1330509 .九、發明說明： 【發明所屬之技術領域】 本發明涉及一種印刷電路板之製作方法，尤其涉及一 種鏤空電路板之製作方法。 【先前技術】 電路板通常包括絕緣基材及形成於絕緣基材上之導電 線路。導電線路通常由銅製成。絕緣基材最常採用之材料 Φ為聚醯亞胺，但最近開始出現採用複合材料作為絕緣基材 以提高電路板之性能，請參見Bong Sup Kim et al.， Polyimide/Carbon Nanotubes Composite Films: A Potential for FPCB, 2006. ICONN '06. International Conference on Nanoscience and Nanotechnology ° 鏤空電路板，通常又稱為浮雕板，係指部分區域之導 電線路兩側之絕緣層被挖空，從而線路於兩邊懸空之電路 板。鏤空區域之導電線路可實現雙面電連接。鏤空電路板 • 通常從銅箔開始製造，具體過程如下··首先於銅箔第一表 面上壓合一層預先形成有第一開口之絕緣基材；然後於銅 箔中製作線路，製作完成線路之後再於銅箔第二表面上壓 合一層預先形成有第二開口之絕緣基材，第一開口與第二 開口位置相互對應，從而於導電線路上定義出一鏤空區， 也就是說，形成一鏤空電路板。 於銅箔中製作線路時第一開口處之銅箔之第一表面上 需要貼保護膜予以保護。保護膜通常採用幹膜，但第一開 7 1330509 口處絕緣基材與㈣之間存於高度差，保護膜不能充分貼 合於銅箔之第一表面，於第一開口之邊界處會產生一空 隙，進行線路之製作時，银刻藥水會進入此空隙，從而造 成鋼箔背面處之線路發生側蝕以及過蝕之情形。 …因此，有必要提供一種可避免於製作線路時蝕刻藥水 2箱之第—表面對線路造成㈣及祕之鏤^電路板 作方法。 【發明内容】 對銅例二明一種可避免於製作線路時餘刻藥水 製作方:近基材一側之表面造成㈣及過银之鏤空電路板 -句二種路板之製作方法，其包括以下步驟：提供 .銅泊，該銅'治包括相對之第一表面與第 徒供 箔之第一表面上壓人，於該銅 基！；於該第-絕緣基材之第-開口處形成保護：：絕緣 除第-開口處二2=於該㈣中製作線路;去 先形成有第二開口“ —嗜缘：：第：f面上壓合-層預 開口相互對應。 弟開口與第二 該鏤空電路板之製作方法中，於銅Μ 於絕緣基材開口處形成塗層 ：：路之前 密貼合於銅箱上，從而避免㈣液進入銅時塗層緊 側之表面上而造成線路之侧兹或過钱。 名緣基材 8 1330509 •【實施方式】 參閱圖1’本技術方案提供之鏤空電路板製作方法包括 以下步驟： 步驟1，參閱·圖2，提供一銅镇10。銅搭1〇可為電解 銅箔，亦可為壓延銅箔。銅箔10包括相對之第一表面102 與第二表面104。優選地，可採用酸性清洗液對銅箔1〇進 行處理，以除去銅箔10第一表面102與第二表面1〇4上之 鲁髒汙，並增加銅箔第一表面102與第二表面104之粗糙度。 步驟2，將預先形成有第一開口 122之第一絕緣基材 12壓合於銅箔10之第一表面102上。 參閱圖3，第一絕緣基材12上具有兩個第一開口 122。 當然第一絕緣基材12上根據需求還可開設複數個第一開口 12.2。第一絕緣基材12可為柔性基材如聚醯亞胺（p〇iyimide， PI )、聚乙烯對苯二曱酸乙二醇酷（Polyethylene Terephtalate， PET)、聚四氟乙稀（TeHon)、聚硫胺（Polyamide)、聚曱基丙 •烯酸曱醋（Polymethylmethacrylate)、聚碳酸 S旨 (Polycarbonate)或聚醯亞胺-聚乙稀-對苯二曱g旨共聚物 (Polyamide polyethylene-terephthalate copolymer)或者其組 合物。第一絕緣基材12還可為硬性基材如玻纖布、環氧樹 脂等。當採用柔性基材時最終可得到鏤空柔性電路板，當 採用硬性基材時最終可得到硬性鏤空電路板。第一開口 122 可採用衝壓、鐳射切割等方式於第一絕緣基材12上形成。 參閱圖4,第一絕緣基材12壓合於銅箔10後形成電路板基 9 1330509 增加可提高鋼㈣舆第 122 步驟3,參閱圖5,於第一絕緣基材12之第一 處塗布塗層14。1330509. Description of the Invention: [Technical Field] The present invention relates to a method of fabricating a printed circuit board, and more particularly to a method of fabricating a hollowed circuit board. [Prior Art] A circuit board generally includes an insulating substrate and a conductive line formed on the insulating substrate. The conductive lines are usually made of copper. The most commonly used material for insulating substrates, Φ, is polyimide, but recently composite materials have been used as insulating substrates to improve the performance of the board. See Bong Sup Kim et al., Polyimide/Carbon Nanotubes Composite Films: A Potential for FPCB, 2006. ICONN '06. International Conference on Nanoscience and Nanotechnology ° Hollow circuit boards, often referred to as embossed boards, mean that the insulation on both sides of the conductive lines in a partial area is hollowed out so that the lines are suspended on both sides. Circuit board. Conductive lines in the cutout area enable double-sided electrical connection. Hollow circuit board • Usually manufactured from copper foil, the specific process is as follows: First, a layer of insulating substrate pre-formed with a first opening is pressed on the first surface of the copper foil; then the wiring is made in the copper foil, and the line is completed. And further pressing a layer of the insulating substrate formed with the second opening on the second surface of the copper foil, wherein the first opening and the second opening position correspond to each other, thereby defining a hollow region on the conductive line, that is, forming a Hollow the circuit board. A protective film is required to be protected on the first surface of the copper foil at the first opening when the wiring is formed in the copper foil. The protective film usually adopts a dry film, but the height difference between the insulating substrate at the opening of the first opening 7 1330509 and (4), the protective film cannot be sufficiently adhered to the first surface of the copper foil, and is generated at the boundary of the first opening. When a gap is made, the silver engraving solution enters the gap, causing side etching and over-etching of the line at the back of the steel foil. ... Therefore, it is necessary to provide a circuit board method that avoids the etching of the syrup 2 boxes when the line is made, and the surface causes the circuit to be (4) and secret. [Description of the Invention] The copper case is a method for making the remaining syrup when the line is made: the surface of the near substrate side is caused by (4) and the silver plated circuit board - the two kinds of road plates are produced, including The following steps: provide. Copper, the copper's treatment consists of pressing the first surface and the first surface of the foil on the first surface of the foil, on the copper base! Forming a protection at the first opening of the first insulating substrate:: insulation except the first opening 2 2 = making a line in the (4); forming a second opening first - "Faith:: f: f The upper press-layer pre-openings correspond to each other. In the manufacturing method of the second opening and the second hollow circuit board, the coating is formed on the opening of the insulating substrate at the opening of the copper:: the road is closely adhered to the copper box, thereby avoiding (4) When the liquid enters the surface of the coating on the tight side of the coating, the side of the line is too expensive. The edge substrate 8 1330509 • [Embodiment] Referring to FIG. 1 'The method for manufacturing the hollow circuit board provided by the technical solution includes the following steps Step 1, refer to Fig. 2, to provide a copper town 10. The copper foil may be an electrolytic copper foil or a rolled copper foil. The copper foil 10 includes an opposite first surface 102 and a second surface 104. Preferably, The copper foil 1〇 may be treated with an acidic cleaning solution to remove the dirt on the first surface 102 and the second surface 1〇4 of the copper foil 10, and increase the first surface 102 and the second surface 104 of the copper foil. Roughness. Step 2, the first insulating base having the first opening 122 formed in advance 12 is pressed onto the first surface 102 of the copper foil 10. Referring to Figure 3, the first insulating substrate 12 has two first openings 122. Of course, the first insulating substrate 12 can also be opened in plurality according to requirements. Opening 12.2. The first insulating substrate 12 may be a flexible substrate such as polyfluorene (PI), polyethylene terephthalate (PET), polytetrafluoroethylene (TeHon), Polyamide, Polymethylmethacrylate, Polycarbonate or Polyimide-polyethylene-p-benzoquinone g copolymer ( Polyamide polyethylene-terephthalate copolymer) or a combination thereof. The first insulating substrate 12 may also be a rigid substrate such as fiberglass cloth, epoxy resin, etc. When a flexible substrate is used, a hollow flexible circuit board can be finally obtained, when rigid A rigid hollow circuit board is finally obtained in the substrate. The first opening 122 can be formed on the first insulating substrate 12 by stamping, laser cutting, etc. Referring to FIG. 4, the first insulating substrate 12 is pressed against the copper foil 10. Forming the board base 9 1330509 increases can increase Steel (iv) 舆 122 Step 3, referring to Figure 5, a coating 14 is applied to the first portion of the first insulating substrate 12.
塗層14成份不限，固化後於後續之線路製作過程 會因機械作用而脫落，但可用適當之溶劑溶劑剝除。具體 地’塗層14可採用各種防焊油墨（s〇lder以伽）或^種 液態光阻二防焊油墨通常又稱為綠漆、可剝膠等。塗層Μ 充分之覆蓋於開口 122處之銅箔1〇之第—表面1〇2上。 本實施例當中，採用絲網印刷之方法於第一絕緣基材 12開口 122處印刷一層防焊油墨。絲網18為25〇目之^絲 網，絲網厚度為5〇微米。印刷時絲網18之離版 1mm，採用硬度為8〇單位之刮刀，刮刀角度2〇度，= 壓，力0.35兆帕，刮刀速度6〇毫米/秒。所謂25〇目指每平 方釐米之絲網中具有250個孔’離版高度指絲網離第一絕 緣基材12之高度，到刀角度指刮刀所處平面與第一基材a 表面之間之角度。當然塗層14還可採用其他塗布方二如喷 塗、刷塗、浸塗等形成。 、 步驟4，參見圖6 ’固化塗層14形成保護層16。 固化係為後續於銅箔1〇中製作線路時防止塗層W從 銅馆10上脫落。本實施當中塗層14採用防焊油墨曰，固化 時可採用紅外線烤箱進行烘烤，烘烤溫度9〇度到度， 優選100度。烘烤時間為5分鐘到30分種。供烤完之後， 防焊油墨固化形成保護層16。 丄州0509 有不== 態光:形成保護層16’則固化過程我 如莫^〜、>果為液態光阻為正光阻，則經過烘烤步驟即可。 部暖^⑮光阻為負光阻’則於料之後彡㈣貞光阻進行全 時負%阳使光阻中之聚合物分子交聯從而於後續製作線路 時負先阻不溶於顯影液。 步驟5，於銅箔10中製作線路。 10之製1作線路可採用濕法姓刻工藝。具體地，首先於銅落 光阻面綱上施加—層幹膜光阻，採用光罩對幹膜 仃k擇性曝S，使幹膜綠有選擇性IU化或分解， 行顯影’❹阻t聚合物分子鏈料之或者未交聯 蝕二t顯影液中，從而銅箱露出部分銅面。將銅箱放於 撞^行钱刻’未被光阻保護之地方就被钱刻液钱刻 /刻完成後將光阻剝除即露出銅線路。當然製作線路 也可採用液態光阻。 步驟6’剝除保護層16。保護層16可與製作線路時鋼 第二表面104上之光阻同時去除。-般剝除保護層 ^㈣U)之第二表面綱上之光阻時可採用強驗性 例如虱氧化鈉溶液。 步驟7,參閱圖7,於銅落10之第二表面1〇4上壓合 預先形成有第二開π 132之第二絕緣基材13。第二開口 132 與第一開π m相對應，從而於銅落1〇上定義出一鎮空區 域’㈣1G位於此鏤空區域内之線路兩邊分別從第一開口 122與第二開口 132露出。 本實施例之鏤空電路板之製作方法中’於銅落ι〇中製 11 1330509 -作線路之前於第一絕緣基材12之第一開口 122處形成保護 ,層16。於銅箔10中製作線路時保護層16緊密貼合於銅箔， 從而避免蝕刻液進入銅箔10靠近第一絕緣基材12 —側之 第一表面102上而造成線路之側钱或過^虫。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 鲁應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案提供之鏤空電路板製作方法流程圖。 圖2係本技術方案提供之鏤空電路板製作方法採用之 銅箔示意圖。 •圖3係本技術方案提供之鏤空電路板製作方法採用之 第一絕緣基材示意圖。 圖4係本技術方案提供之鏤空電路板製作方法銅箔與 鲁第一絕緣基材貼合後之示意圖。 圖5係本技術方案提供之鏤空電路板製作方法印刷塗 層之示意圖。 圖6係本技術方案提供之鏤空電路板製作方法塗層形 成後之示意圖。 圖7係本技術方案提供之鏤空電路板製作方法得到之 鎮空電路板結構不意圖。 12 1330509 【主要元件符號說明】 銅猪 10 第一絕緣基材 12 第二絕緣基材 13 塗層 . 14 保護層 16 絲網 18 第一表面 102 第二表面 104 第一開口 122 第二開口 132 13The composition of the coating 14 is not limited. After curing, it will fall off due to mechanical action in the subsequent circuit manufacturing process, but it can be stripped off with a suitable solvent solvent. Specifically, the coating 14 can be made of various solder resist inks or liquid photoresist. The solder resist ink is also commonly referred to as green paint, peelable glue, and the like. The coating Μ is sufficiently covered on the first surface 1〇2 of the copper foil 1 at the opening 122. In this embodiment, a layer of solder resist ink is printed on the opening 122 of the first insulating substrate 12 by screen printing. The screen 18 is a 25 mesh wire mesh having a thickness of 5 inches. At the time of printing, the screen 18 is 1 mm away from the plate, and a doctor blade having a hardness of 8 inches is used. The blade angle is 2 degrees, the pressure is 0.35 MPa, and the blade speed is 6 mm/sec. The so-called 25 inch means that there are 250 holes in the screen per square centimeter. The off-plate height refers to the height of the screen from the first insulating substrate 12, and the angle to the knife refers to the plane between the plane of the blade and the surface of the first substrate a. angle. Of course, the coating 14 can also be formed by other coating methods such as spraying, brushing, dip coating, and the like. Step 4, see Figure 6 'The cured coating 14 forms a protective layer 16. The curing is to prevent the coating W from falling off the copper gallery 10 when the wiring is subsequently formed in the copper foil. In the present embodiment, the coating 14 is made of a solder resist ink, and can be baked by an infrared oven during curing, and the baking temperature is 9 degrees to a degree, preferably 100 degrees. The baking time is from 5 minutes to 30 minutes. After the baking is completed, the solder resist ink is cured to form the protective layer 16.丄州0509 有不== STATUS LIGHT: Forming the protective layer 16', the curing process, such as Mo~~, > If the liquid photoresist is positive photoresist, it can be baked. The part of the heater 15 is a negative photoresist. Then, after the material, the photoresist is subjected to the full-time negative % anode to crosslink the polymer molecules in the photoresist, so that the negative resistance is insoluble in the developer in the subsequent fabrication of the line. In step 5, a line is formed in the copper foil 10. The 10 system can be used as a line. Specifically, firstly, a dry film photoresist is applied on the copper-off photoresist surface, and a dry mask is used to selectively expose the dry film ,k, so that the dry film green is selectively IU- or decomposed, and the development is blocked. The t polymer molecular chain is either uncrosslinked or etched in the t-developing solution, so that the copper box exposes a part of the copper surface. Put the copper box in the place where it is hit by the money. When it is not protected by the photoresist, it will be stripped of the light and then the photoresist will be stripped to expose the copper line. Of course, liquid photoresist can also be used for the production line. Step 6' strips the protective layer 16. The protective layer 16 can be removed simultaneously with the photoresist on the second surface 104 of the steel when the wiring is made. - Stripping the protective layer - (4) U) The second surface of the photoresist can be used in a strong manner, such as sodium bismuth oxide solution. Step 7, referring to Fig. 7, a second insulating substrate 13 on which a second opening π 132 is formed in advance is press-bonded on the second surface 1〇4 of the copper drop 10. The second opening 132 corresponds to the first opening π m, thereby defining an empty space region on the copper drop 1'. (4) 1G The two sides of the line in the hollow region are respectively exposed from the first opening 122 and the second opening 132. In the method for fabricating the hollowed-out circuit board of the present embodiment, the protective layer 16 is formed at the first opening 122 of the first insulating substrate 12 before the circuit is formed in the slab. When the circuit is formed in the copper foil 10, the protective layer 16 is closely adhered to the copper foil, so as to prevent the etching liquid from entering the first surface 102 of the copper foil 10 near the side of the first insulating substrate 12, thereby causing the side of the line or the ^ insect. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a method for manufacturing a hollow circuit board provided by the technical solution. FIG. 2 is a schematic view of a copper foil used in the method for manufacturing a hollow circuit board provided by the technical solution. • FIG. 3 is a schematic diagram of a first insulating substrate used in the method for fabricating a hollow circuit board provided by the technical solution. Fig. 4 is a schematic view showing the method of manufacturing the hollow circuit board provided by the technical solution after the copper foil is bonded to the first insulating substrate. FIG. 5 is a schematic diagram of a printed coating layer of a method for fabricating a hollow circuit board provided by the technical solution. Fig. 6 is a schematic view showing the formation of the coating method of the hollow circuit board provided by the technical solution. FIG. 7 is a schematic diagram of the structure of the hollow circuit board obtained by the method for manufacturing the hollow circuit board provided by the technical solution. 12 1330509 [Description of main component symbols] Copper pig 10 First insulating substrate 12 Second insulating substrate 13 Coating . 14 Protective layer 16 Wire mesh 18 First surface 102 Second surface 104 First opening 122 Second opening 132 13