TWI334079B - - Google Patents

Download PDF

Info

Publication number
TWI334079B
TWI334079B TW96121630A TW96121630A TWI334079B TW I334079 B TWI334079 B TW I334079B TW 96121630 A TW96121630 A TW 96121630A TW 96121630 A TW96121630 A TW 96121630A TW I334079 B TWI334079 B TW I334079B
Authority
TW
Taiwan
Prior art keywords
heat
casing
heat dissipation
fan
electronic device
Prior art date
Application number
TW96121630A
Other languages
English (en)
Chinese (zh)
Other versions
TW200848992A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW96121630A priority Critical patent/TW200848992A/zh
Publication of TW200848992A publication Critical patent/TW200848992A/zh
Application granted granted Critical
Publication of TWI334079B publication Critical patent/TWI334079B/zh

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW96121630A 2007-06-15 2007-06-15 Heat dissipation architecture of electronic apparatus TW200848992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96121630A TW200848992A (en) 2007-06-15 2007-06-15 Heat dissipation architecture of electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96121630A TW200848992A (en) 2007-06-15 2007-06-15 Heat dissipation architecture of electronic apparatus

Publications (2)

Publication Number Publication Date
TW200848992A TW200848992A (en) 2008-12-16
TWI334079B true TWI334079B (enrdf_load_stackoverflow) 2010-12-01

Family

ID=44209762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96121630A TW200848992A (en) 2007-06-15 2007-06-15 Heat dissipation architecture of electronic apparatus

Country Status (1)

Country Link
TW (1) TW200848992A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10617034B2 (en) * 2017-12-12 2020-04-07 Cloud Light Technology Limited Heat dissipation system of enclosed electronic module with single/multiple active components
JP7297716B2 (ja) * 2020-05-29 2023-06-26 日立チャネルソリューションズ株式会社 紙幣処理装置

Also Published As

Publication number Publication date
TW200848992A (en) 2008-12-16

Similar Documents

Publication Publication Date Title
US7554805B2 (en) Heat dissipation structure for electronic devices
TWI505073B (zh) 電子裝置
TWM309846U (en) Heat dissipation device
TWI309001B (enrdf_load_stackoverflow)
CN110740619A (zh) 一种电子设备
TW200530790A (en) Convection type heat dissipating hood
US20100246123A1 (en) Cooling device
JP2017103266A (ja) 電子機器
TWM309314U (en) Heat-dissipating mechanical housing
TWI334079B (enrdf_load_stackoverflow)
CN211378651U (zh) 一种电子设备及其散热装置
CN203276149U (zh) 一种多功能笔记本散热垫
JP2000223876A5 (enrdf_load_stackoverflow)
TWM242991U (en) Heat sink device with multi-directional air inlets
JPH1187961A (ja) 電子機器の放熱構造
CN101344808B (zh) 散热模块
TWI564699B (zh) 散熱組件及顯示卡模組
CN2491883Y (zh) 散热装置
TW200540598A (en) Heat dissipation wind guide cover
CN104105379A (zh) 散热组件及显示卡模块
CN101907912B (zh) 电子设备
JPH118485A (ja) 電子機器の冷却構造
CN201177787Y (zh) 散热装置及具有该散热装置的计算机机箱
JPH11340669A (ja) 廃熱装置
TWI736470B (zh) 散熱裝置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees