TWI341553B - Method of forming resist pattern - Google Patents

Method of forming resist pattern

Info

Publication number
TWI341553B
TWI341553B TW096128962A TW96128962A TWI341553B TW I341553 B TWI341553 B TW I341553B TW 096128962 A TW096128962 A TW 096128962A TW 96128962 A TW96128962 A TW 96128962A TW I341553 B TWI341553 B TW I341553B
Authority
TW
Taiwan
Prior art keywords
resist pattern
forming resist
forming
pattern
resist
Prior art date
Application number
TW096128962A
Other languages
Chinese (zh)
Other versions
TW200811921A (en
Inventor
Kazunori Kitamura
Kiyoshi Sato
Eiichi Inoue
Original Assignee
San Ei Kagaku Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Co filed Critical San Ei Kagaku Co
Publication of TW200811921A publication Critical patent/TW200811921A/en
Application granted granted Critical
Publication of TWI341553B publication Critical patent/TWI341553B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW096128962A 2006-08-18 2007-08-07 Method of forming resist pattern TWI341553B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006223568 2006-08-18
JP2006276892 2006-10-10
JP2007201223A JP4660826B2 (en) 2006-08-18 2007-08-01 Method for forming resist pattern

Publications (2)

Publication Number Publication Date
TW200811921A TW200811921A (en) 2008-03-01
TWI341553B true TWI341553B (en) 2011-05-01

Family

ID=38955113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128962A TWI341553B (en) 2006-08-18 2007-08-07 Method of forming resist pattern

Country Status (5)

Country Link
JP (1) JP4660826B2 (en)
KR (1) KR100892949B1 (en)
CN (1) CN101126893B (en)
DE (1) DE102007038183B4 (en)
TW (1) TWI341553B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101139561B1 (en) * 2007-05-11 2012-05-02 히다치 가세고교 가부시끼가이샤 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
JP5449688B2 (en) * 2008-03-26 2014-03-19 太陽ホールディングス株式会社 Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them
KR101383892B1 (en) * 2008-11-24 2014-04-10 삼성테크윈 주식회사 Reel to reel typed circuit substrate and the fabrication method thereof
KR101530265B1 (en) * 2009-03-12 2015-06-22 해성디에스 주식회사 Method for manufacturing printed circuit board using PSR
JP5316901B2 (en) * 2009-12-07 2013-10-16 山栄化学株式会社 Printed wiring board and manufacturing method thereof
JP5427632B2 (en) * 2010-02-08 2014-02-26 太陽ホールディングス株式会社 Laminated structure and photosensitive dry film used therefor
KR20130099219A (en) * 2010-12-28 2013-09-05 다이요 잉키 세이조 가부시키가이샤 Photocurable resin composition, dry film and cured object obtained therefrom, and printed wiring board obtained using these
JP2012256636A (en) * 2011-06-07 2012-12-27 Taiyo Holdings Co Ltd Resin composition for plating resist and multilayer printed wiring board
CN107969077B (en) * 2013-05-22 2020-02-18 三菱制纸株式会社 Method for manufacturing wiring substrate
JP5660691B2 (en) * 2013-12-02 2015-01-28 太陽ホールディングス株式会社 Manufacturing method of laminated structure and laminated structure
JP5775943B2 (en) * 2014-02-13 2015-09-09 太陽ホールディングス株式会社 Solder resist layer and printed wiring board
JP6519134B2 (en) * 2014-09-25 2019-05-29 日立化成株式会社 Photosensitive resin composition
JP6668004B2 (en) * 2015-06-09 2020-03-18 カンタツ株式会社 Circuit pattern manufacturing apparatus, circuit pattern manufacturing method, and circuit pattern manufacturing program
KR101952745B1 (en) * 2016-09-22 2019-02-27 주식회사 디텍 Ultraviolet curable solder resist ink composition having an excellent flexibility
CN106982514B (en) * 2017-05-09 2020-09-18 南方科技大学 Single-layer multi-material conductive circuit board and preparation method thereof
JP6605103B2 (en) * 2017-09-27 2019-11-13 株式会社タムラ製作所 Solder resist film pattern forming method and electronic substrate manufacturing method
CN108490738B (en) * 2018-03-22 2020-09-29 深圳市华星光电技术有限公司 Black matrix material composition and manufacturing method of black matrix
CN109243984B (en) * 2018-09-26 2020-03-10 西安明科微电子材料有限公司 Solder resisting method for IGBT aluminum silicon carbide heat dissipation substrate
KR102362335B1 (en) * 2019-12-05 2022-02-14 한국다이요잉크 주식회사 Etching resist ink composition
CN114624843B (en) * 2022-03-04 2024-04-30 上海慧希电子科技有限公司 Optical device manufacturing method
NL2032627B1 (en) * 2022-07-28 2023-11-10 Zhuhai Nengdong Tech Optical Industry Co Ltd Resistance welding dry film photoresist as well as preparation method use thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2532589B2 (en) * 1988-06-29 1996-09-11 松下電器産業株式会社 Fine pattern formation method
DE19706495B4 (en) * 1996-07-05 2006-04-27 Mitsubishi Denki K.K. Method for producing a semiconductor device using finely separated resist patterns
JP3373147B2 (en) * 1998-02-23 2003-02-04 シャープ株式会社 Photoresist film and pattern forming method thereof
JP2001201870A (en) * 1999-08-03 2001-07-27 Kansai Paint Co Ltd Pattern-forming laminate
JP2001242618A (en) * 2000-02-28 2001-09-07 Kansai Paint Co Ltd Pattern forming method
JP3952795B2 (en) * 2002-02-07 2007-08-01 ソニー株式会社 Resist film pattern forming method
US6764808B2 (en) * 2002-02-27 2004-07-20 Advanced Micro Devices, Inc. Self-aligned pattern formation using wavelenghts

Also Published As

Publication number Publication date
JP2008116910A (en) 2008-05-22
DE102007038183A1 (en) 2008-02-21
KR100892949B1 (en) 2009-04-09
JP4660826B2 (en) 2011-03-30
CN101126893A (en) 2008-02-20
KR20080016462A (en) 2008-02-21
CN101126893B (en) 2011-04-27
DE102007038183B4 (en) 2020-09-10
TW200811921A (en) 2008-03-01

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