TWI505757B - A circuit board with embedded components - Google Patents

Description

Circuit board with embedded components

The invention relates to a circuit board with embedded components, in particular to a circuit board which is applied to an embedded component, can reduce the contact area, and is favorable for high density and fine circuit fabrication.

In general, the circuit substrate is mainly composed of a plurality of patterned patterned circuit layers and a dielectric layer alternately stacked. Wherein, the patterned circuit layer is formed by a copper foil layer through a lithography and etching process, and a dielectric layer is disposed between the patterned circuit layers for isolating the patterned circuit layer. In addition, the stacked patterned circuit layers are electrically connected to each other through a through hole (PTH) or a conductive via that penetrates the dielectric layer. Finally, various electronic components (active components, passive components) are disposed on the surface of the circuit substrate, and the circuit design of the internal circuit achieves the purpose of electrical signal propagation.

However, as the market needs to be light, short, and portable for electronic products, in the current electronic products, the electronic components originally soldered to the circuit board are designed as an embedded component that can be buried inside the circuit board. Embedded component board technology improves passive component performance, reduces passive component count, and reduces board area occupied by passive components. Therefore, the integration of the embedded component circuit board technology can be used to replace the traditional discrete passive components, such as capacitors, resistors and inductors, which have the advantages of reducing the number of separate passive components and reducing the related production of the products. With the cost of testing, Reduce the number of solder joints of passive components, improve product density and reliability.

In the buried component circuit board technology, in order to increase the wiring area, the multilayer circuit board uses more conductive layers and holes for embedding passive components, such as vias, buried vias, or blind vias ( Blind vias) and so on. As shown in the first figure, the structure of the multi-layer circuit board is shown. The via hole 11 is usually pierced through the circuit board 13 in which the embedded component 12 is buried, but the length is long, so that the via holes 11 are not filled. Voids or keyholes are difficult. Conventionally, electroless copper may be used to align the via holes with a seed layer of a metal such as copper, and then coat the seed layer by electroplating. Since the length of the via hole is long, it is more difficult to make the plating material lining or filling the via hole without voids, voids or keyholes, and the void, void or keyhole has an adverse effect on the conductivity of the via hole, and Maintaining a certain aspect ratio (the height or length of the via hole and the ratio of the width or the diameter) is relatively large in width or diameter, so that the solder pads 14 exposed on the circuit board are also relatively large in area, which is disadvantageous for high density and fine lines. Production.

In view of the above, the present invention provides a circuit board which can be applied to an embedded component, can reduce the contact area, and is advantageous for high density and fine circuit fabrication, and is its main purpose.

In order to achieve the above, at least one embedded component is disposed in the circuit board of the present invention, and at least one pad structure is embedded in the circuit board, and the pad structure is provided with at least one conductive via hole, and the circuit can be connected The contact of the board is to solve the problem that the distance between the contacts caused by the embedded components is far, which causes the conduction, and the invention can reduce the aperture and the contact area of the hole, which is beneficial to the high density and the fine line. Production.

According to the above main structural features, the circuit board includes at least: a first substrate, a second substrate, a buried component, and a padded structure, wherein the first substrate is respectively provided with a first surface opposite to the first surface and the second surface a second patterned circuit layer, the first and second patterned circuit layers are provided with at least one contact; the second substrate is provided with opposite third and fourth surfaces, and the fourth surface is disposed on the first surface And covering the first patterned circuit layer, the third surface is provided with a third patterned circuit layer, the third patterned circuit layer is provided with at least one contact; the embedded component is embedded in the first The second substrate is embedded in the second substrate; the high structure is embedded in the second substrate, the high structure is provided with at least one conductive via, and the first patterned circuit layer and the first The junction of the three patterned circuit layers.

According to the above main structural features, the pad structure is provided with a substrate, and the substrate is respectively provided with a conduction line opposite to the fifth and sixth surfaces, and the conductive via is electrically connected to the fifth and sixth surfaces. The lines, and the conductive lines of the fifth and sixth surfaces are respectively connected to the contacts.

The embedded components described above may be packaged semiconductor or unpackaged bare wafers.

According to the above main structural features, the third surface of the second substrate may further be provided with a third substrate.

According to the above main structural features, the embedded component is connected to a junction of the first patterned circuit layer.

According to the above main structural features, the second substrate may be provided with an opening for receiving the embedded component.

According to the above main structural features, the embedded component and the height structure may be Firstly disposed on the first surface, and then press-bonding a resin material to cover the embedded component and the padding structure to form a second substrate.

The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments.

As shown in the second embodiment of the circuit board of the present invention, at least one embedded component 21 is disposed in the circuit board 20 of the present invention, and at least one pad structure 22 is embedded in the circuit board 20, The padded structure 22 is provided with at least one conductive through hole 221, and can be connected to the contact 30 on the upper and lower surfaces of the circuit board to solve the problem that the distance between the upper and lower surface contacts is long, and the conduction is difficult. The invention can reduce the contact area, and is advantageous for the production of high density and fine lines.

In the overall implementation, the circuit board 20 includes at least a first substrate 23, a second substrate 24, a buried component 21, and a pad structure 22, wherein the first substrate 23 is opposite to the first and second surfaces 231 and 232, respectively. The first and second patterned circuit layers are provided with at least one contact 30; the second substrate 24 is provided with opposite third and fourth surfaces 241, 242, the fourth surface 242 is disposed on the first surface 231 and covers the first patterned circuit layer 233. The third surface 241 is further provided with a third patterned circuit layer 243. The circuit layer is provided with at least one contact 30; the embedded component 21 is embedded in the second substrate 24 and connected to the contact 30; wherein the embedded component 21 can be a packaged semiconductor or unpackaged The bare wafer, as shown in the embodiment, is connected to the junction of the first patterned wiring layer 233.

The pad structure 22 is embedded in the second substrate 24, please Referring to the third embodiment, the pad structure 22 is provided with a substrate 222. The substrate 222 is respectively provided with a conduction line 225 opposite to the fifth and sixth surfaces 223 and 224. The conductive via 221 is electrically connected. Connecting the fifth and sixth surface conduction lines 225, the fifth and sixth surface conduction lines 225 respectively connecting the first patterned circuit layer and the third patterned circuit layer contact 30; As shown in the figure, a conductive via 221 is defined between the conductive line 225 and the contact 30.

Furthermore, as shown in the second embodiment of the fourth figure, the third surface 241 of the second substrate may further be provided with a third substrate 25, which may increase the line configuration; of course, the second surface of the first substrate or the first The third surface of the second substrate may further be provided with other electronic components. As shown in the third embodiment of the fifth figure, the second surface 232 of the first substrate may be provided with other electronic components 40, or the first substrate. The second surface may further have a fourth substrate (not shown) of the embedded component.

When the invention is formed, an opening may be formed at a specific position of the second substrate for receiving the embedded component; or the embedded component and the height-up structure may be first disposed on the first surface, and then pressed A resin material or prepreg covers the buried component and the padding structure to form a second substrate.

The present invention has the following advantages over the conventional circuit board system:

1. It can solve the problem that the distance between the contacts caused by the embedded components is far away and the conduction is caused.

2. The invention can reduce the contact area under the fixed aspect ratio, which is beneficial to the production of high density and fine lines.

3. The pad structure may form a retaining wall to protect the embedded component during the process of forming the second substrate by pressing the resin material.

4. The padding structure can be soldered simultaneously with the component in the same assembly manner He is mounted in a first manner on the first surface of the first substrate.

In summary, the present invention provides a method for manufacturing a multilayer circuit board which is preferably a buried component, and an application for an invention patent according to the law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art It is still possible to make various substitutions and modifications without departing from the spirit of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

11‧‧‧ Guide hole

12‧‧‧ embedded components

13‧‧‧Circuit board

14‧‧‧ solder pads

20‧‧‧ boards

21‧‧‧ embedded components

22‧‧‧High structure

221‧‧‧ conductive through holes

222‧‧‧Substrate

223‧‧‧ fifth surface

224‧‧‧ sixth surface

225‧‧‧Connected lines

23‧‧‧First substrate

231‧‧‧ first surface

232‧‧‧ second surface

233‧‧‧First patterned circuit layer

234‧‧‧Second patterned circuit layer

24‧‧‧second substrate

241‧‧‧ third surface

242‧‧‧ fourth surface

243‧‧‧ Third patterned circuit layer

25‧‧‧ Third substrate

30‧‧‧Contacts

40‧‧‧Electronic components

The first figure is a schematic diagram of the structure of a multi-layer circuit board.

The second figure is a schematic structural view of a first embodiment of a circuit board in the present invention.

The third figure is an enlarged schematic view of the structure of the high structure of the present invention.

The fourth figure is a schematic structural view of a second embodiment of the circuit board of the present invention.

The fifth figure is a schematic structural view of a third embodiment of the circuit board of the present invention.

22‧‧‧High structure

221‧‧‧ conductive through holes

222‧‧‧Substrate

223‧‧‧ fifth surface

224‧‧‧ sixth surface

225‧‧‧Connected lines

23‧‧‧First substrate

24‧‧‧second substrate

30‧‧‧Contacts

Claims (6)

A circuit board having a buried component, comprising: a first substrate, wherein the first substrate and the first surface are respectively provided with first and second patterned circuit layers, the first and second patterned The circuit layer is provided with at least one contact; the second substrate is provided with opposite third and fourth surfaces, and the fourth surface is disposed on the first surface and covers the first patterned circuit layer The third surface is provided with a third patterned circuit layer, and the third patterned circuit layer is provided with at least one contact; the embedded component is embedded in the second substrate and patterned with the first a pad connection of the circuit layer; and a pad structure is embedded in the second substrate, the pad structure is provided with at least one conductive via, and the first patterned circuit layer and the third pattern are connected The buried layer component and the padding structure may be first disposed on the first surface, and then pressed with a resin material or film to cover the buried component and the padding structure to form a second substrate. The circuit board with embedded components according to claim 1, wherein the pad structure is provided with a substrate, and the substrate is respectively provided with a conduction line opposite to the fifth and sixth surfaces, the conductive via The conduction lines of the fifth and sixth surfaces are electrically connected, and the conduction lines of the fifth and sixth surfaces are respectively connected to the contacts. A circuit board having a buried component according to claim 2, wherein a conductive via is provided between the conductive line and the contact. A circuit board having a buried component according to claim 1, wherein the embedded component may be a packaged semiconductor or an unpackaged die sheet. The circuit board having a buried component according to claim 1, wherein the third surface of the second substrate is further provided with a third substrate. A circuit board having a buried component according to claim 1, wherein the second substrate is provided with an opening for receiving the embedded component.