TWI339780B - Stripper - Google Patents

Stripper

Info

Publication number
TWI339780B
TWI339780B TW095126667A TW95126667A TWI339780B TW I339780 B TWI339780 B TW I339780B TW 095126667 A TW095126667 A TW 095126667A TW 95126667 A TW95126667 A TW 95126667A TW I339780 B TWI339780 B TW I339780B
Authority
TW
Taiwan
Prior art keywords
stripper
Prior art date
Application number
TW095126667A
Other languages
English (en)
Other versions
TW200710610A (en
Inventor
Robert L Brainard
Robert L Auger
Joseph F Lachowski
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200710610A publication Critical patent/TW200710610A/zh
Application granted granted Critical
Publication of TWI339780B publication Critical patent/TWI339780B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
TW095126667A 2005-07-28 2006-07-21 Stripper TWI339780B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70340905P 2005-07-28 2005-07-28

Publications (2)

Publication Number Publication Date
TW200710610A TW200710610A (en) 2007-03-16
TWI339780B true TWI339780B (en) 2011-04-01

Family

ID=37499892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126667A TWI339780B (en) 2005-07-28 2006-07-21 Stripper

Country Status (6)

Country Link
US (1) US7723280B2 (zh)
EP (1) EP1755003B1 (zh)
JP (1) JP5015508B2 (zh)
KR (1) KR101295193B1 (zh)
CN (1) CN1916772B (zh)
TW (1) TWI339780B (zh)

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WO2006081406A1 (en) * 2005-01-27 2006-08-03 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
JP4909908B2 (ja) * 2005-02-25 2012-04-04 イーケイシー テクノロジー インコーポレーテッド 銅とｌｏｗ−ｋ誘電材料を有する基板からレジスト、エッチング残渣、及び酸化銅を除去する方法
TW200722505A (en) * 2005-09-30 2007-06-16 Rohm & Haas Elect Mat Stripper
US7632796B2 (en) * 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
US8263539B2 (en) 2005-10-28 2012-09-11 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and methods for its use
US9329486B2 (en) 2005-10-28 2016-05-03 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
TW200734448A (en) * 2006-02-03 2007-09-16 Advanced Tech Materials Low pH post-CMP residue removal composition and method of use
US20070191243A1 (en) * 2006-02-13 2007-08-16 General Chemical Performance Products, Llc Removal of silica based etch residue using aqueous chemistry
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KR20090072546A (ko) * 2007-12-28 2009-07-02 삼성전자주식회사 포토레지스트 제거용 조성물 및 이를 이용한 어레이 기판의제조 방법
CN101364055B (zh) * 2008-09-17 2011-11-09 电子科技大学 正性光敏聚酰亚胺光刻胶用中性显影液
CN102197124B (zh) 2008-10-21 2013-12-18 高级技术材料公司 铜清洁及保护调配物
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JP5817139B2 (ja) 2011-02-18 2015-11-18 富士通株式会社 化合物半導体装置の製造方法及び洗浄剤
US8889609B2 (en) * 2011-03-16 2014-11-18 Air Products And Chemicals, Inc. Cleaning formulations and method of using the cleaning formulations
KR101978514B1 (ko) * 2012-10-05 2019-05-14 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
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US9158202B2 (en) * 2012-11-21 2015-10-13 Dynaloy, Llc Process and composition for removing substances from substrates
SG11201603122XA (en) * 2013-10-21 2016-05-30 Fujifilm Electronic Materials Cleaning formulations for removing residues on surfaces
KR20230129193A (ko) 2013-12-06 2023-09-06 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 잔류물 제거용 세정 제형
US10490417B2 (en) 2014-03-18 2019-11-26 Fujifilm Electronic Materials U.S.A., Inc. Etching composition
KR102223781B1 (ko) * 2015-01-22 2021-03-05 동우 화인켐 주식회사 경화 고분자 제거용 조성물
JP6612891B2 (ja) 2015-03-31 2019-11-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 洗浄配合
AU2017221372B2 (en) 2016-02-18 2019-04-18 Ecolab Usa Inc. Solvent application in bottle wash using amidine based formulas
EP3480288A1 (en) * 2017-11-07 2019-05-08 Henkel AG & Co. KGaA Fluoride based cleaning composition
IL301529A (en) 2018-03-28 2023-05-01 Fujifilm Electronic Mat Usa Inc cleaning products
CN114269892B (zh) * 2019-08-27 2024-02-23 株式会社力森诺科 组合物、及粘接性聚合物的清洗方法
CN114450388A (zh) * 2019-09-27 2022-05-06 弗萨姆材料美国有限责任公司 用于去除蚀刻残留物的组合物及其使用方法和用途
FR3122664A1 (fr) * 2021-05-05 2022-11-11 Dehon Composition de defluxage d’assemblages electroniques
CN113589662B (zh) * 2021-07-30 2022-07-12 浙江奥首材料科技有限公司 一种组合物、剥离液及其在剥离光刻胶或光刻胶残余物中的应用和剥离方法

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Also Published As

Publication number Publication date
JP5015508B2 (ja) 2012-08-29
EP1755003B1 (en) 2012-04-18
US20070066502A1 (en) 2007-03-22
KR101295193B1 (ko) 2013-08-12
CN1916772A (zh) 2007-02-21
EP1755003A1 (en) 2007-02-21
KR20070015051A (ko) 2007-02-01
US7723280B2 (en) 2010-05-25
JP2007128038A (ja) 2007-05-24
CN1916772B (zh) 2010-08-11
TW200710610A (en) 2007-03-16

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