TWI341797B - - Google Patents

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Publication number
TWI341797B
TWI341797B TW97150807A TW97150807A TWI341797B TW I341797 B TWI341797 B TW I341797B TW 97150807 A TW97150807 A TW 97150807A TW 97150807 A TW97150807 A TW 97150807A TW I341797 B TWI341797 B TW I341797B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
resin layer
thermal transfer
layer
micro
Prior art date
Application number
TW97150807A
Other languages
English (en)
Chinese (zh)
Other versions
TW201024104A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW97150807A priority Critical patent/TW201024104A/zh
Publication of TW201024104A publication Critical patent/TW201024104A/zh
Application granted granted Critical
Publication of TWI341797B publication Critical patent/TWI341797B/zh

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  • Laminated Bodies (AREA)
  • Decoration By Transfer Pictures (AREA)
TW97150807A 2008-12-26 2008-12-26 Thermal transferring structure with micro-pattern TW201024104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97150807A TW201024104A (en) 2008-12-26 2008-12-26 Thermal transferring structure with micro-pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97150807A TW201024104A (en) 2008-12-26 2008-12-26 Thermal transferring structure with micro-pattern

Publications (2)

Publication Number Publication Date
TW201024104A TW201024104A (en) 2010-07-01
TWI341797B true TWI341797B (cg-RX-API-DMAC7.html) 2011-05-11

Family

ID=44851920

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97150807A TW201024104A (en) 2008-12-26 2008-12-26 Thermal transferring structure with micro-pattern

Country Status (1)

Country Link
TW (1) TW201024104A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
TW201024104A (en) 2010-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees