1330514 070458.TW 24950twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子裝置，且特別是有關於一種 的具有滑動機構（sliding mechanism)的電子裝置。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an electronic device, and more particularly to an electronic device having a sliding mechanism. [Prior Art]
現今的電子裴置已朝向輕薄短小的趨勢發展。就手持 式電子裝置而言，例如行動電話（mobile phone )與個人數 位化助理（Pers〇nal digital assistant, PDA)，因其方便性 與可攜性，已逐漸成為日常生活中不可或缺的工具。就行 動電話而言，為了保護其按鍵或螢幕，除了傳統的皮套包 覆外，行動電話也發展出具有掀蓋結構（liftingc〇ver)的 ，式，甚至進一步發展出具有滑蓋結構（sliding cover)的 ::崔口此，行動電話可藉由上述掀蓋結構或滑蓋結構的 二避免使用者誤觸按鍵撥打號碼或防止外力撞而造 成的損壞。Today's electronic devices have evolved toward a light and short trend. For handheld electronic devices, such as mobile phones and personal digital assistants (PDAs), they have become an indispensable tool in daily life because of their convenience and portability. . In terms of mobile phones, in order to protect their buttons or screens, in addition to the traditional holster covering, mobile phones have also developed a type of lifting structure, even further developed with a sliding structure (sliding) Cover)::Cuikou, the mobile phone can avoid the damage caused by the user accidentally touching the button to dial the number or prevent the external force from colliding by the above-mentioned cover structure or the slide structure.
^ ，/、繪不習知之一種行動電話的立體示意 :體本體(body)uo與-滑蓋12〇。 蓋m 營幕112、多個碰114與一滑轨116。滑 上。當;設（slidinglydisposed)於本體 110 動滑苗J Γ 關閉滑蓋12 0時，使用者施力來移 為滑苗120相^士習知行動電話100之滑執116僅僅作 月瓜120相對於本體110滑動的中介。 1330514 070458.TW 24950twf.doc/n 【發明内容】 本發明提供一種電子裝置，其具有導熱滑軌 (heat-conducting slide)，以提升電子裝置運作時的散熱 效能（heat dissipation efficiency )。 本發明提出一種電子裝置，其包括一第一機體 (machine assembly)、一第二機體與一滑動機構。第一機 體具有一熱源（heat source)。第二機體滑設於第一機體 上，且適於在一第一位置與一第二位置之間作滑動。滑動 機構包括一滑接部（sliding connection portion)與一導熱 滑軌。滑接部配置於第一機體上，且導熱滑軌配置於第二 機體上。滑接部滑接於（slidingly connected)導熱滑執。 當第二機體位於第一位置時，部分導熱滑軌熱耦接至熱 源，且另一部分導熱滑軌暴露於外。 在本發明之一實施例中，上述導熱滑執包括一導引凹 槽（guide trench)、一導熱延伸件（heat-conducting extension element )與一導熱接觸件（heat-conducting contact element)。導引凹槽配置於第二機體，且導熱延伸件配置 於導引凹槽内。導熱接觸件配置於導熱延伸件的一端。當 第二機體位於第一位置時’導熱接觸件接觸熱源，且部分 導熱延伸件與部分導引凹槽暴露於外。 在本發明之一實施例中’上述導熱接觸件可為一可撓 性元件（flexible element)。當第二機體位於第一位置時， 導熱接觸件繞性變形以接觸熱源。此外，上述導熱接觸件 可為一導熱塊（heat-conductingblock)。另外，導熱滑執 1330514 070458.TW 24950twf.doc/n 更包括至少一散熱鰭片（钉n) ’其配置於導熱延伸件的另 一端。當第二機體位於第—位置時，散熱鰭片暴露於外。 在本發明之一實施例中，上述滑接部可為一滑塊 (sliding block)。 在本發明之一實施例中’當第二機體位於第二位置 時，第一機體覆蓋導熱滑執。^ , /, painted a stereoscopic gesture of a mobile phone: body uo and - slider 12 〇. Cover m camp 112, multiple bumps 114 and a slide rail 116. Slide on. When the sliding body 12 is closed, the user applies force to move to the sliding seedlings 120. The slippery 116 of the mobile phone 100 is only used as the melon 120. The intermediary of the sliding of the body 110. 1330514 070458.TW 24950twf.doc/n SUMMARY OF THE INVENTION The present invention provides an electronic device having a heat-conducting slide to improve heat dissipation efficiency during operation of the electronic device. The invention provides an electronic device comprising a first machine assembly, a second body and a sliding mechanism. The first body has a heat source. The second body is slidably disposed on the first body and adapted to slide between a first position and a second position. The sliding mechanism includes a sliding connection portion and a heat conducting slide. The sliding portion is disposed on the first body, and the heat conducting rail is disposed on the second body. The sliding portion is slidingly connected to the thermal sliding slip. When the second body is in the first position, a portion of the thermally conductive slide is thermally coupled to the heat source and another portion of the thermally conductive slide is exposed to the outside. In one embodiment of the invention, the thermally conductive slide includes a guide trench, a heat-conducting extension element, and a heat-conducting contact element. The guiding groove is disposed on the second body, and the heat conducting extension is disposed in the guiding groove. The thermally conductive contact is disposed at one end of the thermally conductive extension. When the second body is in the first position, the thermally conductive contact contacts the heat source, and the portion of the thermally conductive extension and the portion of the guide groove are exposed. In one embodiment of the invention, the thermally conductive contact can be a flexible element. When the second body is in the first position, the thermally conductive contact is circumferentially deformed to contact the heat source. Further, the above thermally conductive contact member may be a heat-conducting block. In addition, the thermal sliding slip 1330514 070458.TW 24950twf.doc/n further includes at least one heat dissipating fin (nail n)' disposed at the other end of the thermally conductive extension. When the second body is in the first position, the heat sink fins are exposed to the outside. In an embodiment of the invention, the sliding portion may be a sliding block. In an embodiment of the invention, when the second body is in the second position, the first body covers the heat transfer slip.
由於當第二機體位於第一位置時，部分導熱滑執熱耦 接至熱源’且另一部分導熱滑軌暴露於外，所以導熱滑軌 可將熱源的熱傳遞至外界環境。因此，本發明之實施例的 電子裝置運作時的散熱效能得以提升。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 [第一實施例] 圖2A繪示本發明第一實施例之一種電子裝置之第二 機體位於第一位置的剖面示意圖，圖2β|會示圖从之 機體位於第二位置的剖面示意圖。技 士舍 兩， D月參考圖2A與圖2B， 本實施例之電子裝置200例如為行動 :…上 理或超級行動電腦（ultra mobile Pc m、個人數位化助 第-機體21G、—第二機體22G‘\Hc) ’其包括一 _ 民古為屯月動機構230。第一機 肢210具有一熱源212。熱源212 (heat-generating element)或一 $ 勒 ·、 x …、 plate )。 双·、、、扳（heat-dissipating 1330514 070458.TW 24950twf.doc/n 第二機體220滑設於該第—機體21〇上，且適於在一 位置P1與-第二位置P2之間作滑動。滑動機構23〇 ^括—滑接部232與一導熱滑轨234。滑接部232配置於 第一機體210上’且導熱滑轨234配置於第二機體上。 雜部232滑接於導熱滑軌234。此外，當第二機體別 位於第-位置P1時，部分導熱雜234絲接至熱源 212，且另一部分導熱滑執234暴露於外。 在此必須說明的是，當第二機體22〇位於第—位置ρι 時，電子裝置200是處於使用狀態，使得使用者可藉由多 個配置於第一機體210上的按鍵214與一配置於第二機體 220上的螢幕222來使用電子裝置2〇〇。由於當第二機體 220位於第一位置P1時，部分導熱滑執234熱耦接至熱源 212，且另一部分導熱滑轨234暴露於外，所以導熱滑軌 234可將熱源212的熱傳遞至外界環境。因此，本實施例 之電子裝置200運作時的散熱效能（heat dissipation efficiency)得以提升。 • 詳言之’在本實施例中，滑接部232可為一滑塊，且 導熱滑執234包括一導引凹槽234a、一導熱延伸件234b、 一導熱接觸件234c與至少一散熱鰭片234d。導引凹槽234a 配置於第二機體220，且滑接部232滑設於導引凹槽234a 内。導熱延伸件234b (其材質例如為金屬）配置於導引凹 槽234a内，導熱接觸件234c配置於導熱延伸件234b的一 端，且散熱鰭片234d配置於導熱延伸件234b的另一端。 當第二機體220位於第一位置P1時，導熱接觸件234c接 1330514 070458.TW 24950twf.doc/n 觸熱源212，且部分導熱延伸件234b、部分導引凹槽234a 與散熱鰭片234d暴露於外。散熱鰭片234d具有較大的散 熱面積，以更為提升電子裝置200運作時的散熱效能。 在本實施例中，導熱接觸件234c可為一可撓性元件 (flexible element)。當第二機體220位於第一位置η時， 導熱接觸件234c撓性變形以接觸熱源212。當第二機體22〇 位於第二位置P2時，第一機體210可覆蓋導熱滑執234， 且導熱接觸件234c恢復至自然狀態而貼附於導熱延伸件 234b 上。 [第二實施例] 圖3A繪示本發明第二實施例之一種電子裝置之第二 機體位於第一位置的剖面示意圖，圖3B繪示圖3A之第二 機體位於第二位置的剖面示意圖。請參考圖3A與圖3B， 第一實施例之電子裝置300與第一實施例之電子裝置200 的主要不同之處在於’第二實施例之導熱滑執334之導熱 接觸件334c可為一導熱塊。 當第二機體320位於第一位置pi，時，導熱接觸件334c 接觸第一機體310之熱源312，且部分導熱延伸件334b、 部分導引凹槽334a與散熱鰭片334d暴露於外。當第二機 體320位於第二位置p2’時，第一機體31〇可覆蓋導熱滑 軌334，且導熱接觸件334c遠離熱源312。 綜上所述’由於當第二機體位於第一位置時，部分導 熱滑執熱耦接至熱源，且另一部分導熱滑軌暴露於外，所 以導熱滑執可將熱源的熱傳遞至外界環境。因此，本發明 1330514 070458.TW 24950twf.doc/n 之實裝置運作時的散熱效能得以提升。 本發明…心發明已以實施例揭露如上，然:其並非用以限定 样明之麟賴巾私通常知财，在不脫離 本發明之保護範―更動與潤飾，因此 準。 以I視後附之巾請♦利範_界定者為 【圖式簡單說明】 ，1綠示習知之-種行動電話的立體示 圖2A %示本發明第一實施例之一種‘二 機體位於第—』心種宅子裝置之第-弟位置的剖面示意圖。 乐― 固圖2B綠示圖2A之第二機體位於第二位 圖。 罝的剖面示音 圖3A繪示本發明第二實施 一 機體位於第—位置的剖面示意圖„種電子裝置之第二 圖如會示圖Μ之第二機體位於第二位置的剖面示意 圖 【主要元件符鱿說明】 100 :行動電話 110 ·’本體 112、222 :螢幕 I14、214 :按鍵 116 :滑軌 1330514 070458.TW 24950twf.doc/n 120 :滑蓋 200、300 :電子裝置 210、220、310、320 :機體 212、312 :熱源 230 :滑動機構 232 :滑接部 234、334 :導熱滑執 234a、334a :導引凹槽 234b、334b :導熱延伸件 234c、334c :導熱接觸件 234d、334d :散熱鰭片 PI、P2、ΡΓ、P2’ ：位置Since the heat transfer slip is thermally coupled to the heat source and the other portion of the heat transfer slide is exposed when the second body is in the first position, the heat transfer slide can transfer heat from the heat source to the outside environment. Therefore, the heat dissipation performance of the electronic device of the embodiment of the present invention is improved. The above described features and advantages of the present invention will be more apparent from the following description. [First Embodiment] FIG. 2A is a cross-sectional view showing a second body of an electronic device in a first position according to a first embodiment of the present invention, and FIG. 2 is a view showing a second body of the electronic device in a second position. Schematic diagram of the section. For example, the electronic device 200 of the present embodiment is, for example, an action: an ultra mobile Pc m, an individual digitally assisted first body 21G, and a second body. 22G'\Hc) 'It includes a _ Mingu is a lunar mechanism 230. The first limb 210 has a heat source 212. Heat source 212 (heat-generating element) or a $ 勒 ·, x ..., plate ). The second body 220 is slidably disposed on the first body 21 , and is adapted to be between a position P1 and a second position P2. The sliding mechanism 23 includes a sliding portion 232 and a heat conducting rail 234. The sliding portion 232 is disposed on the first body 210 and the heat conducting rail 234 is disposed on the second body. The heat-conducting slide rail 234. In addition, when the second body is located at the first position P1, part of the heat-conducting 234 is wire-connected to the heat source 212, and the other part of the heat-conducting slide 234 is exposed to the outside. It must be noted that when the second When the body 22 is located at the first position ρι, the electronic device 200 is in use, so that the user can use the plurality of buttons 214 disposed on the first body 210 and the screen 222 disposed on the second body 220. The electronic device 2〇〇. Since the partial heat conduction sliding 234 is thermally coupled to the heat source 212 when the second body 220 is at the first position P1, and the other portion of the heat conducting sliding rail 234 is exposed to the outside, the heat conducting sliding rail 234 can heat the heat source. The heat of 212 is transferred to the external environment. Therefore, the embodiment The heat dissipation efficiency of the electronic device 200 is improved. • In the present embodiment, the sliding portion 232 can be a slider, and the heat conducting sliding 234 includes a guiding groove 234a. A heat conduction extension 234b, a heat conduction contact 234c and at least one heat dissipation fin 234d. The guiding groove 234a is disposed on the second body 220, and the sliding portion 232 is slidably disposed in the guiding groove 234a. The heat conduction extension 234b The material (for example, metal) is disposed in the guiding groove 234a, the heat conducting contact 234c is disposed at one end of the heat conducting extension 234b, and the heat dissipating fin 234d is disposed at the other end of the heat conducting extension 234b. When the second body 220 is located In the first position P1, the heat conduction contact 234c is connected to the 1330514 070458.TW 24950 twf.doc/n heat source 212, and the partial heat conduction extension 234b, the partial guide groove 234a and the heat dissipation fin 234d are exposed. The heat dissipation fin 234d The heat dissipation area of the electronic device 200 can be improved. In the embodiment, the heat conduction contact 234c can be a flexible element. When the second body 220 is located at the first Bit When n is set, the heat conducting contact 234c is flexibly deformed to contact the heat source 212. When the second body 22 is at the second position P2, the first body 210 can cover the heat conducting slip 234, and the heat conducting contact 234c returns to the natural state. Attached to the thermally conductive extension 234b. [Second embodiment] FIG. 3A is a cross-sectional view showing a second body of an electronic device in a first position according to a second embodiment of the present invention, and FIG. 3B is a second view of FIG. A schematic cross-sectional view of the body in a second position. Referring to FIG. 3A and FIG. 3B , the main difference between the electronic device 300 of the first embodiment and the electronic device 200 of the first embodiment is that the thermal conductive contact 334 c of the thermal sliding 334 of the second embodiment can be a heat conducting. Piece. When the second body 320 is in the first position pi, the heat conduction contact 334c contacts the heat source 312 of the first body 310, and the partial heat conduction extension 334b, the partial guide groove 334a and the heat dissipation fin 334d are exposed. When the second body 320 is at the second position p2', the first body 31 can cover the heat conducting rail 334, and the heat conducting contact 334c is away from the heat source 312. In summary, since when the second body is in the first position, part of the heat conduction slip is thermally coupled to the heat source, and another part of the heat conduction slide is exposed, the heat transfer slip can transfer the heat of the heat source to the external environment. Therefore, the heat dissipation performance of the real device of the present invention 1330514 070458.TW 24950twf.doc/n is improved. The invention has been disclosed in the above embodiments, but it is not intended to limit the general knowledge of the invention, and it does not deviate from the protection of the invention. Please refer to the towel attached to I. ♦ 范 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ - Schematic diagram of the position of the first-different position of the heart-shaped house device. The second body of the music-solid diagram 2B green diagram 2A is located in the second position. FIG. 3A is a cross-sectional view showing the second embodiment of the present invention in the first position of the second embodiment of the present invention. The second diagram of the electronic device is shown in the second position of the second body.鱿 鱿 】 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 320: body 212, 312: heat source 230: sliding mechanism 232: sliding portion 234, 334: heat conducting slip 234a, 334a: guiding groove 234b, 334b: heat conducting extension 234c, 334c: heat conducting contact 234d, 334d : Heat sink fins PI, P2, ΡΓ, P2' : position
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