TWI334761B - Circuit connecting process and structure thereof - Google Patents

Description

1334761 0612003 23125twf.doc/p IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board, and more particularly to a line connection process and a structure thereof. 'Prior art

The line connection structure is commonly used on double-panel and multi-layer board type printed circuit boards for electrically connecting patterned layer layers of different layers. As mentioned in the special announcement No. J23U66 "Line Connection Structure and Its Process", since the conductive holes are mostly formed by the laser hole forming process, they become, but the depth is too deep (about _陴). The aspect ratio (depth/width ratio) of the ^ hole is too high, and the conduction = inside the conductive hole. When the thickness of the conductive film continues to increase; near the bottom of the conductive hole at the top of the sin-conducting hole, a near-conducting line connection structure and its light-weight patent are proposed.

The depth of the hole is relative to the money, so that in the case of a change, the conductive film prevents voids or bubbles from being formed. The vertical and horizontal holes of the electric holes are relatively small to be effective. However, the above patent can only cover the depth of a conductive hole and still have a thickness of one h, and the thickness of one side of the double-panel is limited as a conductive pad. In addition, the above patents are applicable to buried circuits. It is only applicable to non-buried lines, and it is not possible. [Invention] The present invention provides a line connection process and a structure thereof, which can reduce two

1334761 0612003 23125twf.doc/p Depth or bubble of conductive holes between circuit layers. This is a circuit connection process, including the following steps: - connection layer, the connection layer includes a core layer With the hole pad and the second hole in the core two -

The second hole is electrically conductive; providing a first conductive dielectric layer, at least one whistling layer, at least one first conductive layer, the second dielectric layer: and the second conductive layer; The second conductive layer, the second and second dielectric layers, and the second conductive layer and the first conductive layer are opposite to the first hole, and are formed on the second dielectric layer. - an opening; corresponding to the second opening; the layer and the second dielectric layer forming a -first conductive material in the first opening, in the hole to form a second conductive '. a second conductive material in the second opening

In order to prevent the occurrence of voids during the coating: a two-layer layer, a first layer, the connecting layer has a core layer and a second conductive connection layer through the core layer, y = independent connection pad, the independent On the two surfaces of the core layer, the first hole pad and the second hole pad are turned on. The first dielectric layer is disposed at the core: c the second hole pad is electrically connected to the first hole pad. #带一表面, and having a further configuration, and having a second dielectric layer disposed in the core layer pillar. The first conductive layer is disposed on one of the second conductive layers on the first aperture And electrically connected to the first conductive 1334761 0612003 23125 twf.doc/p column. The second conductive layer is disposed on the second dielectric layer and electrically connected to the second conductive pillar. In one embodiment, the first opening and the second opening comprise a laser hole, a plasma hole or a mechanical hole. In one embodiment of the invention, the first conductive layer has a first hole pad a first annular pad, the first annular pad is buried in the first when the first conductive layer is pressed onto the first dielectric layer In addition, the second conductive layer has a second annular pad corresponding to the second hole pad, and the second annular pad is embedded in the second conductive layer on the second dielectric layer. In the second dielectric layer, the present invention further provides a line connection process, comprising the steps of: firstly, providing a connection layer, the connection layer comprising a core layer and at least one independent connection pad, the independent connection pad passing through the core a first hole pad and a second hole pad are respectively formed on the two surfaces of the core layer, wherein the first hole pad is electrically connected to the second hole pad; then, a first conductive layer is provided, At least one first dielectric layer, at least one second dielectric layer, and a second conductive layer; pressing the first conductive layer, the first dielectric layer, the connection layer, the second dielectric layer, and the first a second conductive layer to form a plurality of plates; corresponding to the first hole pad, forming a first opening penetrating through the first conductive layer and the first dielectric layer; corresponding to the second hole pad, forming through the first a second conductive layer and a second opening of one of the second dielectric layers; thereafter, Forming a first conductive material in the first opening to form a first conductive pillar; forming a second conductive material in the second opening to form a second conductive pillar. The invention further provides a line connection The structure comprises a connection layer, a 7 1334761 0612003 23125 twf.doc/p first dielectric layer, a second dielectric layer, the connection layer has a core layer and a second conductive connection passes through the core a layer, and a two-hole connection, the single hole is formed on the surface of the core layer, and the second surface of the core layer is disposed on the surface of the core layer The other surface of the layer, and:: a conductive column. The second dielectric layer is disposed on the second dielectric layer. The first conductive layer is placed on the second hole pad, and the column is electrically connected. ^ is connected to and electrically connected to the second conductive post. s ^罘一"Electrical layer The present invention uses a separate connection between the two patterned circuit layers to achieve a relatively small degree of conduction and an aspect ratio, and a deep rise of the conductive column Shouting the film's yield. The above features and preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. FIG. 1A to FIG. 1 are the first embodiment of the present invention. Schematic diagram of the structure: the shirt phase: ^ example of the line connection process and the straight cup y ^ test money provided - the connection layer 100, A includes a core layer 110 and an independent core layer 110 for the tree furnace m into +, (number Not limited.)

==: the upper and lower surfaces of the layer 110, and respectively form a Z-hole pad 124 on the core layers π 〇 (1), Π 4. It can be seen from Fig. 1 that the distance between the first hole=face is the thickness of the core layer 。. In the present two = W4/61 0612003 23125 twf.doc/p, the first hole pad i22 and the second hole 124 are covered. The two-sided copper wire plate is formed into a plurality of pairs (four) one (four) and two holes 塾m, each pair of first holes φ, and then the conductive pillars 126 penetrating the core layer 110 are electrically connected to FIG. 1A. Show the independent connection pad 12〇. Press to form

Then, please refer to FIG. 1B and FIG. 2c to provide: 3〇, −-dielectric layer 14G, second dielectric layer 15Q, and a first J layer 160, and contact the first conductive layer 130, A dielectric layer 'conductive, junction layer, second dielectric layer 15G and s corresponding to the via-hole pad 122, and the second conductive layer pair may have a second ring

:, 丄 62' corresponds to the second aperture 124. The first annular crucible 132 is pressed into the first dielectric layer 140, and the second annular pad 162 can also be buried in the second dielectric layer 150 in one pass, thereby forming a double with buried lines. Face 16 is fine. In this embodiment, since the connection layer is a medium for connecting the first and second conductive layers 130 and 160, and no special line pattern is required, the area of the first/second aperture pads 122 and 124 is adjusted. And greater than or equal to the area of the / / second annular pads 132, 162, so that the requirements for interlayer alignment can be relaxed. / Next, please take McCaw 1D, when the double-panel 200 is pressed, step 2, 'right? a first opening 134 is formed through the first conductive layer and the first dielectric layer 140 at a position of the first hole pad 122 such that the bottom of the first opening exposes the first hole pad H, corresponding to the second The position of the hole pad 4 forms a second opening 164 extending through the second conductive layer 16 and the second dielectric layer 15〇0612003 23125twf.doc/p to make the second opening?丨] (4). Form the first -, second: = = ==: mechanical drilling, etc., but other light

It should be noted that after the first opening on the conductive layer (10) is formed, the first opening is formed by the laser. The wide yield of 134 is comparable to the aperture of the (-)th pad 132. Since the width of the first opening 134 formed by the laser is uniform, the aspect ratio (depth/width ratio) is also reduced as the depth of the second opening 134 becomes smaller. Bran II, in contrast to the prior art, there are three dielectric layers between the first conductive layer n◦ and the second conductive layer (10), that is, the first dielectric layer 14Q and the core layer ιι 〇 dielectric layer 150 Therefore, the spacing D between the first conductive layer 13 〇 and the second conductive layer 16 得 is larger than that of the conventional two-layer dielectric layer to effectively solve the problem of leakage current. In addition, the present invention adopts a separate connection pad 12 设有 provided with a first/first aperture on both sides, so that the first and second apertures 134, 164 ^ can be reduced in depth ' and the first and second apertures 134, The depth of 164 is only one third of the first lead or more than the bottleneck and limitation of the prior art. Next, referring to FIG. 1E and FIG. 1F, the first conductive material is filled in the first opening 134 to form A first conductive pillar 136 electrically connected to the first conductive layer 13(). Similarly, a second conductive material is filled in the second opening 164 to form a second conductive pillar 166 electrically connected to the second conductive layer 160. The first and second conductive materials are, for example, steel, silver or a suitable material having a resistance less than that of the second conductor 10 1334761 0612003 23125 twf.doc/p electrical layer and electrical connection. Forming first and second conductive pillars 136, 16 conductive material on the first conductive layer 13〇, the second conductive layer 垫^=pad 122, and the second hole pad 124 (as shown in FIG. 1), or The selective electroplating/printing of the conductive material is performed on the first, second, fourth, fourth, and fourth, after the plating, the copper layer is thinned, and the second line pattern is as shown in FIG. 1F/132. a second annular pad 162. The second layer of the steel layer is thinned by the second surface, the second conductive layer 130, and the electrical material 上方 above it, or the first and second conductive reeds are selectively etched. The required (10) road pattern / 1D 1 connection process with the description of the pattern is completed in sequence. The mine hole with H Ε and the copper layer of Figure 1F are thinned, but the process of changing the process is changed. In addition, although the present invention uses the first and second conductive layers m and the lake of the double layer as an example, it can also be used as a conductive layer of a single layer, and can be used as a complete conductive connection. 2:1: This issue: The month is not limited to the application on the buried line, and may also be the I-in (external) line or a combination of the two. ~ In the above first embodiment 'The connection layer 100 with the first hole and the second hole 塾m on both sides can also be changed. The variation of FIG. 2: the first hole 塾 1 (10) the second hole two: ί 1334761 0612003 23125 twf.doc / p The electric column 126' deviates from the first Open hole] 34 fish sample, the first opening 134 and the central axis of the first opening 164. The position of the same to the opening 64 can also be changed as appropriate, and the rest of the structure is as described in the embodiment - the embodiment is no longer 3A_ : 3F: The line connection process of the second embodiment of the present invention, and the m and tea test chart 3A, firstly provide a connection layer, which includes a core layer 310 and an independent connection port 320 (the number is not limited).

^ Same as the connection layer of the independent connection pad 12Q. In FIG. 3A, the 佯-- flute + a, (four) one--person + conductive layer 330, a first dielectric layer, a " electrical layer 350 and a second conductive layer 36〇, and continue The first conductive layer 330, the first dielectric layer (10), the connection layer, the second dielectric layer 351, and the second conductive layer 36G are laminated to form the double panel 400.

/ Next, please refer to FIG. 3C for tea, and after completing the pressing step of the double panel 4', corresponding to the position of the first-hole pad 322, forming the first through the first conductive layer 330 and the first-dielectric layer 34- The hole 334 is opened such that the bottom of the first opening 334 exposes the first hole pad 322. Similarly, corresponding to the position of the second hole pad 324, the second opening 364 is formed through the second conductive layer 36 and the second dielectric layer 35, so that the bottom of the second opening 364 reveals the second hole pad. 324. The manner of forming the first and second openings 334, 364 is, for example, a laser hole, a plasma hole or a mechanical hole, but other photolithography techniques or chemical etching techniques are also applicable. It should be noted that the present invention adopts a separate connection pad 320 with a first/second aperture pad on both sides, which can make the depths of the first and second openings 334 and 364 smaller. Limitation, which in turn increases the yield of the coating. Next, referring to FIG. 3D, the first conductive material is filled in the first opening 1334761 0612003 23125 twf.d〇c/p hole 334 to form a first conductive pillar 336 electrically connected to the first conductive layer 330. Similarly, the second conductive material is filled in the second opening 3 to form a second conductive pillar 366 electrically connected to the second conductive layer 360. The first and second conductive materials are, for example, copper, silver or a suitable material having a resistance equal to or less than the conductive layer and the electrical connection pads. Thereafter, referring to FIG. 3E, the first conductive layer 33 and the conductive material thereon are patterned to form a first line pattern 33A, and the first line pattern 330a is, for example, an exposed pad and/or line. In addition, the second conductive layer 360 and the conductive material ′ above it are patterned to form a second circuit pattern; and the lines are patterned such as exposed fresh sputum and/or lines. In another embodiment of the present invention, a multilayer circuit board having the line connection structure of the present invention may be selectively retained or subtracted in another embodiment of the present invention. At the time of the line connection process i of one of the two embodiments, at least the upper layer of the slaughter line connection structure line 53 is produced. In the circuit of the present invention, the four-layer, six-layer or eight-layer circuit of the multi-layer circuit board, such as the wafer, the electric salt, and the electric upper layer patterned circuit, are arranged to transmit the electric ball, the electric glue, The interface and the structure of the present invention have the following 13 H > 1334761 0612003 23125 twf.doc/p advantages: (1) The present invention can, the % aspect ratio of the small laser into a hole To prevent the production of pores or bubbles by the amine. (2) The present invention can be electrically connected to two conductive pillars located between two patterned circuit layers by using independent pads provided with first/second aperture pads on both sides, because the depth and aspect ratio of the two conductive pillars are relatively Smaller, and thus better to improve the coating (3) The present invention can also be used to connect layers with independent connecting pads on one side, so that the depth of the opening can be reduced to reduce the aspect ratio of the opening. (4) In addition to electrically connecting the upper and lower conductive layers, the connection layer is :==_sity' and increases the spacing between the upper and lower conductive layers. The depth of the conductive holes is only the first conductive layer and the second neck. And restrictions. The bottle of the whispering technique is not sacred, and when some changes can be made and the present invention has been disclosed in the preferred embodiment as above, the bran defines the invention, and any prior art has the usual knowledge = to retouch The protection of the present invention is based on the scope of the patent application, which is defined by the scope of the patent application. [Brief Description] The present invention is the present side-implementation scale connection process and FIG. 2 is a schematic view of a variation of the first embodiment. 14 1334761 0612003 23125twf.doc/p FIG. 3A to FIG. 3E are schematic views of the structure thereof. The present invention relates to a line connection process of the second embodiment of the present invention and a multilayer circuit board having the line connection structure of the present invention.

100: connection layer 112, 114: upper and lower surface 122: first aperture 塾 126 ' 126': conductive pillar 132: first annular pad 136: first conductive pillar 150: second dielectric layer 162. Shape 166: second conductive guinea 300: connecting layer 32 〇: independent 辏 pad 330a. 弟一略略 pattern 336: conductive 桎μ 350: second dielectric layer 360a. first edge although pattern 366: second conductive column 510: upper layerization line 530: lower layer picture line W: width 110: core layer 120: independent connection 塾 124: second hole pad 130: first conductive layer 134: first opening 140: first Electrical layer 160: second conductive layer 164: second opening 200, 40: double panel 310. core layer 330: first conductive layer 334: first opening 340: first dielectric layer 360: second conductive layer 364: second opening 500: multilayer wiring board 520 · line connection structure D: spacing 15

Claims (1)

Year nfhr day repair (more) Γ 皆 all page ____ 席 丨 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 99 At least one independent connection pad, the independent connection pad passes through the core layer, and respectively forms a first aperture and a second aperture on the two surfaces of the core layer, wherein the first aperture pad and the second aperture pad Electrically conducting; and providing a first conductive layer, at least one first dielectric layer, at least one second dielectric layer, and a second conductive layer, wherein the first conductive layer has a corresponding corresponding to the first hole pad a first ring-shaped, (10) second conductive layer having a second annular pad corresponding to the second hole pad; pressing the first conductive layer, the first dielectric layer, the connecting layer, the second dielectric a layer and the second conductive layer to form a plurality of plates; corresponding to the first hole pad, forming an m-hole through the first conductive layer and the first-dielectric layer, wherein the first lion thief should be exposed to the first One end of an opening; - corresponding to the second hole pad 'forming through the second conductive layer and the first a hole 'where the second ring is electrically conductively conductive material in the first opening hole' to form a first conductive material into a second conductive material in the second opening to form a second 2. The wire described in the second item includes a patterned first conductive layer and the first conductive material which is connected to each other to form a first line pattern of 1334476 99-7.15. 3. The circuit of claim 2, wherein the patterning the second conductive layer and the second pass thereon is further comprising a second line pattern.枓, to form 4· as described in the scope of the patent application, the line connected to the first hunger or machine _ hole shape 2 5 · such as the line connection fee described in item 1 of the patent range, the second opening The holes are formed by laser-forming holes, plasma hunger or the wiring of the circuit as described in the scope of the patent application. The first annular pad is pressed into the first conductive layer in the first dielectric layer. (4) 7.t. The wire-joining shoe according to item 1 of the patent application scope is filled with the first technical pad (4) and the second conductive layer is buried in the second dielectric layer. In the case of the electric layer, there is a line connection structure, including: a connection layer 'having a core layer and at least independent connections through the core layer On the two surfaces of the core layer, wherein the first and the - pupil pads are electrically conductive; the apertures and the second: the first dielectric layer are disposed on one of the core layers, and are disposed in the first opening The hole is located at: there is a transmission 'one of the deep holes of the first opening, the first: the far side of the layer: the side of the layer toward the first hole = = the first layer, disposed in the core layer Another-surface' and having a second opening of 1334476 99-7-15 and a second conductive pillar disposed in the second opening and located on the second aperture pad, wherein the second opening _degree/width The ratio is gradually increased from the side of the second dielectric layer away from the connection layer toward the second hole pad; a first conductive layer is disposed on the first dielectric layer, and the first conductive layer is electrically connected And a second conductive layer disposed on the second dielectric layer and electrically connected to the second conductive pillar. The circuit connection structure of claim 8, wherein the first conductive layer has a first annular pad corresponding to one of the first hole pads. 10. As described in claim 8 The line connection structure, wherein the second conductive layer has a second annular pad corresponding to one of the second aperture pads. 11. The line connection structure of claim 8, wherein the first conductive layer and the conductive material thereover have a first line pattern corresponding to the first pad. 12. The line connection structure of claim 2, wherein the second conductive layer and the conductive material thereover have a second line pattern corresponding to one of the second & pads. 13. A line connection structure comprising: a connection layer having a core layer and at least one independent connection pad, the independent connection passing through the core layer and having a first aperture and a second aperture On the two surfaces of the core layer, the first hole pad and the second hole pad are electrically connected; a first dielectric layer disposed on a surface of the core layer and having a first opening and a configuration a first conductive pillar in the first opening and located on the first hole pad, 1333476 99-7-15; a second dielectric layer disposed on the other surface of the core layer and having a second opening a second conductive pillar disposed in the second opening and located on the second aperture pad; a first conductive layer 'disposed on the first dielectric layer' and electrically connected to the first conductive pillar The first conductive layer has a first annular pad corresponding to the first hole pad; and a second conductive layer disposed on the second dielectric layer and electrically connected to the second conductive column Wherein the second conductive layer has a second ring corresponding to one of the second aperture pads pad. 14. The line connection structure of claim 13, wherein the first conductive layer and the conductive material thereover have a first line pattern corresponding to one of the first aperture pads. 15. The line connection structure of claim 13, wherein the second conductive layer and the conductive material thereover have a second line pattern corresponding to one of the second aperture pads. •9