TWI349583B - Application device and method for detecting an air bubble in the application device - Google Patents

Application device and method for detecting an air bubble in the application device

Info

Publication number
TWI349583B
TWI349583B TW096145635A TW96145635A TWI349583B TW I349583 B TWI349583 B TW I349583B TW 096145635 A TW096145635 A TW 096145635A TW 96145635 A TW96145635 A TW 96145635A TW I349583 B TWI349583 B TW I349583B
Authority
TW
Taiwan
Prior art keywords
application device
detecting
air bubble
application
bubble
Prior art date
Application number
TW096145635A
Other languages
English (en)
Other versions
TW200902164A (en
Inventor
Cheng Xiong Xia
Masami Aoki
Original Assignee
Chugai Ro Kogyo Kaisha Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chugai Ro Kogyo Kaisha Ltd filed Critical Chugai Ro Kogyo Kaisha Ltd
Publication of TW200902164A publication Critical patent/TW200902164A/zh
Application granted granted Critical
Publication of TWI349583B publication Critical patent/TWI349583B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)
TW096145635A 2007-01-25 2007-11-30 Application device and method for detecting an air bubble in the application device TWI349583B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007015045A JP4975454B2 (ja) 2007-01-25 2007-01-25 塗布装置及び塗布装置における気泡検知方法

Publications (2)

Publication Number Publication Date
TW200902164A TW200902164A (en) 2009-01-16
TWI349583B true TWI349583B (en) 2011-10-01

Family

ID=39723125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096145635A TWI349583B (en) 2007-01-25 2007-11-30 Application device and method for detecting an air bubble in the application device

Country Status (4)

Country Link
JP (1) JP4975454B2 (zh)
KR (1) KR100952810B1 (zh)
CN (2) CN101850320B (zh)
TW (1) TWI349583B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2362102B1 (de) 2010-02-18 2012-10-03 Grundfos Management A/S Dosierpumpenaggregat
CN101954339B (zh) * 2010-10-28 2012-10-10 中天科技光纤有限公司 防止光纤涂覆产生气泡的进料系统
JP6264811B2 (ja) * 2013-09-27 2018-01-24 日本電気株式会社 塗布装置及び塗布方法
TWI554408B (zh) * 2014-03-21 2016-10-21 鴻積科機股份有限公司 可去除氣泡之膠膜貼黏裝置
KR200477660Y1 (ko) * 2015-01-22 2015-07-06 주식회사 지앤씨 반도체 생산설비의 배관 누수탐지장치
KR101927920B1 (ko) * 2016-11-24 2018-12-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN107356729A (zh) * 2017-06-20 2017-11-17 巴斯夫上海涂料有限公司 水性色漆成膜方法及其在针孔气泡性能检测中的应用
CN107596939B (zh) * 2017-10-24 2020-05-05 武汉华星光电半导体显示技术有限公司 检测装置、搅拌器及脱泡方法
CN109712125A (zh) * 2018-12-19 2019-05-03 汕头大学 一种浸渍辊涂布施涂过程产生气泡机器视觉检测方法
CN111889249A (zh) * 2019-05-05 2020-11-06 湖南迪宏物联科技有限公司 喷淋系统、控制方法及装置、喷淋设备
CN110479550A (zh) * 2019-06-11 2019-11-22 汉腾汽车有限公司 一种压力变送器在涂胶机器人系统上的应用
CN114894811B (zh) * 2022-07-12 2022-11-18 武汉鹏恒包装印务有限公司 一种包装盒照明检测装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217255A (ja) * 1985-03-22 1986-09-26 Minolta Camera Co Ltd インクジエツトポンプ
FR2619753B2 (fr) * 1986-12-10 1990-08-31 Imaje Sa Circuit d'alimentation fluide d'une tete d'impression equipee d'une cellule multifonctions comportant une chambre a volume variable
JPH01150549A (ja) * 1987-12-08 1989-06-13 Fuji Xerox Co Ltd インクジェットプリンタにおけるインク流路の気泡検出装置
JPH03161345A (ja) * 1989-11-20 1991-07-11 Canon Inc 液体噴射記録装置
JPH11260680A (ja) * 1998-03-09 1999-09-24 Dainippon Screen Mfg Co Ltd 塗布方法及び同装置
JP2000254568A (ja) 1999-03-09 2000-09-19 Hitachi Ltd 粘稠液体の加圧移送装置及びその移送方法
JP2003182116A (ja) * 2001-12-19 2003-07-03 Canon Inc インクジェット記録装置
US6848625B2 (en) * 2002-03-19 2005-02-01 Tokyo Electron Limited Process liquid supply mechanism and process liquid supply method
JP2004058531A (ja) * 2002-07-30 2004-02-26 Fuji Photo Film Co Ltd 液体吐出装置の気泡検出装置及び方法
KR20060057706A (ko) * 2004-11-24 2006-05-29 삼성전자주식회사 필터 하우징 제어장치 및 제어방법
KR100780718B1 (ko) * 2004-12-28 2007-12-26 엘지.필립스 엘시디 주식회사 도포액 공급장치를 구비한 슬릿코터
JP2006321188A (ja) * 2005-05-20 2006-11-30 Fujifilm Holdings Corp 液体吐出装置及び温度変化検出方法
KR20070007450A (ko) * 2005-07-11 2007-01-16 삼성전자주식회사 케미컬 필터상태 검출장치

Also Published As

Publication number Publication date
CN101850320B (zh) 2012-08-15
TW200902164A (en) 2009-01-16
CN101229538A (zh) 2008-07-30
KR20080070551A (ko) 2008-07-30
CN101229538B (zh) 2010-12-29
CN101850320A (zh) 2010-10-06
KR100952810B1 (ko) 2010-04-14
JP4975454B2 (ja) 2012-07-11
JP2008178817A (ja) 2008-08-07

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