 | 无锡职业技术学院 | 一种板材对接焊接工作台 |
EP4303911A4 (en) * | 2021-03-29 | 2024-05-08 | Hirata Corporation | WIRE CONNECTION DEVICE |
CN113102924B (zh) * | 2021-04-21 | 2023-03-21 | 广州荣裕智能机械有限公司 | 一种体温计热敏线焊接机 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4361261A (en) * | 1978-11-22 | 1982-11-30 | Kulicke & Soffa Industries, Inc. | Apparatus for wire bonding |
US4266710A (en) * | 1978-11-22 | 1981-05-12 | Kulicke And Soffa Industries Inc. | Wire bonding apparatus |
US4422568A (en) * | 1981-01-12 | 1983-12-27 | Kulicke And Soffa Industries, Inc. | Method of making constant bonding wire tail lengths |
US4550871A (en) * | 1982-08-24 | 1985-11-05 | Asm Assembly Automation Ltd. | Four-motion wire bonder |
DD279979B5 (de) * | 1987-02-25 | 1994-07-21 | Css Semiconductor Equipment Gm | Vorrichtung fuer die Ultraschallkontaktierung |
JP2789384B2 (ja) * | 1990-10-16 | 1998-08-20 | 株式会社新川 | タブテープへの半導体素子接合方法及び超音波ボンデイング装置 |
EP0675581B1 (en) * | 1994-03-31 | 1997-08-27 | STMicroelectronics S.r.l. | Bonding apparatus for semiconductor electronic devices |
JP3034774B2 (ja) * | 1994-12-28 | 2000-04-17 | 株式会社カイジョー | ワイヤボンディング装置 |
JP3819095B2 (ja) * | 1996-01-05 | 2006-09-06 | 富士ゼロックス株式会社 | 光伝送路形成方法、光伝送路形成装置および光回路 |
US5839640A (en) * | 1996-10-23 | 1998-11-24 | Texas Instruments Incorporated | Multiple-tool wire bonder |
KR100199293B1 (ko) * | 1996-11-08 | 1999-06-15 | 윤종용 | 반도체 패키지 제조 장치 |
US5897048A (en) * | 1996-11-08 | 1999-04-27 | Asm Assembly Automation Ltd. | Radial wire bonder and selectable side view inspection system |
JP3534583B2 (ja) * | 1997-01-07 | 2004-06-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
US5931372A (en) * | 1997-02-14 | 1999-08-03 | Miller; Charles F. | Ultrasonic bonding method and apparatus with locking tool tip |
JP3601645B2 (ja) * | 1997-04-24 | 2004-12-15 | 澁谷工業株式会社 | 固体レーザ発振器のボンディング方法 |
US5909837A (en) * | 1997-05-09 | 1999-06-08 | Quad Systems Corporation | Contactless bonding tool heater |
US5901896A (en) * | 1997-06-26 | 1999-05-11 | Kulicke And Soffa Investments, Inc | Balanced low mass miniature wire clamp |
US6048750A (en) * | 1997-11-24 | 2000-04-11 | Micron Technology, Inc. | Method for aligning and connecting semiconductor components to substrates |
US6434726B1 (en) * | 1999-06-29 | 2002-08-13 | Lucent Technologies Inc. | System and method of transmission using coplanar bond wires |
SG92747A1 (en) * | 1999-11-02 | 2002-11-19 | Esec Trading Sa | Bonhead for a wire bonder |
US6723451B1 (en) * | 2000-07-14 | 2004-04-20 | 3M Innovative Properties Company | Aluminum matrix composite wires, cables, and method |
US6640423B1 (en) * | 2000-07-18 | 2003-11-04 | Endwave Corporation | Apparatus and method for the placement and bonding of a die on a substrate |
US6616030B2 (en) * | 2001-05-07 | 2003-09-09 | West Bond, Inc. | Gantry mounted ultrasonic wire bonder with orbital bonding tool head |
US7320423B2 (en) * | 2002-11-19 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | High speed linear and rotary split-axis wire bonder |
US7320424B2 (en) * | 2004-05-05 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | Linear split axis wire bonder |
-
2005
- 2005-03-29 US US11/092,399 patent/US7320424B2/en not_active Expired - Fee Related
- 2005-04-14 SG SG200502290A patent/SG116614A1/en unknown
- 2005-04-27 CN CNB2005100681390A patent/CN100452334C/zh not_active Expired - Fee Related
- 2005-05-05 TW TW094114601A patent/TWI350132B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7320424B2 (en) | 2008-01-22 |
SG116614A1 (en) | 2005-11-28 |
US20050247758A1 (en) | 2005-11-10 |
CN100452334C (zh) | 2009-01-14 |
TW200610456A (en) | 2006-03-16 |
CN1694235A (zh) | 2005-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |