CN1495118B - 基片输送系统及其操作方法和基片装载站 - Google Patents
基片输送系统及其操作方法和基片装载站 Download PDFInfo
- Publication number
- CN1495118B CN1495118B CN031326951A CN03132695A CN1495118B CN 1495118 B CN1495118 B CN 1495118B CN 031326951 A CN031326951 A CN 031326951A CN 03132695 A CN03132695 A CN 03132695A CN 1495118 B CN1495118 B CN 1495118B
- Authority
- CN
- China
- Prior art keywords
- substrate carrier
- conveyer
- substrate
- carrier
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 740
- 230000007246 mechanism Effects 0.000 claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 claims abstract description 45
- 230000033001 locomotion Effects 0.000 claims description 89
- 230000013011 mating Effects 0.000 claims description 67
- 239000000725 suspension Substances 0.000 claims description 34
- 230000001133 acceleration Effects 0.000 claims description 31
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 230000000712 assembly Effects 0.000 claims description 10
- 238000000429 assembly Methods 0.000 claims description 10
- 230000000630 rising effect Effects 0.000 claims description 10
- 239000000969 carrier Substances 0.000 abstract description 19
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 230000032258 transport Effects 0.000 abstract description 6
- 230000014509 gene expression Effects 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 27
- 238000003860 storage Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 13
- 238000012546 transfer Methods 0.000 description 10
- 238000009434 installation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 244000045947 parasite Species 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40745102P | 2002-08-31 | 2002-08-31 | |
US60/407,451 | 2002-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1495118A CN1495118A (zh) | 2004-05-12 |
CN1495118B true CN1495118B (zh) | 2010-08-25 |
Family
ID=31496016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN031326951A Expired - Fee Related CN1495118B (zh) | 2002-08-31 | 2003-08-29 | 基片输送系统及其操作方法和基片装载站 |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP1394840B1 (zh) |
JP (1) | JP2004266242A (zh) |
KR (1) | KR101057511B1 (zh) |
CN (1) | CN1495118B (zh) |
DE (1) | DE60324746D1 (zh) |
TW (1) | TWI341006B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7413069B2 (en) * | 2004-02-28 | 2008-08-19 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
KR101601005B1 (ko) * | 2006-11-27 | 2016-03-08 | 테크-셈 아크티엔게젤샤프트 | 오버헤드 이송 시스템용 운송 장치 |
KR101301258B1 (ko) * | 2007-12-28 | 2013-08-28 | 신토고교 가부시키가이샤 | 각주 형상 부재의 연마 장치 |
DE102008006956B3 (de) | 2008-01-31 | 2009-09-03 | Grenzebach Maschinenbau Gmbh | Portalumsetzer für großflächige Glasplatten |
CN102556652A (zh) * | 2010-12-31 | 2012-07-11 | 平成科贸股份有限公司 | 物件传输系统 |
CN102437077A (zh) * | 2011-10-19 | 2012-05-02 | 东莞宏威数码机械有限公司 | Oled基片线性传输设备 |
CN102522491B (zh) * | 2011-12-14 | 2014-02-05 | 南京航空航天大学 | 具有驱动和传感能力的聚合物器件及其制备和应用 |
CN103531495B (zh) * | 2012-07-04 | 2016-06-22 | 理想能源设备(上海)有限公司 | 半导体检测装置、半导体检测系统及检测衬底温度的方法 |
JP2017513036A (ja) | 2014-11-14 | 2017-05-25 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | 貨物固定システムおよびリソグラフィシステム内で基板を移送するための方法 |
GB2539050B (en) * | 2015-06-05 | 2020-11-25 | Tbs Eng Ltd | Apparatus for stacking battery plates |
NL2015784B1 (en) * | 2015-11-13 | 2017-06-02 | Mapper Lithography Ip Bv | Load lock system and method for transferring substrates in a lithography system. |
KR20200038040A (ko) * | 2018-10-02 | 2020-04-10 | (주)테크윙 | 전자부품 테스트용 핸들러 |
CN109955153B (zh) * | 2019-04-19 | 2023-10-10 | 米巴精密零部件(中国)有限公司 | 一种翻转定位装置及其工作方法 |
DE102019206209A1 (de) | 2019-04-30 | 2020-11-05 | Multivac Sepp Haggenmüller Se & Co. Kg | SCHALENVERSCHLIEßMASCHINE SOWIE VERFAHREN ZUR SANFTEN AUFNAHME EINER SCHALE |
CN110416132A (zh) * | 2019-08-20 | 2019-11-05 | 上海新傲科技股份有限公司 | 在半导体剥离工艺中装片的方法 |
KR102399076B1 (ko) * | 2021-09-16 | 2022-05-17 | 주식회사 엠아이티 | 초음파 프로브를 이용한 불량 소자 자동 검사 장치 및 이를 이용한 검사방법 |
CN115091249B (zh) * | 2022-06-15 | 2023-03-21 | 深圳市久久犇自动化设备股份有限公司 | 一种数控机床生产线控制系统及方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4805759A (en) * | 1985-04-12 | 1989-02-21 | Societe Pour L'etude Et La Fabrication De Circuits Integres Speciaux Efcis | Installation and method for handling delicate objects in an atmosphere having a controlled dust content |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5110249A (en) * | 1986-10-23 | 1992-05-05 | Innotec Group, Inc. | Transport system for inline vacuum processing |
DE3702775A1 (de) * | 1987-01-30 | 1988-08-11 | Leybold Ag | Vorrichtung zum quasi-kontinuierlichen behandeln von substraten |
US6036426A (en) * | 1996-01-26 | 2000-03-14 | Creative Design Corporation | Wafer handling method and apparatus |
US6183186B1 (en) * | 1997-08-29 | 2001-02-06 | Daitron, Inc. | Wafer handling system and method |
US6283692B1 (en) | 1998-12-01 | 2001-09-04 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
JP2002192487A (ja) | 2000-12-25 | 2002-07-10 | Seiko Epson Corp | ピックアンドプレイス装置の制御方法及び該方法を適用したピックアンドプレイス装置 |
US6699329B2 (en) * | 2001-05-25 | 2004-03-02 | George Koch Sons, Llc | Coating and curing system |
US7243003B2 (en) * | 2002-08-31 | 2007-07-10 | Applied Materials, Inc. | Substrate carrier handler that unloads substrate carriers directly from a moving conveyor |
-
2003
- 2003-08-29 EP EP03255404A patent/EP1394840B1/en not_active Expired - Lifetime
- 2003-08-29 DE DE60324746T patent/DE60324746D1/de not_active Expired - Lifetime
- 2003-08-29 EP EP08018060A patent/EP2019417A1/en not_active Withdrawn
- 2003-08-29 CN CN031326951A patent/CN1495118B/zh not_active Expired - Fee Related
- 2003-08-29 TW TW092124036A patent/TWI341006B/zh not_active IP Right Cessation
- 2003-09-01 JP JP2003309155A patent/JP2004266242A/ja not_active Withdrawn
- 2003-09-01 KR KR1020030060777A patent/KR101057511B1/ko not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4805759A (en) * | 1985-04-12 | 1989-02-21 | Societe Pour L'etude Et La Fabrication De Circuits Integres Speciaux Efcis | Installation and method for handling delicate objects in an atmosphere having a controlled dust content |
Also Published As
Publication number | Publication date |
---|---|
KR101057511B1 (ko) | 2011-08-17 |
EP2019417A1 (en) | 2009-01-28 |
EP1394840A2 (en) | 2004-03-03 |
EP1394840B1 (en) | 2008-11-19 |
EP1394840A3 (en) | 2004-12-08 |
JP2004266242A (ja) | 2004-09-24 |
DE60324746D1 (de) | 2009-01-02 |
CN1495118A (zh) | 2004-05-12 |
KR20040020829A (ko) | 2004-03-09 |
TW200405407A (en) | 2004-04-01 |
TWI341006B (en) | 2011-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1495118B (zh) | 基片输送系统及其操作方法和基片装载站 | |
US7527141B2 (en) | System for transporting substrate carriers | |
US7506746B2 (en) | System for transporting substrate carriers | |
CN100552870C (zh) | 直接从移动运输装置上卸载基片载体的基片载体搬运器 | |
US7930061B2 (en) | Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback | |
US9327904B2 (en) | Apparatus and method for resorting piece goods assortments | |
EP2149516B1 (en) | Intelligent product feed system and method | |
CN100520706C (zh) | 半导体制造用竖直传送带与空中升降机组合式自动物料搬运系统 | |
US7168553B2 (en) | Dynamically balanced substrate carrier handler | |
US7684895B2 (en) | Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event | |
WO2008045375A2 (en) | Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback | |
CN1683223B (zh) | 响应意外事件从移动式传送带自动退回的晶片装载装置 | |
KR20230103118A (ko) | 군집이송을 선택적으로 수행하는 천정 반송장치 | |
CN114384877A (zh) | 一种光伏行业智慧车间制造系统及方法 | |
JP2001139147A (ja) | 包装シートの集積装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: APPLIED MATERIALS INC. Free format text: FORMER NAME: APPLIED MATERIALS, INC. |
|
CP01 | Change in the name or title of a patent holder |
Address after: American California Patentee after: Applied Materials Inc. Address before: American California Patentee before: Applied Materials, Inc. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: American California Patentee after: Applied Materials Inc. Address before: American California Patentee before: Applied Materials Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20180829 |