TWI340176B - - Google Patents

Info

Publication number
TWI340176B
TWI340176B TW095124525A TW95124525A TWI340176B TW I340176 B TWI340176 B TW I340176B TW 095124525 A TW095124525 A TW 095124525A TW 95124525 A TW95124525 A TW 95124525A TW I340176 B TWI340176 B TW I340176B
Authority
TW
Taiwan
Application number
TW095124525A
Other languages
Chinese (zh)
Other versions
TW200710238A (en
Inventor
Yoshinobu Murakami
Hidehiko Ito
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200710238A publication Critical patent/TW200710238A/zh
Application granted granted Critical
Publication of TWI340176B publication Critical patent/TWI340176B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F04D17/168—Pumps specially adapted to produce a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
TW095124525A 2005-07-06 2006-07-05 Furnace wall mechanism and film deposition apparatus TW200710238A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005197709A JP4767605B2 (ja) 2005-07-06 2005-07-06 ハース機構及び成膜装置

Publications (2)

Publication Number Publication Date
TW200710238A TW200710238A (en) 2007-03-16
TWI340176B true TWI340176B (ko) 2011-04-11

Family

ID=37753686

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124525A TW200710238A (en) 2005-07-06 2006-07-05 Furnace wall mechanism and film deposition apparatus

Country Status (3)

Country Link
JP (1) JP4767605B2 (ko)
KR (1) KR100847684B1 (ko)
TW (1) TW200710238A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477626B (zh) * 2012-05-21 2015-03-21 Sumitomo Heavy Industries Film forming device
TWI503433B (zh) * 2013-10-08 2015-10-11 不二越股份有限公司 成膜裝置及成膜方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4633816B2 (ja) * 2008-03-31 2011-02-16 株式会社フェローテック ターゲット交換式プラズマ発生装置
JP7034976B2 (ja) * 2019-03-18 2022-03-14 Ｔｏｗａ株式会社 ワーク保持部及びワーク保持部回転ユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4048462A (en) 1975-01-17 1977-09-13 Airco, Inc. Compact rotary evaporation source
JPS6169963A (ja) 1984-09-14 1986-04-10 Anelva Corp 蒸着用電子銃装置
US5186975A (en) 1987-10-14 1993-02-16 Enichem S.P.A. Process and machinery for step-and-repeat vacuum-deposition of large-area thin-film-electronics matrix-circuits on monolithic glass panes through small perforated metal masks
US5324366A (en) 1991-08-09 1994-06-28 Caterpillar Inc. Heat treat furnace system for performing different carburizing processes simultaneously
JP3189042B2 (ja) * 1997-07-24 2001-07-16 住友重機械工業株式会社 真空成膜の材料供給装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477626B (zh) * 2012-05-21 2015-03-21 Sumitomo Heavy Industries Film forming device
TWI503433B (zh) * 2013-10-08 2015-10-11 不二越股份有限公司 成膜裝置及成膜方法

Also Published As

Publication number Publication date
TW200710238A (en) 2007-03-16
KR100847684B1 (ko) 2008-07-23
KR20070005484A (ko) 2007-01-10
JP4767605B2 (ja) 2011-09-07
JP2007016269A (ja) 2007-01-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees