CN209659835U - Heat transfer structure and electronic device - Google Patents
Heat transfer structure and electronic device Download PDFInfo
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- CN209659835U CN209659835U CN201822112360.7U CN201822112360U CN209659835U CN 209659835 U CN209659835 U CN 209659835U CN 201822112360 U CN201822112360 U CN 201822112360U CN 209659835 U CN209659835 U CN 209659835U
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Abstract
The application discloses a kind of heat transfer structure and the electronic device with the heat transfer structure.Heat transfer structure includes a heat-sink unit, a thermally conductive adhesion part and a heat transfer unit.Heat-sink unit has one end.Thermally conductive adhesion part is set to the end of heat-sink unit.Heat transfer unit is set to thermally conductive adhesion part, and heat transfer unit includes that a heat conducting element and a graphene layer, heat conducting element are attached on graphene layer, and heat conducting element is connected to the end of heat-sink unit through thermally conductive adhesion part;The thermal energy that heat-sink unit is transmitted along a first direction generates the heat transfer for being different from a second direction of first direction through heat transfer unit, then generates the heat transfer for being different from a third direction of second direction through graphene layer and dissipation is gone out.
Description
Technical field
This application involves a kind of heat transfer structure and electronic device, in particular to a kind of heat transfer with grapheme material
Structure and the electronic device with the heat transfer structure.
Background technique
With the development of science and technology, be directed to the design and research and development of electronic device, invariably with slimming and high-effect preferentially to examine
Amount.In the case where requiring high-speed computation, the electronic component of electronic device will inevitably generate relatively previous more heats,
But the operating environment of high temperature not only will affect the characteristic of electronic component, and excessively high temperature is more likely to cause electronic component permanent
Damage.
In order to avoid electronic device overheat, it generally can be all installed with radiator, to pass through the side such as conduction, convection current and radiation
Formula dissipates out thermal energy caused by electronic device.When the radiator seen includes air-cooled (radiating fin adds fan), liquid
Cold (liquid plus pumping), heat pipe, semiconductor refrigerating, compressor refrigeration and heat dissipation film etc..
In Chinese invention patent application number: disclosing a kind of hand-set host plate heat dissipation graphite in CN201610559223.0
Piece further includes the heat-dissipating pipe having in square shape, and a corresponding two sides are average in symmetrical structure in the tube wall of the heat-dissipating pipe
Several interior fins are distributed with, interior fin is embedded to be installed in graphite matrix, and heat-dissipating pipe is wrapped in outside graphite matrix, the heat dissipation
Several outer-finneds are distributed in symmetrical structure in another corresponding two sides outside the tube wall of pipe, and the tube wall outside of the heat-dissipating pipe is uniformly
Smearing is provided with spray coating.The utility model uses the higher aluminium alloy of thermal coefficient, and in addition inside and outside wall has fin, inner wall and stone
Sufficiently, outer wall heat dissipation area is big, and then greatly improves radiating rate for ink sheet contact, by the way that heat release hole is arranged on graphite flake, pastes
If when graphite flake, air can be discharged easily by heat release hole.
However, the heat-dissipating pipe of the preceding case technology or other radiators, the not limitation in escape straight line heat transfer path,
The direction of heat transfer can not be allowed to be changed, such as the heat out in 90 degree of directions.
Utility model content
In view of above-mentioned, the purpose of the application be provide a kind of heat transfer structure with the electronics of the heat transfer structure
Device dissipates out again after being shifted direction of heat transfer.
In order to achieve the above object, a kind of heat transfer structure according to the application, including a heat-sink unit, a thermally conductive adhesion part with
An and heat transfer unit.Heat-sink unit has one end.Thermally conductive adhesion part is set to the end of heat-sink unit.Heat transfer unit is set
It is placed in thermally conductive adhesion part, heat transfer unit includes that a heat conducting element and a graphene layer, heat conducting element are attached on graphene layer,
And heat conducting element is connected to the end of heat-sink unit through thermally conductive adhesion part;Heat transfer structure is by heat-sink unit along a first party
The heat transfer for being different from a second direction of first direction is generated through heat transfer unit to the thermal energy of transmitting, then penetrates graphene
Layer generates the heat transfer for being different from a third direction of second direction and dissipation is gone out.
In order to achieve the above object, a kind of electronic device according to the application, including a heat source and a heat transfer structure.Heat turns
Structure setting is moved in heat source, and includes heat-sink unit, a thermally conductive adhesion part and a heat transfer unit.Heat-sink unit and heat source connect
It connects, heat-sink unit has the one end far from heat source.Thermally conductive adhesion part is set to the end of heat-sink unit.The setting of heat transfer unit
In thermally conductive adhesion part, heat transfer unit is attached on graphene layer comprising a heat conducting element and a graphene layer, heat conducting element, and
Heat conducting element is connected to the end of heat-sink unit through thermally conductive adhesion part;Heat transfer structure is the heat by heat source generation through scattered
Hot cell is transmitted along a first direction, and heat-sink unit is different from along the thermal energy that first direction transmits through the generation of heat transfer unit
The heat transfer of one second direction of first direction, then the heat for being different from a third direction of second direction is generated through graphene layer
It shifts and dissipates away.
From the above, heat transfer structure disclosed in the present application with the heat transfer structure electronic device in, thoroughly
It crosses heat-sink unit to connect with heat source, heat-sink unit is different from along the thermal energy that first direction transmits through the generation of heat transfer unit
The heat transfer of the second direction of first direction, then the heat transfer for being different from the third direction of second direction is generated through graphene layer
And dissipate away, whereby, can thermal energy caused by long-time transfer electron device, and allow thermal energy can be in electronic device
It is turned in design path (transfer), therefore, heat transfer path can be made no longer to limit to only linear type path.In addition,
Due to that thermally conductive pathways can be allowed to turn, the spare part, such as motherboard, battery, circuit board, microphone etc. of electronic device can be allowed
Every placing part position is more flexible, more has outside abundant space, moreover it is possible to allow the outlet of heat dissipation that the bottom of electronic device is arranged in, no
The palm of the user of hand-hold electronic device can be allowed heated for a long time.
Detailed description of the invention
Figure 1A is a kind of decomposition diagram of heat transfer structure of one embodiment of the application;
Figure 1B is the combination diagram of the heat transfer structure of Figure 1A;
Fig. 2A, Fig. 2 B and Fig. 3 are respectively a kind of schematic diagram of heat transfer structure of the application difference embodiment;
Fig. 4 is a kind of decomposition diagram of electronic device of the embodiment of the present application.
Specific embodiment
Hereinafter with reference to correlative type, illustrates the heat transfer structure according to the application preferred embodiment and there is the heat transfer
The electronic device of structure, wherein identical element will be illustrated with identical reference marks.
Figure 1A is a kind of decomposition diagram of heat transfer structure of one embodiment of the application, and Figure 1B is the heat transfer of Figure 1A
The combination diagram of structure.
The heat transfer structure 1 of the application can operate with such as, but not limited to notebook computer, mobile phone, plate and servomechanism
Interior relevant computer equipment or other electronic equipments, to be designed and continual heat sinking function as the transfer of the direction of high thermal conductivity.
As shown in Figure 1A and Figure 1B, heat transfer structure 1 includes that a heat-sink unit 11, a thermally conductive adhesion part 12 and a heat turn
Move unit 13.In addition, the heat transfer structure 1 of the present embodiment may also include a heat dissipation film layer 14.
Heat-sink unit 11 can be connect with the heat source (such as CPU) of electronic device, and have one end 111.In this, end
111 are located at side of the heat-sink unit 11 far from heat source.Heat-sink unit 11 can be heat pipe, hot plate, backing, heat dissipation film, radiating fin
Or fan, or other heat dissipation equipments, or combinations thereof.The heat-sink unit 11 of the present embodiment is by taking heat pipe as an example.
Thermally conductive adhesion part 12 is set to the end 111 of heat-sink unit 11.In this, thermally conductive adhesion part 12 is connected to heat-sink unit
11 end 111, to transmit the heat that heat-sink unit 11 is guided.Thermally conductive adhesion part 12 may include the metal of high thermal conductivity coefficient
Class, such as copper, aluminium, gold, steel, silver, or combinations thereof or other can be with the material based on high thermal conductivity;Thermally conductive adhesion part 12 can also wrap
High-heat-conductivity glue containing non-metal kind, is not intended to limit.Wherein, thermally conductive adhesion part 12 may include the combination of host material and filler, base
Material can be such as, but not limited to silica resin, polyurethane, acrylate polymer, hot melt adhesive or pressure sensitivity class sticker,
And filler can be such as, but not limited to copper powder, aluminium oxide, boron nitride, zinc oxide or aluminium nitride, or combinations thereof.In some embodiments
In, the weight percent (wt%) of filler can account between 70~80wt% of thermally conductive adhesion part 12.The thermally conductive of the present embodiment is sticked together
Part 12 is by taking copper starches solid as an example, rapidly to transmit the heat of the end 111 of heat-sink unit 11.
Heat transfer unit 13 is set to thermally conductive adhesion part 12, so that thermally conductive adhesion part 12 is folded in heat-sink unit 11 and heat turns
It moves between unit 13.Heat transfer unit 13 may include a heat conducting element 131 and a graphene layer 132, and heat conducting element 131 is penetrated and led
Hot adhesion part 12 is connected to the end 111 of heat-sink unit 11.The shape of graphene layer 132 and heat conducting element 131 substantially can phase
Together, so that heat conducting element 131 can completely be attached on graphene layer 132 (such as using thermally conductive glue laminating), and then make thermal conductivity
Heat-conducting effect between element 131 and graphene layer 132 is more preferable.In this, the metal of high thermal conductivity coefficient is can be used in heat conducting element 131
Class, such as copper, aluminium, gold, steel, silver, or combinations thereof or other can with the material based on high thermal conductivity, and graphene layer 132 be a stone
Black alkene heat conducting film (Graphene Thermal Film, GTF).The heat conducting element 131 of the present embodiment is by taking copper sheet as an example.Therefore,
The heat for being transferred to the end 111 of heat-sink unit 11 can be conducted through thermally conductive adhesion part 12 to heat conducting element 131, and along heat
The extending direction of guiding element 131 rapidly guides and is transferred to graphene layer 132, since graphene layer 132 has good xy
Therefore plane thermal conductivity can rapidly transmit heat along the extending direction on 132 surface of graphene layer, thermal energy is quick
Ground dissipates to the external world.
As shown in Figure 1B, when the heat-sink unit 11 of heat transfer structure 1 is by heat transfer caused by heat source to heat-sink unit
When 11, it can pass through heat-sink unit 11 and transmitted in parallel along a first direction D1, and the heat that heat-sink unit 11 is transmitted along first direction D1
The heat transfer for the second direction D2 that heat transfer unit 13 is generated different from first direction D1 can be can pass through, then penetrate graphene layer
132 generations are different from the heat transfer of a third direction D3 of second direction D2 and dissipation is gone out.The first direction D1 of the present embodiment
Parallel with the extending direction of heat-sink unit 11, second direction D2 is parallel with the extending direction of heat transfer unit 13, and third direction
The vertical second direction D2 of D3, and it is parallel with first direction D1.
In other words, heat-sink unit 11 has the heat transfer path of its parallel extending direction (first direction D1), and heat turns
The heat conducting element 131 for moving unit 13 has the extending direction of vertical heat-sink unit 11, i.e. second direction D2 (its vertical first direction
D1 heat transfer path), so that the parallel heat from heat-sink unit 11, via thermally conductive adhesion part 12 conduction to heat conducting element
The change in heat transfer direction is generated after 131 and becomes vertical thermal to (i.e. second direction D2), is generated again after graphene layer 132
Parallel heat transfer (i.e. third direction D3, vertical second direction D2 but parallel first direction D1), heat is dissipated out.
In addition, the heat-sink unit 11 of the present embodiment, thermally conductive adhesion part 12 and heat transfer unit 13 are settings in heat dissipation film layer
On 14.In this, the film layer 14 that radiates is the graphene film layer structure of whole piece, is used for conducting with heat dissipation.Therefore, when electronics fills
Heat caused by setting can be conducted to heat dissipation film layer 14, heat-sink unit 11, then through heat-sink unit 11, thermally conductive adhesion part 12 and heat
Buanch unit 13 carry out direction of heat transfer transfer (as described above), make heat can from the graphene layer 132 of heat transfer unit 13 toward
Third direction D3 is dissipated out.In some embodiments, heat transfer structure 1 can be applied to such as, but not limited to mobile phone, by hand
Heat caused by machine (such as produced when charging, high-effect or high-speed computation or fast charge) shifts and by graphene layer 132
It is rapidly dissipated out toward the bottom of such as mobile phone, the palm for not allowing user to hold mobile phone is heated for a long time (general in use, using
The hand of person can hold the back-cover of mobile phone).
Referring to figure 2. shown in A, Fig. 2 B and Fig. 3, be respectively the application difference embodiment a kind of heat transfer structure 1a,
The schematic diagram of 1b.
As shown in Fig. 2A and Fig. 2 B, the heat transfer structure 1a of the present embodiment and 1 its yuan of heat transfer structure of previous embodiment
The connection relationship of part composition and each element is roughly the same.The difference is that the heat dissipation film of the heat transfer structure 1a of the present embodiment
Layer 14 includes two through-holes O1, O2.In some application examples, for example, applied to wireless charging mobile phone when, can be wireless by two
Charge coil 27 is correspondingly arranged in through-hole O1, O2 (Fig. 2 B), and generated heat is through heat dissipation film layer 14 when by wireless charging
It conducts to heat-sink unit 11, then after thermally conductive adhesion part 12 carries out the transfer of direction of heat transfer with heat transfer unit 13, makes heat
It is dissipated out from graphene layer 132 toward third direction D3.The edge of preferably, two Wireless charging coils 27 and through-hole O1, O2 are extremely
Rare a part overlaps (contact), and heat-conducting effect is preferable;The best, the side of two Wireless charging coils 27 and through-hole O1, O2
Edge can overlap completely, and heat-conducting effect is more preferable.
In addition, as shown in figure 3, its element of the heat transfer structure 1b and the heat transfer structure 1a of previous embodiment of the present embodiment
The connection relationship of composition and each element is roughly the same.The difference is that the heat transfer list of the heat transfer structure 1b of the present embodiment
Member 13 more may include a recess portion 133.It is by taking two recess portions 133 as an example in this.In some embodiments, due to telecommunication apparatus, example
If data can be wirelessly transferred by mobile phone, electric power is wirelessly transferred, bottom has not needed the configuration that jack is transmitted such as USB,
It, can be in heat transfer unit along with the volume of loudspeaker (Speaker) increasingly reduces, therefore when heat transfer structure 1b is arranged
It digs a hole on 13 (recess portion 133), and is correspondingly arranged loudspeaker (speaker) 29 in recess portion 133, in addition to using heat transfer structure
1b dissipates out the heat for being sent to mobile phone bottom, also puts loudspeaker 29 using heat transfer unit 13 (recess portion 133), subtracts
The volume of few electronic device.
It is a kind of decomposition diagram of electronic device 2 of the embodiment of the present application shown in referring to figure 4..Electronic device 2 can
The such as, but not limited to relevant computer equipment such as mobile phone, notebook computer, tablet computer or servomechanism, is not intended to limit.This reality
The electronic device 2 for applying example is to take the mobile phone as an example.
Electronic device 2 may include heat transfer structure 1a and above-mentioned Wireless charging coil 27.In addition to heat transfer structure 1a with
Outside Wireless charging coil 27, electronic device 2 further includes having upper cover 21, display panel 22, panel drive circuit plate 23, circuit system
The spare parts such as plate 24, battery 25, framework 26 and back-cover 28, these spare parts are all the known skill elements in mobile phone, are not these
The emphasis of application, those skilled in the art can be by learning its relativeness and function in existing literature or technical data, herein not
It is again to explain more.
The heat source of electronic device 2 can be central processing unit (CPU), the memory body of the system circuit board 24 of electronic device 2, or
Other can generate the element or unit of high heat.And heat transfer structure 1a is set to heat source, the two is connected with each other.Wherein, heat turns
The heat-sink unit 11 for moving structure 1a is connect with heat source (such as CPU), heat caused by heat source is derived and through heat dissipation
Unit 11 transmits in parallel along first direction D1, and heat-sink unit 11 can pass through heat transfer unit along the thermal energy that first direction D1 is transmitted
13 generate the heat transfer of the second direction D2 different from first direction D1, then generate through graphene layer 132 and be different from second party
To the heat transfer (can refer to Fig. 2 B) of the third direction D3 of D2, heat is dissipated by such as bottom of electronic device 2 (mobile phone)
Out.The other technologies content of heat transfer structure 1a and its relativeness with Wireless charging coil 27 in being described in detail among the above,
It is no longer herein to explain more.
It in various embodiments, can also be by heat transfer structure 1a with heat transfer structure 1 above-mentioned or heat transfer structure 1b
Replace, equally can dissipate out heat caused by electronic device by its bottom.
Hold, the beneficial effects of the present application are as follows: can thermal energy caused by long-time transfer electron device, and allow thermal energy
It can be turned (transfer) in design path in electronic device, whereby, heat transfer path can be made no longer to limit to only straight
Line style path.In addition, also due to thermally conductive pathways can be allowed to turn, therefore, the spare part of electronic device, such as motherboard, electricity can be allowed
The items such as pond, circuit board, microphone placing part position is more flexible, more has outside abundant space, moreover it is possible to allow heat dissipation outlet for example
The bottom of electronic device is set, the palm of the user of hand-hold electronic device will not be allowed heated for a long time.
In conclusion in the heat transfer structure in the application and the electronic device with the heat transfer structure, through scattered
Hot cell is connect with heat source, and heat-sink unit is generated along the thermal energy that first direction transmits through heat transfer unit and is different from first
The heat transfer of the second direction in direction, then generated through graphene layer and be different from the heat transfer of the third direction of second direction and dissipate
Evolution is gone, whereby, can thermal energy caused by long-time transfer electron device, and thermal energy can have been set in electronic device
Meter is turned (transfer) in path, therefore, heat transfer path can be made no longer to limit to only linear type path.In addition, also due to
Thermally conductive pathways can be allowed to turn, therefore can allow the items such as spare part, such as motherboard, battery, circuit board, microphone of electronic device
Placing part position is more flexible, more has outside abundant space, moreover it is possible to allow the outlet of heat dissipation for example in electronic device bottom, will not allow hand
The palm for holding the user of electronic device is heated for a long time.
The foregoing is merely illustratives, rather than are restricted person.It is any without departing from spirit herein and scope, and to it
The equivalent modifications or change of progress, are intended to be limited solely by the application the scope of the patents.
Claims (10)
1. a kind of heat transfer structure characterized by comprising
One heat-sink unit has one end;
One thermally conductive adhesion part is set to the end of the heat-sink unit;And
One heat transfer unit, is set to the thermally conductive adhesion part, and the heat transfer unit includes a heat conducting element and a graphene
Layer, the heat conducting element are attached on the graphene layer, and the heat conducting element is connected to institute through the thermally conductive adhesion part
State the end of heat-sink unit;
Wherein, the heat transfer structure is that the heat-sink unit is penetrated the heat transfer list along the thermal energy that a first direction transmits
It is first to generate the heat transfer for being different from a second direction of the first direction, then generate through the graphene layer different from described
The heat transfer of one third direction of second direction and dissipation is gone out.
2. heat transfer structure as described in claim 1, which is characterized in that the heat-sink unit is heat pipe, hot plate, backing, dissipates
Hotting mask, radiating fin or fan, or combinations thereof.
3. heat transfer structure as described in claim 1, which is characterized in that the extension of the first direction and the heat-sink unit
Direction is parallel, and the second direction is parallel with the extending direction of the heat transfer unit, the third direction vertical described second
Direction, and it is parallel with the first direction.
4. heat transfer structure as described in claim 1, which is characterized in that further include:
One heat dissipation film layer, the heat-sink unit, the thermally conductive adhesion part and the heat transfer unit are set in radiated film layer.
5. heat transfer structure as claimed in claim 4, which is characterized in that the heat dissipation film layer includes an at least through-hole.
6. a kind of electronic device characterized by comprising
One heat source;And
One heat transfer structure, is set to the heat source, and include:
One heat-sink unit is connect with the heat source, and the heat-sink unit has the one end far from the heat source;
One thermally conductive adhesion part is set to the end of the heat-sink unit;And
One heat transfer unit, is set to the thermally conductive adhesion part, and the heat transfer unit includes a heat conducting element and a graphene
Layer, the heat conducting element are attached on the graphene layer, and the heat conducting element is connected to institute through the thermally conductive adhesion part
State the end of heat-sink unit;
Wherein, the heat transfer structure is that the heat for generating the heat source is passed through the heat-sink unit along a first direction
It passs, and the heat-sink unit generates through the heat transfer unit along the thermal energy that the first direction transmits and is different from described first
The heat transfer of one second direction in direction, then the third direction for being different from the second direction is generated through the graphene layer
Heat transfer and dissipation go out.
7. electronic device as claimed in claim 6, which is characterized in that the heat transfer structure also includes a heat dissipation film layer, institute
Heat-sink unit, the thermally conductive adhesion part and the heat transfer unit is stated to be set in radiated film layer.
8. electronic device as claimed in claim 7, which is characterized in that further include:
One Wireless charging coil, the heat dissipation film layer include a through-hole, and the Wireless charging coil is set to the through-hole.
9. electronic device as claimed in claim 8, which is characterized in that the edge of the Wireless charging coil and the through-hole
At least part overlaps.
10. electronic device as claimed in claim 6, which is characterized in that further include:
One loudspeaker, the heat transfer unit also include a recess portion, and the loudspeaker is set in the recess portion.
Priority Applications (1)
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CN201822112360.7U CN209659835U (en) | 2018-12-17 | 2018-12-17 | Heat transfer structure and electronic device |
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CN201822112360.7U CN209659835U (en) | 2018-12-17 | 2018-12-17 | Heat transfer structure and electronic device |
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Publication Number | Publication Date |
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