TWI348162B - Memory cell structure and method of manufacturing the same, and mram cell structure - Google Patents
Memory cell structure and method of manufacturing the same, and mram cell structureInfo
- Publication number
- TWI348162B TWI348162B TW096127979A TW96127979A TWI348162B TW I348162 B TWI348162 B TW I348162B TW 096127979 A TW096127979 A TW 096127979A TW 96127979 A TW96127979 A TW 96127979A TW I348162 B TWI348162 B TW I348162B
- Authority
- TW
- Taiwan
- Prior art keywords
- cell structure
- manufacturing
- same
- memory cell
- mram
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1653—Address circuits or decoders
- G11C11/1655—Bit-line or column circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1653—Address circuits or decoders
- G11C11/1657—Word-line or row circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86873306P | 2006-12-06 | 2006-12-06 | |
US11/674,581 US7692230B2 (en) | 2006-12-06 | 2007-02-13 | MRAM cell structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200826097A TW200826097A (en) | 2008-06-16 |
TWI348162B true TWI348162B (en) | 2011-09-01 |
Family
ID=39496973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096127979A TWI348162B (en) | 2006-12-06 | 2007-07-31 | Memory cell structure and method of manufacturing the same, and mram cell structure |
Country Status (3)
Country | Link |
---|---|
US (3) | US7692230B2 (zh) |
CN (1) | CN101197345B (zh) |
TW (1) | TWI348162B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5502339B2 (ja) * | 2009-02-17 | 2014-05-28 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
US8278122B2 (en) * | 2010-01-29 | 2012-10-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming MTJ cells |
US8675397B2 (en) | 2010-06-25 | 2014-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cell structure for dual-port SRAM |
US8399931B2 (en) | 2010-06-30 | 2013-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Layout for multiple-fin SRAM cell |
US8879314B2 (en) * | 2011-06-06 | 2014-11-04 | Iii Holdings 1, Llc | Memory cell with Schottky diode |
US8772845B2 (en) | 2011-09-22 | 2014-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Technique for smoothing an interface between layers of a semiconductor device |
US9230611B2 (en) | 2011-11-04 | 2016-01-05 | Hewlett Packard Enterprise Development Lp | Structure of a switching device in an array |
US8574928B2 (en) | 2012-04-10 | 2013-11-05 | Avalanche Technology Inc. | MRAM fabrication method with sidewall cleaning |
US10096544B2 (en) * | 2012-05-04 | 2018-10-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor interconnect structure |
KR102266709B1 (ko) | 2014-09-22 | 2021-06-22 | 삼성전자주식회사 | 반도체 메모리 장치 |
KR102374642B1 (ko) | 2015-01-22 | 2022-03-17 | 삼성전자주식회사 | 자기 메모리 소자 및 그 제조 방법 |
KR102358565B1 (ko) | 2015-09-09 | 2022-02-04 | 삼성전자주식회사 | 자기 저항 소자를 포함하는 반도체 소자 |
US9842986B2 (en) * | 2015-12-15 | 2017-12-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method of forming the same |
KR20180086375A (ko) | 2017-01-20 | 2018-07-31 | 삼성전자주식회사 | 반도체 메모리 장치 |
US10784440B2 (en) * | 2017-11-10 | 2020-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Magnetic random access memory with various size magnetic tunneling junction film stacks |
JP2020035976A (ja) * | 2018-08-31 | 2020-03-05 | キオクシア株式会社 | 磁気記憶装置 |
CN111435702B (zh) * | 2019-01-14 | 2023-05-19 | 联华电子股份有限公司 | 磁阻随机存取存储单元 |
US11114606B2 (en) | 2019-09-23 | 2021-09-07 | International Business Machines Corporation | MRAM devices containing a harden gap fill dielectric material |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4037561B2 (ja) * | 1999-06-28 | 2008-01-23 | 株式会社東芝 | 半導体装置の製造方法 |
US6873023B2 (en) * | 2002-04-18 | 2005-03-29 | Kabushiki Kaisha Toshiba | Magnetic random access memory |
AU2003265062A1 (en) * | 2002-10-03 | 2004-04-23 | Koninklijke Philips Electronics N.V. | Programmable magnetic memory device |
JP3863484B2 (ja) * | 2002-11-22 | 2006-12-27 | 株式会社東芝 | 磁気抵抗効果素子および磁気メモリ |
JP2005116658A (ja) * | 2003-10-06 | 2005-04-28 | Fujitsu Ltd | 磁気抵抗メモリ装置 |
JP2005310840A (ja) * | 2004-04-16 | 2005-11-04 | Toshiba Corp | 磁気ランダムアクセスメモリ |
US6977181B1 (en) * | 2004-06-17 | 2005-12-20 | Infincon Technologies Ag | MTJ stack with crystallization inhibiting layer |
US7387961B2 (en) | 2005-01-31 | 2008-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd | Dual damascene with via liner |
-
2007
- 2007-02-13 US US11/674,581 patent/US7692230B2/en active Active
- 2007-07-31 TW TW096127979A patent/TWI348162B/zh active
- 2007-08-16 CN CN2007101410450A patent/CN101197345B/zh active Active
-
2010
- 2010-04-05 US US12/754,451 patent/US8080471B2/en active Active
-
2011
- 2011-11-30 US US13/308,065 patent/US8558297B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20120170358A1 (en) | 2012-07-05 |
US8080471B2 (en) | 2011-12-20 |
TW200826097A (en) | 2008-06-16 |
CN101197345A (zh) | 2008-06-11 |
CN101197345B (zh) | 2010-11-10 |
US20080135957A1 (en) | 2008-06-12 |
US8558297B2 (en) | 2013-10-15 |
US7692230B2 (en) | 2010-04-06 |
US20110143514A1 (en) | 2011-06-16 |
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