TWI340476B - - Google Patents

Info

Publication number
TWI340476B
TWI340476B TW092137085A TW92137085A TWI340476B TW I340476 B TWI340476 B TW I340476B TW 092137085 A TW092137085 A TW 092137085A TW 92137085 A TW92137085 A TW 92137085A TW I340476 B TWI340476 B TW I340476B
Authority
TW
Taiwan
Application number
TW092137085A
Other versions
TW200418209A (en
Inventor
Tetsushi Tamura
Tatsumi Setomoto
Nobuyuki Matsui
Masanori Shimizu
Yoshihisa Yamashita
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW200418209A publication Critical patent/TW200418209A/zh
Application granted granted Critical
Publication of TWI340476B publication Critical patent/TWI340476B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW092137085A 2003-01-30 2003-12-26 Optical semiconductor bare chip, printed circuit board, illumination unit, and illumination device TW200418209A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003022184A JP4317697B2 (ja) 2003-01-30 2003-01-30 光半導体ベアチップ、プリント配線板、照明ユニットおよび照明装置

Publications (2)

Publication Number Publication Date
TW200418209A TW200418209A (en) 2004-09-16
TWI340476B true TWI340476B (zh) 2011-04-11

Family

ID=32820683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092137085A TW200418209A (en) 2003-01-30 2003-12-26 Optical semiconductor bare chip, printed circuit board, illumination unit, and illumination device

Country Status (6)

Country Link
US (2) US7242086B2 (zh)
EP (1) EP1592071A4 (zh)
JP (1) JP4317697B2 (zh)
AU (1) AU2003296078A1 (zh)
TW (1) TW200418209A (zh)
WO (1) WO2004068595A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
CN100468792C (zh) * 2004-11-24 2009-03-11 杨秋忠 整合型发光二极管及其制造方法
JP4856463B2 (ja) 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
WO2011087168A1 (ko) * 2010-01-15 2011-07-21 삼성엘이디 주식회사 인쇄회로기판
JP5172915B2 (ja) * 2010-09-07 2013-03-27 株式会社東芝 発光装置
US9635759B2 (en) * 2013-08-16 2017-04-25 Osram Sylvania Inc. Conductor pad for flexible circuits and flexible circuit incorporating the same
CN105428510B (zh) * 2014-09-03 2018-01-30 展晶科技(深圳)有限公司 覆晶式发光二极管封装结构
US9825202B2 (en) * 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
EP3030059B1 (en) * 2014-11-12 2018-08-15 OSRAM GmbH An electronic component and corresponding mounting method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516415A (en) 1978-07-21 1980-02-05 Hitachi Ltd Diode
DE69434105T2 (de) * 1993-08-09 2005-10-20 Nippon Telegraph And Telephone Corp. Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform
US6107644A (en) * 1997-01-24 2000-08-22 Rohm Co., Ltd. Semiconductor light emitting device
EP0921577A4 (en) 1997-01-31 2007-10-31 Matsushita Electric Ind Co Ltd ELECTROLUMINESCENT ELEMENT, SEMICONDUCTOR ELECTROLUMINESCENT DEVICE, AND PROCESS FOR PRODUCING THE SAME
JP3916011B2 (ja) * 1997-02-21 2007-05-16 シャープ株式会社 窒化ガリウム系化合物半導体発光素子及びその製造方法
JP3794792B2 (ja) * 1997-07-22 2006-07-12 Ｔｄｋ株式会社 回路基板
JP3708319B2 (ja) 1998-02-03 2005-10-19 松下電器産業株式会社 半導体発光装置
JP3399440B2 (ja) 1999-04-26 2003-04-21 松下電器産業株式会社 複合発光素子と発光装置及びその製造方法
DE10010979A1 (de) * 2000-03-07 2001-09-13 Bosch Gmbh Robert Elektrische Schaltung und Substrat hierzu
JP2002094123A (ja) * 2000-09-14 2002-03-29 Citizen Electronics Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2002232016A (ja) 2001-02-07 2002-08-16 Matsushita Electric Ind Co Ltd 半導体発光素子の実装方法
JP4107814B2 (ja) 2001-07-06 2008-06-25 豊田合成株式会社 発光素子
JP3852000B2 (ja) 2001-09-28 2006-11-29 豊田合成株式会社 発光素子
EP1263058B1 (en) 2001-05-29 2012-04-18 Toyoda Gosei Co., Ltd. Light-emitting element

Also Published As

Publication number Publication date
WO2004068595A1 (ja) 2004-08-12
US7671464B2 (en) 2010-03-02
JP4317697B2 (ja) 2009-08-19
JP2004235441A (ja) 2004-08-19
EP1592071A1 (en) 2005-11-02
US20060104563A1 (en) 2006-05-18
AU2003296078A1 (en) 2004-08-23
TW200418209A (en) 2004-09-16
EP1592071A4 (en) 2009-04-08
US20070235748A1 (en) 2007-10-11
US7242086B2 (en) 2007-07-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees