TWI337371B - - Google Patents
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- Publication number
- TWI337371B TWI337371B TW96120519A TW96120519A TWI337371B TW I337371 B TWI337371 B TW I337371B TW 96120519 A TW96120519 A TW 96120519A TW 96120519 A TW96120519 A TW 96120519A TW I337371 B TWI337371 B TW I337371B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- pressure equalizing
- pressing unit
- ring surface
- mounting ring
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 49
- 238000003825 pressing Methods 0.000 claims description 29
- 238000000465 moulding Methods 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000010953 base metal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96120519A TW200849319A (en) | 2007-06-07 | 2007-06-07 | Uniformly pressurizing device for micro-nano transfer printing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96120519A TW200849319A (en) | 2007-06-07 | 2007-06-07 | Uniformly pressurizing device for micro-nano transfer printing |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200849319A TW200849319A (en) | 2008-12-16 |
TWI337371B true TWI337371B (enrdf_load_stackoverflow) | 2011-02-11 |
Family
ID=44824138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96120519A TW200849319A (en) | 2007-06-07 | 2007-06-07 | Uniformly pressurizing device for micro-nano transfer printing |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200849319A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI395655B (zh) * | 2009-01-16 | 2013-05-11 | Chenming Mold Ind Corp | Microstructure forming device and method thereof |
-
2007
- 2007-06-07 TW TW96120519A patent/TW200849319A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200849319A (en) | 2008-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |