TWI346758B - - Google Patents

Info

Publication number
TWI346758B
TWI346758B TW096143053A TW96143053A TWI346758B TW I346758 B TWI346758 B TW I346758B TW 096143053 A TW096143053 A TW 096143053A TW 96143053 A TW96143053 A TW 96143053A TW I346758 B TWI346758 B TW I346758B
Authority
TW
Taiwan
Application number
TW096143053A
Other versions
TW200831813A (en
Inventor
Yoshifumi Amano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200831813A publication Critical patent/TW200831813A/zh
Application granted granted Critical
Publication of TWI346758B publication Critical patent/TWI346758B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW096143053A 2006-11-15 2007-11-14 Processing system, processing method and recording medium TW200831813A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006309210A JP4842771B2 (ja) 2006-11-15 2006-11-15 処理システムと処理方法および記録媒体

Publications (2)

Publication Number Publication Date
TW200831813A TW200831813A (en) 2008-08-01
TWI346758B true TWI346758B (zh) 2011-08-11

Family

ID=39401607

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096143053A TW200831813A (en) 2006-11-15 2007-11-14 Processing system, processing method and recording medium

Country Status (6)

Country Link
US (1) US8136538B2 (zh)
JP (1) JP4842771B2 (zh)
KR (1) KR101058818B1 (zh)
DE (1) DE112007002728T5 (zh)
TW (1) TW200831813A (zh)
WO (1) WO2008059799A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418812B1 (ko) * 2012-10-31 2014-07-16 크린팩토메이션 주식회사 웨이퍼 퍼지 가능한 천장 보관 장치
JP2015182351A (ja) * 2014-03-25 2015-10-22 富士フイルム株式会社 積層フィルムの製造方法
EP2944444A1 (en) 2014-05-16 2015-11-18 Meyer Burger AG Wafer processing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4795497A (en) * 1985-08-13 1989-01-03 Mcconnell Christopher F Method and system for fluid treatment of semiconductor wafers
JPH0697146A (ja) * 1992-09-16 1994-04-08 Dainippon Screen Mfg Co Ltd スチームを用いた基板処理方法
TW471031B (en) * 1997-01-08 2002-01-01 Ebara Corp Vapor feed supply system
US6248168B1 (en) * 1997-12-15 2001-06-19 Tokyo Electron Limited Spin coating apparatus including aging unit and solvent replacement unit
JP4236073B2 (ja) 2000-09-28 2009-03-11 大日本スクリーン製造株式会社 基板処理装置
JP2003224102A (ja) 2002-01-30 2003-08-08 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2003332322A (ja) 2002-03-08 2003-11-21 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2006309210A (ja) 2005-04-01 2006-11-09 Bridgestone Corp 表示媒体用粒子及びそれを用いた情報表示用パネル

Also Published As

Publication number Publication date
US8136538B2 (en) 2012-03-20
KR101058818B1 (ko) 2011-08-23
JP4842771B2 (ja) 2011-12-21
WO2008059799A1 (fr) 2008-05-22
JP2008124385A (ja) 2008-05-29
DE112007002728T5 (de) 2009-09-24
US20100154836A1 (en) 2010-06-24
TW200831813A (en) 2008-08-01
KR20080087809A (ko) 2008-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees