九、發明說明： 【發明所屬之技術領域】 本發明涉及一種風扇架，特別係涉及一種用於發 熱電子元件之風扇架及採用該風扇架之散熱裝置。 【先前技術】 當前，隨著電腦産業之迅速發展，微處理晶片等 發熱電子元件産生之熱量愈來愈多。爲將該等多餘之 熱量有效散發，習知之方法係在發熱電子元件表面貼 設一散熱器，然後在該散熱器上設置一散熱風扇，利 用該散熱風扇産生之冷却氣流對該散熱器進行强制 散熱，從而將發熱電子元件産生之熱量强制散去。例 如，美國專利第7，123,483號公開一種中央處理器之 散熱裝置，該散熱裝置包括一散熱風扇、一散熱器及 一風扇架。其中，該散熱風扇固定在一風扇架上，該 風扇架上設有複數扣臂，扣臂之末端設有扣鈎，對應 散熱器上剖溝形成有卡槽，該扣鈎扣入卡槽内，從而 將風扇架固定至散熱器上。 然而，由於散熱器在製造完成後還須剖溝設置卡 槽，增加了製作工序，也增加了製造上之成本；同時， 在將散熱器固定至中央處理器時，還須使用額外之金 屬扣件進行固定，使成本進一步攀升。 【發明内容】 有鑒於此，有必要提供一種結構簡單、有利於降 1327269 低製造成本之風扇架及採用該風扇架之散熱裝置。 一種風扇架，用於固定散熱風扇至散熱器上，該 風扇架包括位於中間之框體，該框體之上方延伸設有 複數用於支撑該散熱風扇之支柱，該框體之下方延伸 設有複數扣臂，該等扣臂中至少兩扣臂於底端向内設 有扣鈎，該等扣鈎用於扣接在散熱器之底面上而將風 扇架固定至散熱器上。 一種散熱裝置，包括散熱風扇、風扇架、複數扣 具及散熱器，該風扇架包括框體、設置在該框體上方 之複數支柱及設置在該框體下方之複數扣臂，該散熱 風扇由該等支柱固定在該風扇架内，該等扣臂中至少 兩扣臂於底端向内設有扣釣，該扣鈎扣接在散熱器之 底面上而將風扇架固定至散熱器上。 進一步地*該等扣臂中至少兩扣臂於底端向外設 有扣脚，該等扣具穿過該等扣脚而將該散熱器固定。 與習知技術相比，藉由在風扇架之扣臂之内側設 置扣鈎，可以直接將風扇架扣在散熱器之底面上，散 熱器在加工完成後無須再進行剖溝以形成卡槽之工 序；同時，藉由扣臂上之扣脚可實現散熱器之固定， 結構簡單，無須使用額外之金屬扣件，從而有效降低 產品之製造成本。 【實施.方式】 下面參照附圖，結合實施例作進一步說明。 圖1所示爲本發明散熱.裝置其中一實施例之立體 1327269 分解圖。該散熱裝置100包括一散熱風扇10、一風扇 架20、複數扣具30及一散熱器40，該散熱風扇10及散 熱器40固定在該風扇架20内，該散熱風扇10、風扇架 20、散熱器40之組合藉由扣具30固定至一電路板50 上，並使該散熱器40與一發熱電子元件60之表面緊密 貼接（如圖3及圖4所示），以吸收該發熱電子元件60産 生之熱量，並藉由該散熱風扇10産生之冷却氣流將該 等熱量强制散去。 請參照圖1與圖2，該散熱風扇10包括一定子12及 一轉子14。該定子12固定於該風扇架20内之頂部中央 位置，該轉子14上設有複數葉片142並組裝至該定子 12上。 該散熱器40由鋁擠一體製成，包括一圓柱狀本體 42及複數從該本體42周邊表面徑向朝外呈放射狀延 伸之鰭片44。該本體42向下延伸突設一底座46(如圖2 所示），該底座46用於同發熱電子元件60接觸。該等鰭 片44在徑向平面上沿相同方向彎曲設置，從而使該散 熱器40整體呈圓柱狀。該等鰭片44之彎曲方向與散熱 風扇10産生之氣流方向相反，各相鄰鰭片44間形成一 氣流通道45，將散熱風扇10產生之冷却氣流導引至發 熱電子元件60及周圍元件上進行散熱。該等鰭片44靠 近自由端之位置設有分叉442，以增加該散熱器40之 散熱面積，提高該散熱器40之散熱效率。 該風扇架20整體成框架結構，其包括一框體22、 8 四個支柱242及四個扣臂244。該框體22爲一圓環狀結 構’其形狀與散熱器40之外形相似，但該框體22之外 徑略小於該散熱器40之外徑。該等支柱242及四個扣 臂244與該框體22—體成型，且在與該框體22垂直之 方向上均勻分布，該等支柱242位於該框體22之上 方’該等扣臂244位於該框體22之下方。該等支柱242 之高度相同且其頂端向内分別水平延伸形成一支架 242a，該等支架242a與該散熱風扇1〇之定子12連接， 將該定子12定位於該風扇架20頂端之中央位置，該等 支柱242之高度經過適當設置以使組裝後之散熱風扇 1〇之底端稍高於該框體22之底端。每一扣臂244之長 度相同且底端分別向外凸伸設有一扣脚244a，該扣脚 244a與該扣臂244相連之兩側分別設有一加强肋245， 該加强肋245用於增强扣脚244a與扣臂244之連接强 度。該扣脚244a上設有一凹槽244b，該凹槽244b内設 有一不規則之半圓形穿孔246。該等扣臂244中之兩相 對之扣臂244之底端沿與扣脚244相反之方向向内分 別凸設形成一扣鈎244c(如圖2所示）。 扣具30爲銷釘式扣具(push pin)，其可穿過該扣脚 244a之穿孔246並與該扣脚244a之凹槽244b抵接配 合，從而將該風扇架20固定至該電路板50上。由於該 穿孔246爲一不規則之半圓形孔，其可與該扣具30緊 密配合而防止扣具30發生轉動。同時，該凹槽244b與 該扣具30之緊密配合可增强扣脚244a與扣具30之定位 1327269 效果。當然，該扣具30也可爲其他種類之扣具如螺釘 . 等。 清參照圖1至圖4，該散熱器4〇中之部分鰭片44之 長度比其他鰭片短，於末端對應該風扇架2〇之每一扣 臂244形成一切槽48,以將該等扣臂244收容於内，防 止散熱器40發生轉動。該框體22之底面向下凸伸設有 凸台222，由於該框體22之外徑小於該散熱器4〇之外 徑，該等凸台222抵頂在該散熱器4〇之頂面上。同時， • 扣臂244上之扣鈎244c扣接在該散熱器40之底面，從而 將該散熱器40在竪直方向上固定（如圖4所示）。另外， 該框體22向下均勻間隔設置四個撞板224，每一擔板 224設置在相鄰之兩個扣臂244之間，並與散熱器40之 側面抵靠，將該散熱器40在水平方向上固定。 組裝時，先將散熱風扇1〇之轉子14組裝至定子12 上，接著將該散熱器40嵌接固定在風扇架2〇内，使扣 鲁 臂244之扣鈞244c扣接在散熱器40之底面上，實現散熱 風扇10與散熱器40之預組裝；最後利用該等扣具3〇將 風扇架20固定在電路板50上，使散熱器40之底座46緊 貼在發熱電子元件60之上即可（如圖3及圖4所示）。該 底座46還起到抬高散熱器40之功效，防止扣鈎244c與 電路板50發生干涉。 由以上叙述可知’該風扇架20不僅能定位該散熱 風扇10，將該散熱風扇10固定至該散熱器40上，而且 能將該散熱器40嵌接固定，並藉由扣具30直接將散# 10 1327269 風扇10、散熱器40固定至電路板上’使散熱器40與 發熱電子元件60緊密貼接。與習知技術相比’藉由在 風扇架20之扣臂244之内側設置扣鈎244c ’可以直接將 散熱風扇10卡扣在散熱器40之底面上’散熱器在鋁 擠加工完成後無須存進行剖溝以形成卡槽之工序；同 時，藉由扣臂244上之扣脚244a即可實現散熱器40之固 定，結構簡單，無須使用額外之金屬扣件’從而縮短 散熱裝置100之製造周期，簡化製造流程，有效降低 製造成本，提升産品市場競爭力。 综上所述，本發明符合發明專利要件，爰依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施 例，舉凡熱悉本案技藝之人士，在爰依本發明精神所 作之等效修飾或變化，皆應涵蓋於以下之申請專利範 圍内。[Technical Field] The present invention relates to a fan frame, and more particularly to a fan frame for heating electronic components and a heat sink using the same. [Prior Art] Currently, with the rapid development of the computer industry, heat generated by heat-generating electronic components such as micro-processed wafers is increasing. In order to effectively dissipate the excess heat, a conventional method is to apply a heat sink on the surface of the heat-generating electronic component, and then a heat-dissipating fan is disposed on the heat-dissipating fan, and the heat-dissipating airflow generated by the heat-dissipating fan is used to force the heat sink. Heat dissipation to force the heat generated by the heat-generating electronic components to dissipate. For example, U.S. Patent No. 7,123,483 discloses a heat sink for a central processing unit including a heat sink fan, a heat sink and a fan frame. The cooling fan is fixed on a fan frame, and the fan frame is provided with a plurality of buckle arms, and the end of the buckle arm is provided with a hook, and a slot is formed in the corresponding groove on the heat sink, and the buckle is buckled into the card slot. , thereby fixing the fan frame to the heat sink. However, since the heat sink must be grooved to provide a card slot after the manufacture is completed, the manufacturing process is increased, and the manufacturing cost is also increased. At the same time, when the heat sink is fixed to the central processing unit, an additional metal buckle is required. The pieces are fixed and the cost is further increased. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a fan frame that is simple in structure and advantageous in reducing the manufacturing cost of 1327269 and a heat sink using the same. A fan rack for fixing a heat dissipating fan to a heat sink, the fan rack includes a frame body in the middle, and a plurality of pillars for supporting the heat dissipating fan are extended above the frame body, and the frame body is extended below the frame body The plurality of buckle arms are provided with at least two buckle arms at the bottom end thereof, and the buckle hooks are used for fastening the bottom surface of the heat sink to fix the fan frame to the heat sink. A heat dissipation device includes a heat dissipation fan, a fan frame, a plurality of buckles, and a heat sink. The fan frame includes a frame body, a plurality of pillars disposed above the frame body, and a plurality of buckle arms disposed under the frame body. The pillars are fixed in the fan frame, and at least two of the buckle arms are provided with buckle fishing inwardly at the bottom end, and the buckle hooks are fastened on the bottom surface of the heat sink to fix the fan frame to the heat sink. Further, at least two of the buckle arms have buckles on the bottom end of the buckle arms, and the fasteners pass through the buckles to fix the heat sink. Compared with the prior art, by providing a hook on the inner side of the buckle arm of the fan frame, the fan frame can be directly fastened on the bottom surface of the heat sink, and the heat sink does not need to be grooved to form a card slot after the processing is completed. At the same time, the fixing of the radiator can be realized by the buckle on the buckle arm, and the structure is simple, and no additional metal fastener is needed, thereby effectively reducing the manufacturing cost of the product. [Embodiment] Modes will be further described below with reference to the accompanying drawings. 1 is an exploded view of a stereo 1327269 of one embodiment of the heat dissipation device of the present invention. The heat dissipation device 100 includes a heat dissipation fan 10, a fan frame 20, a plurality of fasteners 30, and a heat sink 40. The heat dissipation fan 10 and the heat sink 40 are fixed in the fan frame 20. The heat dissipation fan 10 and the fan frame 20 are The combination of the heat sink 40 is fixed to a circuit board 50 by the clip 30, and the heat sink 40 is closely attached to the surface of a heat-generating electronic component 60 (as shown in FIGS. 3 and 4) to absorb the heat. The heat generated by the electronic component 60 is forcibly dissipated by the cooling airflow generated by the cooling fan 10. Referring to Figures 1 and 2, the cooling fan 10 includes a stator 12 and a rotor 14. The stator 12 is fixed to a central portion of the top of the fan frame 20, and the rotor 14 is provided with a plurality of blades 142 and assembled to the stator 12. The heat sink 40 is integrally formed of aluminum and includes a cylindrical body 42 and a plurality of fins 44 extending radially outward from the peripheral surface of the body 42. The body 42 extends downwardly to protrude from a base 46 (shown in FIG. 2) for contacting the heat-generating electronic component 60. The fins 44 are curved in the same direction on a radial plane so that the heat sink 40 is entirely cylindrical. The bending direction of the fins 44 is opposite to the direction of the airflow generated by the cooling fan 10, and an air flow passage 45 is formed between each of the adjacent fins 44 to guide the cooling airflow generated by the cooling fan 10 to the heat-generating electronic component 60 and the surrounding components. Cool down. The fins 44 are provided with a fork 442 near the free end to increase the heat dissipation area of the heat sink 40 and improve the heat dissipation efficiency of the heat sink 40. The fan frame 20 is integrally formed into a frame structure and includes a frame body 22, 8 four pillars 242 and four buckle arms 244. The frame 22 is an annular structure whose shape is similar to that of the heat sink 40, but the outer diameter of the frame 22 is slightly smaller than the outer diameter of the heat sink 40. The pillars 242 and the four latching arms 244 are integrally formed with the frame body 22 and uniformly distributed in a direction perpendicular to the frame body 22, and the pillars 242 are located above the frame body 22. Located below the frame 22. The pillars 242 have the same height and the top ends thereof extend horizontally to form a bracket 242a. The brackets 242a are connected to the stator 12 of the heat dissipation fan 1 , and the stator 12 is positioned at the center of the top of the fan frame 20 . The height of the pillars 242 is appropriately set so that the bottom end of the assembled cooling fan 1 is slightly higher than the bottom end of the frame 22. Each of the fastening arms 244 has the same length and a buckle leg 244a protruding from the bottom end. The two sides of the fastening leg 244 and the fastening arm 244 are respectively provided with a reinforcing rib 245 for reinforcing the buckle. The strength of the connection of the foot 244a to the buckle arm 244. The buckle 244a is provided with a recess 244b, and the recess 244b is provided with an irregular semicircular through hole 246. The bottom ends of the two opposite arms 244 of the buckle arms 244 are respectively protruded inwardly in a direction opposite to the buckle legs 244 to form a hook 244c (shown in FIG. 2). The buckle 30 is a push pin that can pass through the through hole 246 of the buckle 244a and abut against the groove 244b of the buckle 244a, thereby fixing the fan frame 20 to the circuit board 50. on. Since the perforation 246 is an irregular semi-circular hole, it can be tightly fitted with the buckle 30 to prevent the buckle 30 from rotating. At the same time, the close fit of the recess 244b and the clip 30 enhances the positioning of the buckle 244a and the buckle 30 1327269. Of course, the buckle 30 can also be other types of fasteners such as screws. Referring to FIG. 1 to FIG. 4, a portion of the fins 44 of the heat sink 4 are shorter in length than the other fins, and each of the latch arms 244 corresponding to the end of the fan frame 2 defines a slot 48 for the same. The buckle arm 244 is received therein to prevent the heat sink 40 from rotating. The bottom surface of the frame body 22 is downwardly convexly provided with a boss 222. Since the outer diameter of the frame body 22 is smaller than the outer diameter of the heat sink 4, the bosses 222 are abutted on the top surface of the heat sink 4 on. At the same time, the clasp 244c on the buckle arm 244 is fastened to the bottom surface of the heat sink 40, thereby fixing the heat sink 40 in the vertical direction (as shown in Fig. 4). In addition, the frame 22 is evenly spaced downwardly with four strikers 224. Each of the support plates 224 is disposed between the adjacent two buckle arms 244 and abuts against the side of the heat sink 40. Fixed in the horizontal direction. When assembling, the rotor 14 of the cooling fan 1 is first assembled to the stator 12, and then the heat sink 40 is embedded and fixed in the fan frame 2, and the buckle 244c of the buckle arm 244 is fastened to the heat sink 40. On the bottom surface, pre-assembly of the heat dissipation fan 10 and the heat sink 40 is achieved; finally, the fan frame 20 is fixed on the circuit board 50 by the fasteners 3, so that the base 46 of the heat sink 40 is closely attached to the heat-generating electronic component 60. Just (as shown in Figure 3 and Figure 4). The base 46 also functions to raise the heat sink 40 to prevent the hook 244c from interfering with the circuit board 50. It can be seen from the above that the fan frame 20 can not only locate the heat dissipating fan 10, but also fix the heat dissipating fan 10 to the heat sink 40, and can fix and fix the heat sink 40, and directly disperse it by the clip 30. # 10 1327269 The fan 10 and the heat sink 40 are fixed to the circuit board 'to make the heat sink 40 closely adhere to the heat-generating electronic component 60. Compared with the prior art, the heat sink fan 10 can be directly snapped onto the bottom surface of the heat sink 40 by providing the hook 244c on the inner side of the buckle arm 244 of the fan frame 20. The heat sink does not need to be stored after the aluminum extrusion process is completed. The process of grooving to form a card slot; at the same time, the fixing of the heat sink 40 can be realized by the buckle 244a on the buckle arm 244, and the structure is simple, and no additional metal fasteners are needed; thereby shortening the manufacturing cycle of the heat sink 100 Simplify the manufacturing process, effectively reduce manufacturing costs and enhance product market competitiveness. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the modifications and variations of the present invention within the scope of the following claims.
【圖式簡單說明】 圖1爲本發明散熱裝置其中一實施例沿第一視角之 立體分解圖。 圖2爲圖i所示散熱裝置沿第二視角之立體分解圖。 圖3爲圖1所示散熱裝置之立體組裝圖。 圖4爲圖1所示散熱裝置之組裝側視圖。 【主要元件符號說明】 散熱裝置 定子 1〇〇 散熱風扇 12 轉子 10 11 14 葉片 142 風扇架 框體 22 凸台 擋板 224 支柱 支架 242a 扣臂 扣腳 244a 凹槽 扣鈎 244c 加強肋 穿孔 246 扣具 散熱器 40 本體 韓片 44 分叉 氣流通道 45 切槽 電路板 50 發熱電子元件 12BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of an embodiment of a heat sink according to the present invention taken along a first viewing angle. 2 is an exploded perspective view of the heat sink shown in FIG. 3 is an assembled, isometric view of the heat sink shown in FIG. 1. 4 is an assembled side view of the heat sink shown in FIG. 1. [Main component symbol description] Heat sink stator 1〇〇 Cooling fan 12 Rotor 10 11 14 Blade 142 Fan frame 22 Boss baffle 224 Post bracket 242a Buckle leg 244a Groove hook 244c Reinforced rib piercing 246 Buckle Radiator 40 body Korean film 44 bifurcated air flow channel 45 grooving circuit board 50 heating electronic components 12