TWI341006B - System and method for transporting substrate carriers - Google Patents

System and method for transporting substrate carriers

Info

Publication number
TWI341006B
TWI341006B TW092124036A TW92124036A TWI341006B TW I341006 B TWI341006 B TW I341006B TW 092124036 A TW092124036 A TW 092124036A TW 92124036 A TW92124036 A TW 92124036A TW I341006 B TWI341006 B TW I341006B
Authority
TW
Taiwan
Prior art keywords
substrate carriers
transporting substrate
transporting
carriers
substrate
Prior art date
Application number
TW092124036A
Other languages
English (en)
Other versions
TW200405407A (en
Inventor
R Rice Michael
C Hudgens Jeffrey
A Englhardt Eric
B Lowrance Robert
r elliott Martin
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200405407A publication Critical patent/TW200405407A/zh
Application granted granted Critical
Publication of TWI341006B publication Critical patent/TWI341006B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
TW092124036A 2002-08-31 2003-08-29 System and method for transporting substrate carriers TWI341006B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40745102P 2002-08-31 2002-08-31

Publications (2)

Publication Number Publication Date
TW200405407A TW200405407A (en) 2004-04-01
TWI341006B true TWI341006B (en) 2011-04-21

Family

ID=31496016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092124036A TWI341006B (en) 2002-08-31 2003-08-29 System and method for transporting substrate carriers

Country Status (6)

Country Link
EP (2) EP1394840B1 (zh)
JP (1) JP2004266242A (zh)
KR (1) KR101057511B1 (zh)
CN (1) CN1495118B (zh)
DE (1) DE60324746D1 (zh)
TW (1) TWI341006B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI290875B (en) * 2004-02-28 2007-12-11 Applied Materials Inc Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
JP5537947B2 (ja) * 2006-11-27 2014-07-02 テック・セム アーゲー オーバーヘッド型搬送システム用搬送装置
WO2009084101A1 (ja) * 2007-12-28 2009-07-09 Sintobrator, Ltd. 角柱状部材の研磨装置
DE102008006956B3 (de) 2008-01-31 2009-09-03 Grenzebach Maschinenbau Gmbh Portalumsetzer für großflächige Glasplatten
CN102556652A (zh) * 2010-12-31 2012-07-11 平成科贸股份有限公司 物件传输系统
CN102437077A (zh) * 2011-10-19 2012-05-02 东莞宏威数码机械有限公司 Oled基片线性传输设备
CN102522491B (zh) * 2011-12-14 2014-02-05 南京航空航天大学 具有驱动和传感能力的聚合物器件及其制备和应用
CN103531495B (zh) * 2012-07-04 2016-06-22 理想能源设备(上海)有限公司 半导体检测装置、半导体检测系统及检测衬底温度的方法
JP2017513036A (ja) 2014-11-14 2017-05-25 マッパー・リソグラフィー・アイピー・ビー．ブイ． 貨物固定システムおよびリソグラフィシステム内で基板を移送するための方法
GB2539050B (en) * 2015-06-05 2020-11-25 Tbs Eng Ltd Apparatus for stacking battery plates
NL2015784B1 (en) * 2015-11-13 2017-06-02 Mapper Lithography Ip Bv Load lock system and method for transferring substrates in a lithography system.
KR20200038040A (ko) * 2018-10-02 2020-04-10 (주)테크윙 전자부품 테스트용 핸들러
CN109955153B (zh) * 2019-04-19 2023-10-10 米巴精密零部件（中国）有限公司 一种翻转定位装置及其工作方法
DE102019206209A1 (de) * 2019-04-30 2020-11-05 Multivac Sepp Haggenmüller Se & Co. Kg SCHALENVERSCHLIEßMASCHINE SOWIE VERFAHREN ZUR SANFTEN AUFNAHME EINER SCHALE
CN110416132A (zh) * 2019-08-20 2019-11-05 上海新傲科技股份有限公司 在半导体剥离工艺中装片的方法
KR102399076B1 (ko) * 2021-09-16 2022-05-17 주식회사 엠아이티 초음파 프로브를 이용한 불량 소자 자동 검사 장치 및 이를 이용한 검사방법
CN115091249B (zh) * 2022-06-15 2023-03-21 深圳市久久犇自动化设备股份有限公司 一种数控机床生产线控制系统及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2580262B1 (fr) * 1985-04-12 1987-05-22 Efcis Installation de manutention d'objets fragiles en atmosphere a empoussierement controle
US5110249A (en) * 1986-10-23 1992-05-05 Innotec Group, Inc. Transport system for inline vacuum processing
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
US6036426A (en) * 1996-01-26 2000-03-14 Creative Design Corporation Wafer handling method and apparatus
US6183186B1 (en) * 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
US6283692B1 (en) 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
JP2002192487A (ja) 2000-12-25 2002-07-10 Seiko Epson Corp ピックアンドプレイス装置の制御方法及び該方法を適用したピックアンドプレイス装置
US6699329B2 (en) * 2001-05-25 2004-03-02 George Koch Sons, Llc Coating and curing system
US7243003B2 (en) * 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor

Also Published As

Publication number Publication date
CN1495118B (zh) 2010-08-25
EP1394840A2 (en) 2004-03-03
KR20040020829A (ko) 2004-03-09
KR101057511B1 (ko) 2011-08-17
EP1394840A3 (en) 2004-12-08
DE60324746D1 (de) 2009-01-02
JP2004266242A (ja) 2004-09-24
TW200405407A (en) 2004-04-01
EP1394840B1 (en) 2008-11-19
CN1495118A (zh) 2004-05-12
EP2019417A1 (en) 2009-01-28

Similar Documents

Publication Publication Date Title
TWI316279B (en) Systems and methods for transferring small lot size substrate carriers between processing tools
AU2003207544A8 (en) System and method for facilitating shopping
TWI341006B (en) System and method for transporting substrate carriers
AU2003243646A8 (en) System and method for facilitating ridesharing
IL169106A0 (en) Method and system for group communications
AU2002353629A8 (en) Method and system for providing contents
AU2003237197A1 (en) Method and apparatus for transporting data
HK1109525A1 (en) Single carrier transmission system and method using the same
EP1545631A4 (en) SUBSTRATE AND PROCESS FOR ANAEROBIC RESTORATION
HK1073280A1 (en) Device and method for processing carrier tape
GB2396334B (en) Slotted substrates and methods and systems for forming same
EP1632074A4 (en) METHOD AND SYSTEM FOR SUPPRESSION OF CARRIER LEAK
SG105523A1 (en) Substrate processing system and substrate processing method
AU2003261299A8 (en) Systems and methods for processing benefits
EP1536460A4 (en) DEVICE AND METHOD FOR PROCESSING A SUBSTRATE
GB2393147B (en) Slotted substrates and methods and systems for forming same
HK1068835A1 (en) Method and system for treating organic matter
GB0301948D0 (en) Slotted substrates and methods and systems for forming same
SG93901A1 (en) Substrate processing system and substrate processing method
AU2001273658A1 (en) Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers
GB2411505B (en) Item handling system and method
EP1464700A4 (en) SYSTEM AND METHOD FOR ACCOMMODATING / MACHINING A CARRIER
EP1427018A4 (en) PROCESS FOR PROCESSING AN SOI SUBSTRATE
EP1613542A4 (en) METHOD AND SYSTEM FOR DISTRIBUTION AND TRANSPORT OF A LARGE NUMBER OF OBJECTS
SG115678A1 (en) Substrate carrier and method for making a substrate carrier

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees