TWI328512B - - Google Patents

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Publication number
TWI328512B
TWI328512B TW096116523A TW96116523A TWI328512B TW I328512 B TWI328512 B TW I328512B TW 096116523 A TW096116523 A TW 096116523A TW 96116523 A TW96116523 A TW 96116523A TW I328512 B TWI328512 B TW I328512B
Authority
TW
Taiwan
Prior art keywords
film
metal foil
plastic film
conductor
adhesive layer
Prior art date
Application number
TW096116523A
Other languages
English (en)
Chinese (zh)
Other versions
TW200821147A (en
Inventor
Makoto Shimose
Original Assignee
Kawamura Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Sangyo Co Ltd filed Critical Kawamura Sangyo Co Ltd
Publication of TW200821147A publication Critical patent/TW200821147A/zh
Application granted granted Critical
Publication of TWI328512B publication Critical patent/TWI328512B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
TW096116523A 2006-07-06 2007-05-09 A plastic film-conductive metal foil laminate and a method for producing the same TW200821147A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006186819A JP4138824B2 (ja) 2006-07-06 2006-07-06 プラスチックフィルム−導体金属箔積層体の製造方法

Publications (2)

Publication Number Publication Date
TW200821147A TW200821147A (en) 2008-05-16
TWI328512B true TWI328512B (de) 2010-08-11

Family

ID=39070317

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096116523A TW200821147A (en) 2006-07-06 2007-05-09 A plastic film-conductive metal foil laminate and a method for producing the same

Country Status (3)

Country Link
JP (1) JP4138824B2 (de)
KR (1) KR100950885B1 (de)
TW (1) TW200821147A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023127257A1 (ja) * 2021-12-27 2023-07-06 住友ベークライト株式会社 光導波路の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1191035A (ja) * 1997-09-24 1999-04-06 Matsushita Electric Works Ltd 積層板の製造方法
JP2000219267A (ja) * 1999-01-29 2000-08-08 Toppan Printing Co Ltd キャリヤテープ製造用ラミネート装置及びキャリヤテープ製造方法
JP3351468B2 (ja) * 1999-07-29 2002-11-25 日本電気株式会社 多層プリント配線板の製造方法と積層装置
JP2001135914A (ja) * 1999-11-05 2001-05-18 Toray Ind Inc フレキシブルプリント基板用両面銅張り積層板の製造方法
JP3854479B2 (ja) * 2001-07-23 2006-12-06 株式会社巴川製紙所 Ｔａｂテープの製造方法およびｔａｂテープ用積層フィルム
JP2005216931A (ja) * 2004-01-27 2005-08-11 Kyocera Corp 樹脂フィルム付き金属箔、樹脂フィルム付き配線ユニット及び配線基板並びにその製造方法。

Also Published As

Publication number Publication date
KR20080005069A (ko) 2008-01-10
JP4138824B2 (ja) 2008-08-27
JP2008012810A (ja) 2008-01-24
KR100950885B1 (ko) 2010-04-06
TW200821147A (en) 2008-05-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees