201124061 六、發明說明： ' .n押【發明所屬之技術領调-v *7 1 • [_]本發明涉及一種散熱裝置’特別涉及一種用以對電子元 件散熱的散熱裝置。 [先前技術3 [〇〇〇2]隨著中央處理器（CPU)等電子元件功率的不斷提高，散 熱問題越來越受到人們的重視。通常業界在電路板上安 裝散熱器，用以對設置在電路板上的電子元件散熱。散 熱器通常包括一與電子元件導熱接觸的底座及設置於底 座上的複數散熱片為了滿.足電腦機箱内..部空間結構和 佈局的要求，散熱器的底座通常被設計成各種不對稱的 形狀，並藉由螺絲等將散熱器的底座安裝在電路板上。 然而，由於與電子元件接觸的底座的結嫌-對稱，導致 力矩的不平衡，使底座的一端容易翹起，從而使底座與 電子元件接觸不良，影響散熱器的散熱性能。 【發明内容】 [0003] Ο [0004] 有繁於此’有必要提供一種可與電子元件緊密接觸的散 熱裝置。 -種散熱裝置’用於對安裝於電路板上的電子元件散熱 ’包括-與電子元件導熱接觸的底板及一固定在底板上 的扣具，該扣具用於將散熱裝置固裝於電路板上，該底 板底部向下延伸有複數凸柱，在扣具將散熱裝置固裝於 電路板上之前’該複數凸柱可穿設於電路板中，用以將 散熱裝置預定位於電路板上。 本發明中’由於在散熱裝置底部延伸有純，該凸柱穿 098143280 表單編號A0101 第3頁/共17百 ^ w Λ 0982074198-0 [0005] 201124061201124061 VI. Description of the invention: '.n. The technology of the invention belongs to -v *7 1 • [_] The present invention relates to a heat dissipating device, and particularly relates to a heat dissipating device for dissipating heat from an electronic component. [Prior Art 3 [〇〇〇2] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has received more and more attention. Generally, the industry installs a heat sink on a circuit board to dissipate heat from electronic components disposed on a circuit board. The heat sink usually includes a base that is in thermal contact with the electronic component and a plurality of heat sinks disposed on the base. In order to meet the requirements of the space structure and layout of the computer chassis, the base of the heat sink is generally designed to be various asymmetrical. Shape, and mount the base of the heat sink on the circuit board by screws or the like. However, due to the symmetry of the base in contact with the electronic components, the imbalance of the torque causes the one end of the base to be easily lifted, thereby causing poor contact between the base and the electronic component, and affecting the heat dissipation performance of the heat sink. SUMMARY OF THE INVENTION [0003] There is a need to provide a heat sink that can be in close contact with electronic components. a heat dissipating device 'for dissipating heat from an electronic component mounted on a circuit board' includes: a bottom plate in thermal contact with the electronic component and a clip fixed to the bottom plate, the clip being used to fix the heat sink to the circuit board The bottom of the bottom plate extends downwardly with a plurality of studs. Before the clips fix the heat sink on the circuit board, the plurality of studs can be inserted into the circuit board to reserve the heat sink on the circuit board. In the present invention, the protrusion is worn at the bottom of the heat sink, and the column is worn 098143280. Form No. A0101 Page 3 / 17 hundred ^ w Λ 0982074198-0 [0005] 201124061
If'ii, ,m|史於電路板中，從而對電路板上的散熱裝置進行了耀哀 llli ι; γ, ΙΐιιΙϋϋι 3期 ，H1 1位元·並可着防止餵顧|1漱 11置的一端翹起而導致底板丨鼻 電子元件接觸不良。 【實施方式】 [0006] 請參閱圖1和圖2，本發明一些實施例中的散熱裝置用於 對安裝於電路板40上的電子元件42散熱，該散熱裝置包 括一散熱器10、安裝於散熱器10上的一風扇20及一扣具 [0007] 請參閱圖3及圖4，散熱器10包括一底板12、一結合於底 板12底部的導熱板14、一結合於底板12頂部的鰭片組16 及一與底板12、導熱板14和鰭片組16導熱結合的熱管18 。導熱板14直接與電路板40上的電子元件42導熱接觸。 所述電路板40上電子元件42周圍開設有二通孔44及形成 二扣環46。該熱管18呈扁平並彎成V形，其具有一吸熱段 182及一放熱段184。 [0008] 在本發明的一些實施例中，底板12係由鋁等金屬材料一 體形成，而導熱板14係由銅等金屬材料製成，其導熱率 高於底板12的導熱率。底板12大致呈扁平狀，並可分為 大致呈拱形狀的第一部分和大致呈方塊狀的第二部分， 底板1 2的第一部分的圓弧形邊緣與第二部分的一角連接 ，使得底板12整體為不對稱、不規則形狀。底板12的第 一部分中間設有一呈Υ字形的固定座122，三第一進風口 120等間隔地開設於固定座122周圍。該固定座122用以 固定風扇20，其各分支上開設有固定孔1 220。三個固定 部123間隔地形成於底板12的第一部分的外緣，每一固定 098143280 表單編號Α0101 第4頁/共17頁 0982074198-0 201124061 部123設有一通孔12办0。 [0009] 〇 底板1 2的第竺分‘中▲的頂表面對應電子元件4 2的正上 方處向上凸伸出一縱長的凸臺124，該凸臺124大致沿底 板12的第二部分的對角線方向延伸。該凸臺124上沿其延 伸方向開設一狹長的狹槽1240，所述扣具30容置於該狹 槽1 240内。二固定板1242固定於該凸臺124的兩端，用 以將扣具30固定於狹槽1240内。該凸臺124的兩端各開 設二位於狹槽1240兩侧的鎖固孔1244，每一固定板1242 則開設與鎖固孔1244對應的二通孔1246 ’四螺釘1247穿 過固定板1242的通孔螺鎖於凸臺124的鎖固孔1244 而將固定板1242固定於凸臺-124v_L。δ/臺ί24的中間部分 較其兩端高，且凸臺124的中間部分的狹槽1240較其兩端 的狹槽1240淺。 [0010] ο 底板12的第一、第二部分的頂表面上分:別開設有一第一 溝槽125和第二·溝槽128 ’用以分別容置熱管18的放熱段 184和吸熱段182 °第一溝槽125設於固定座122的旁邊。 第二溝槽128的延伸方向與底板12的第一部分的鄰近的一 邊緣大致平行，真第二溝槽128與凸臺124相交。第二溝 槽128與&臺124相交的位置對應電子元件42的位置。第 二溝槽128底部開設一矩形通孔1280，底板12的第二部 分的底表面中夹開設一矩形槽126 ’該槽126與第二溝槽 128相連通，所述導熱板14容置於該槽126内，且熱管18 的吸熱段182的底表面與導熱板14的頂表面導熱接觸。槽 126的四角處甸下凸伸出四開設有固定孔（未標號）的固 定柱126〇 ,導熱板14的四角處開設四與固定柱1260對應 098143280 表單編號Α0101 第5頁/共17頁 0982074198-0 201124061 的通孔140，四螺釘142穿過導熱板14的通孔鎖於 槽1掷内的固定趣而將導熱板14郵箱游細2的槽 126内。在本發明其他的一些實施例中，底板12的底表面 直接接觸電子元件42，而不必在開設槽126來嵌置導熱板 14。 [0011] 底板12的第二部分底表面的矩形對角處垂直向下凸伸出 二凸柱127 ’該二凸柱127的連線在電路板40上的投影穿 過電子元件42的中心且關於該中心對稱，且二凸柱127的 連線與底板12頂表面上的凸臺124的延伸方向交叉。每一 凸枉127包括從底板12雇表面延伸&的一拄狀的臺階部 1272及一從臺階部1272中央向下延仲出的桿部1 274。該 臺階部1272底端抵壓電路板40的頂表面。該桿部1274的 直徑與電路板40上通孔44的孔徑一致或略小於電路板40 上通孔44的孔徑。在扣具30將散熱裝置固裝於電路板40 上之前，該桿部1274可穿設電咚板40的通孔44，用以將 散熱裝置預定位於電路板40上’即該桿部1274並非固定 連接於電路板40上。該臺階部1272的高度與電子元件42 的厚度一致，以使導熱板14恰好可與電子元件42導熱接 觸，益可防止導熱板14過度擠壓電子元件42。 ,[0012] 所述鰭片組16由複數間隔的鰭片16 2堆疊而成’相鄰的鰭 片162間形成複數氣流通道（未標號）°該轉片組16的底 部形成一凹槽（未梯號）’熱管18的放熱段184容置於該 四槽且賴牌16導錢觸。 098143280 所述風扇20為一離心式風扇 其包括一扇框22及位於扇 摧£2内側的 表單煸號A0101 葉輪24。葉輪24的底部安裝有與底板12的固 第 6 頁/共 17 頁 0982074198-0 [0013] 201124061 定座122對應妁一Υ形支撐座242 ’藉由將支撐座242各分 支上的螺翁為44螺鎖於固定，座12 2的固定孔1 2 2 0内將葉、輪 24安裝在底板12的固定座122上。扇框22包括一面板22〇 及沿面板220外緣垂直向下延伸的側壁222。面板220的 形狀對應於散熱器10底板12的第一部分，面板22〇對應於 散熱器10底板12的第一進風口 120設有一圓形的第二進風 口 2200。扇框22的侧壁222對應於底板12的固定部123處 Ο 形成三個定位柱224 ’每一定位柱224設有一孔口 2240， 螺釘2242穿過底板12固定部123的填孔1230螺鎖於定位 柱2 2 4的孔口 2 2 4 0，將扇框2¾固定參散熱器1 〇的底板i 2 的頂表面’從而扇框22與底板12·的第一部分共同形成一 容置葉輪24的腔室（未標號）。 [0014] ❹ 上述扣具30可由彈性金屬線彎折而成，其包括一中間部 32及分別連接於該t間部32兩端的二扣臂34。該中間部 32在電路板40上的投影穿過電子元件42的中心。該中間 部32容置在凸臺124的狹槽1240内，其包括一限定部322 及由限定部322兩端向下彎折丹向外水平延伸形成的二抵 壓部324，該二抵壓部324與限定部322在同一豎直平面 上。該限定部322對應收容在凸臺124的中間部分的狹槽 1240内，抵壓部324對應收容在凸臺124兩端的狹槽1240 内，由於凸臺124中間部分的狹槽1240比凸臺124兩端的 狹槽1240淺，這樣可防止扣具30以中間部32為軸旋轉。 優選地，上述二扣臂34從該中間部32兩端分別向中間部 32所在平面的兩側斜向上再斜向下彎折延伸。該二扣臂 34末端分別形成一扣鉤342，該扣鉤342係由該扣臂34末 098143280 表單煸號A0101 第7頁/共17頁 0982074198-0 201124061 端向下彎折再彎曲向外、向上延伸而減，〗其用於與固定 在該電路板灿上的扣環4 6扣合，吒熱器丨〇固定在 該電路板40上。 [0015] 安裝時’將散熱裝置置於電路板40上，使散熱器1〇的首 熱板14貼設在電子元件42上，同時使底板12的凸杈a? 對應穿過電路板40上的二通孔44，將扣具30的扣鉤342 鉤扣在電路板40上的扣環46上。 [0016] 本發明中，在散熱裝置的結構關於扣具3〇不對稱的情兄 下’由於在散熱裝置底部凸伸U二仏柱127，該二凸枝 127穿設電路板40 ’且該二凸枉127的連線與扣具3〇交又 ，從而對電路板40上的散熱裝置進行了預定位元，並可 有效防止散熱裝置的一端翹g或散熱裝置圍繞扣具3〇轉 動。 [0017] 散熱裝置工作時，導熱板14吸收電子元件42產生的熱量 ，將其傳遞給熱管18，進而熱量藉由爇管丨8傳遞至鰭片 組1 6。風扇2 0同時從底板12的第一進風口 12〇及風扇 的第二進風口 2200將外界空氣吸入扇框22與底板12共同 形成的腔至内，氣流在葉輪24的作用下，被吹向底板I? 上的雜片組16 ’經趙片16 2間的氣流通道吹出。由於底板 12上開設有第一進風口 120，有利於從底板12底部吸入氣 流，從而氣流流入第一進風口 12 0的過程中冷卻了底板12 下面的電子元件42。 綜上所述’本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 098143280 表單編號A0101 第8頁/共17頁 0982074198-0 [0018] 201124061 熟悉本案技藝之人士，在爰依本發明撬神.·所作之等效修-1 r飾或變抱字，葉皆應涵蓋於以下之本-請靡許I·®内。 ， 【圖式簡單說明】 [0019] 圖1係本發明散熱裝置的立體組裝圖，該散熱裝置組裝在 一電路板上。 [0020] 圖2係圖1中散熱裝置的倒置圖。 [0021] 圖3係圖1中散熱裝置的分解圖。 [0022] 圖4係圖3的倒置圖。If'ii, ,m|history in the board, so that the heat sink on the board is stunned llli ι; γ, ΙΐιιΙϋϋι 3, H1 1 bit · and can prevent feeding | 1漱11 One end of the tilting causes the bottom plate to be in poor contact with the electronic components. [0006] Referring to FIG. 1 and FIG. 2, a heat dissipating device in some embodiments of the present invention is used to dissipate heat from an electronic component 42 mounted on a circuit board 40. The heat dissipating device includes a heat sink 10 and is mounted on A fan 20 and a buckle on the heat sink 10 [0007] Referring to FIG. 3 and FIG. 4, the heat sink 10 includes a bottom plate 12, a heat conducting plate 14 coupled to the bottom of the bottom plate 12, and a fin coupled to the top of the bottom plate 12. The wafer set 16 and a heat pipe 18 are thermally coupled to the bottom plate 12, the heat conducting plate 14 and the fin set 16. The thermally conductive plate 14 is in direct thermal contact with the electronic components 42 on the circuit board 40. A two-way hole 44 is formed around the electronic component 42 of the circuit board 40 and a second buckle 46 is formed. The heat pipe 18 is flat and curved into a V shape having a heat absorbing section 182 and a heat releasing section 184. In some embodiments of the present invention, the bottom plate 12 is formed of a metal material such as aluminum, and the heat conductive plate 14 is made of a metal material such as copper, and has a thermal conductivity higher than that of the bottom plate 12. The bottom plate 12 is substantially flat and can be divided into a first portion having a substantially arch shape and a second portion having a substantially square shape. The arcuate edge of the first portion of the bottom plate 12 is connected to a corner of the second portion, so that the bottom plate 12 is asymmetrical and irregular in shape. A U-shaped fixing seat 122 is disposed in the middle of the first portion of the bottom plate 12, and the three first air inlets 120 are equally spaced around the fixing base 122. The fixing base 122 is used for fixing the fan 20, and each of the branches is provided with a fixing hole 1220. The three fixing portions 123 are formed at intervals on the outer edge of the first portion of the bottom plate 12, each fixed 098143280 Form No. 101 0101 Page 4 / Total 17 pages 0982074198-0 201124061 The portion 123 is provided with a through hole 12 for 0. [0009] The top surface of the second portion of the bottom plate of the bottom plate 12 is convexly protruded upwardly from a portion directly above the electronic component 42. The boss 124 is substantially along the second portion of the bottom plate 12. The diagonal direction extends. An elongated slot 1240 is defined in the extending direction of the boss 124. The buckle 30 is received in the slot 1 240. Two fixing plates 1242 are fixed to both ends of the boss 124 for fixing the clip 30 in the slot 1240. Two locking holes 1244 are defined in the two ends of the slot 1240, and each of the fixing plates 1242 defines a two-way hole 1246 corresponding to the locking hole 1244. The four screws 1247 pass through the fixing plate 1242. The through hole is screwed to the locking hole 1244 of the boss 124 to fix the fixing plate 1242 to the boss -124v_L. The middle portion of the δ/table 245 is higher than its ends, and the slot 1240 of the intermediate portion of the boss 124 is shallower than the slot 1240 at its both ends. [0010] ο The top surface of the first and second portions of the bottom plate 12 is divided into: a first trench 125 and a second trench 128 are formed to accommodate the heat releasing portion 184 and the heat absorbing portion 182 of the heat pipe 18, respectively. The first groove 125 is disposed beside the fixing seat 122. The second groove 128 extends substantially parallel to an adjacent edge of the first portion of the bottom plate 12, and the second groove 128 intersects the land 124. The position at which the second groove 128 intersects the & stage 124 corresponds to the position of the electronic component 42. A rectangular through hole 1280 is defined in the bottom of the second groove 128. A rectangular groove 126 is formed in the bottom surface of the second portion of the bottom plate 12. The groove 126 is in communication with the second groove 128. The heat conducting plate 14 is received. The bottom surface of the heat absorbing section 182 of the heat pipe 18 is in thermal contact with the top surface of the heat conducting plate 14. The four corners of the groove 126 protrude downwardly and protrude from the fixing post 126 设有 which is provided with a fixing hole (not labeled). The four corners of the heat conducting plate 14 are opened at four corners corresponding to the fixing column 1260. 098143280 Form No. 1010101 Page 5 of 17 page 0982074198 -0 201124061 The through hole 140, the four screws 142 pass through the through hole of the heat conducting plate 14 to lock in the slot 1 of the slot 1 and the heat conducting plate 14 is in the slot 126 of the thin box 2. In other embodiments of the invention, the bottom surface of the bottom plate 12 directly contacts the electronic component 42 without having to define the slot 126 to embed the thermally conductive plate 14. [0011] a rectangular portion of the bottom surface of the second portion of the bottom plate 12 protrudes vertically downward from the two protrusions 127'. The projection of the connection of the two protrusions 127 on the circuit board 40 passes through the center of the electronic component 42 and The center is symmetrical, and the line connecting the two studs 127 intersects with the extending direction of the boss 124 on the top surface of the bottom plate 12. Each of the tenons 127 includes a stepped portion 1272 extending from the surface of the bottom plate 12 and a stem portion 274 extending downward from the center of the step portion 1272. The bottom end of the step portion 1272 is pressed against the top surface of the circuit board 40. The diameter of the stem portion 1274 is the same as or slightly smaller than the aperture of the through hole 44 in the circuit board 40. Before the clip 30 fixes the heat sink on the circuit board 40, the rod portion 1274 can pass through the through hole 44 of the electric board 40 for pre-positioning the heat sink on the circuit board 40. That is, the rod portion 1274 is not Fixedly connected to the circuit board 40. The height of the step portion 1272 coincides with the thickness of the electronic component 42 such that the heat conducting plate 14 is just in thermal contact with the electronic component 42, thereby preventing the heat conducting plate 14 from over-squeezing the electronic component 42. [0012] The fin group 16 is stacked by a plurality of spaced fins 16 2 . A plurality of air flow channels (not labeled) are formed between adjacent fins 162. The bottom of the rotor group 16 forms a recess ( The unheated section 184 of the heat pipe 18 is accommodated in the four slots and the card 16 is guided by the money. 098143280 The fan 20 is a centrifugal fan which includes a frame 22 and a form nickname A0101 impeller 24 located inside the fan. The bottom of the impeller 24 is mounted with the bottom plate 12, and the rest of the support block 242 is connected to the bottom of the support base 242. The screw is fixed, and the blade and the wheel 24 are mounted on the fixing base 122 of the bottom plate 12 in the fixing hole 1 2 2 0 of the seat 12 2 . The frame 22 includes a panel 22 and a side wall 222 extending vertically downward along the outer edge of the panel 220. The shape of the panel 220 corresponds to the first portion of the bottom plate 12 of the heat sink 10. The first air inlet 120 of the panel 22 corresponding to the bottom plate 12 of the heat sink 10 is provided with a circular second air inlet 2200. The side wall 222 of the fan frame 22 corresponds to the fixing portion 123 of the bottom plate 12, and three positioning posts 224 are formed. Each of the positioning posts 224 is provided with an opening 2240, and the screw 2242 is screwed through the filling hole 1230 of the fixing portion 123 of the bottom plate 12. At the opening 2 2 4 0 of the positioning post 2 2 4, the fan frame 23⁄4 is fixed to the top surface ′ of the bottom plate i 2 of the heat sink 1 从而, so that the fan frame 22 and the first portion of the bottom plate 12· together form an accommodating impeller 24 Chamber (not labeled). [0014] The buckle 30 is formed by bending an elastic metal wire, and includes an intermediate portion 32 and two fastening arms 34 respectively connected to opposite ends of the t-port portion 32. The projection of the intermediate portion 32 on the circuit board 40 passes through the center of the electronic component 42. The intermediate portion 32 is received in the slot 1240 of the boss 124, and includes a defining portion 322 and two pressing portions 324 formed by horizontally extending outwardly from the ends of the defining portion 322. The portion 324 is in the same vertical plane as the defining portion 322. The defining portion 322 is correspondingly received in the slot 1240 of the middle portion of the boss 124. The pressing portion 324 is correspondingly received in the slot 1240 at both ends of the boss 124. The slot 1240 of the middle portion of the boss 124 is larger than the boss 124. The slots 1240 at both ends are shallow, which prevents the buckle 30 from rotating about the intermediate portion 32. Preferably, the two fastening arms 34 are bent obliquely upward from the two ends of the intermediate portion 32 to the sides of the plane of the intermediate portion 32, and then bent obliquely downward. The ends of the two buckle arms 34 respectively form a buckle 342 which is bent downward and bent outward by the buckle arm 34 end 098143280 form nickname A0101 page 7 / page 17 0982074198-0 201124061 Extending upwardly and downwardly, it is used for fastening with a buckle 46 fixed to the circuit board, and the heat sink 丨〇 is fixed on the circuit board 40. [0015] When mounting, the heat sink is placed on the circuit board 40, so that the first hot plate 14 of the heat sink 1 is attached to the electronic component 42 while the cambs a of the bottom plate 12 are correspondingly passed through the circuit board 40. The two through holes 44 hook the hooks 342 of the clips 30 to the buckles 46 on the circuit board 40. [0016] In the present invention, in the structure of the heat dissipating device about the asymmetry of the buckle 3 ' 'Because the U 仏 127 protrudes from the bottom of the heat sink, the two ribs 127 are passed through the circuit board 40 ′ and the The connection of the two tenons 127 and the clip 3 are crossed, so that the heat sink on the circuit board 40 is pre-positioned, and the end of the heat sink can be effectively prevented from rotating or the heat sink can rotate around the clip 3 . [0017] When the heat sink is in operation, the heat conducting plate 14 absorbs the heat generated by the electronic component 42 and transfers it to the heat pipe 18, and the heat is transferred to the fin group 16 by the manifold 8 . The fan 20 simultaneously draws outside air from the first air inlet 12 of the bottom plate 12 and the second air inlet 2200 of the fan into the cavity formed by the fan frame 22 and the bottom plate 12, and the airflow is blown under the action of the impeller 24. The chip group 16' on the bottom plate I? is blown out through the air passage of the Zhao film 16 2 . Since the first air inlet 120 is opened in the bottom plate 12, the air flow is sucked from the bottom of the bottom plate 12, so that the electronic component 42 under the bottom plate 12 is cooled during the flow of the air into the first air inlet 120. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, such as 098143280 Form No. A0101 Page 8 / Total 17 Page 0982074198-0 [0018] 201124061 Those who are familiar with the skill of the present invention, in the invention of the gods. The equivalent repair - 1 r or change the word, the leaves should be covered in the following - please refer to I. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is a perspective assembled view of a heat sink according to the present invention, which is assembled on a circuit board. 2 is an inverted view of the heat sink of FIG. 1. [0021] FIG. 3 is an exploded view of the heat sink of FIG. 1. [0022] FIG. 4 is an inverted view of FIG. 3.
【主要元件符號說明】 [0023] 散熱器10 [0024] 底板 12 [0025] 固定座122[Description of Main Component Symbols] [0023] Heat Sink 10 [0024] Base Plate 12 [0025] Mounting Seat 122
[0026] 凸柱 1 2 7 [0027] 臺階部 1272 ❹ [0028]桿部 1274 [0029] 導熱板14 [0030] 螺釘 142 [0031] 鰭片組1 6 [0032] 熱管 18 [0033] 風扇 20 [0034] 扇框 2 2 098143280 表單編號A0101 第9頁/共17頁 0982074198-0 201124061 α _]'.v 葉輪24 -J- 祕K 扣具30 η [0037] 扣臂34 [0038] 扣鉤3 4 2 [0039] 第一進風口 120 [0040] 固定孔1 2 2 0 [0041] 固定部123 [0042] 通孔1230 ο [0043] 凸臺124 [0044] 狹槽1240 [0045] 鎖固孔1244 [0046] 第一溝槽125 [0047] 槽126 Ο [0048] 固定柱1260 [0049] 溝槽128 [0050] 通孔1280 [0051] 固定板1242 [0052] 通孔1246 [0053] 螺釘1247 098143280 表單編號Α0101 第10頁/共17頁 0982074198-0 201124061Stud 1 2 7 [0027] Step 1272 ❹ [0028] Rod 1274 [0029] Heat Conductive Plate 14 [0030] Screw 142 [0031] Fin Set 1 6 [0032] Heat Pipe 18 [0033] Fan 20 [0034] Fan frame 2 2 098143280 Form number A0101 Page 9 / Total 17 page 0982074198-0 201124061 α _]'.v Impeller 24 -J- Secret K buckle 30 η [0037] Buckle arm 34 [0038] Buckle 3 4 2 [0039] First air inlet 120 [0040] fixing hole 1 2 2 0 [0041] fixing portion 123 [0042] through hole 1230 ο [0043] boss 124 [0044] slot 1240 [0045] locking Hole 1244 [0046] First Trench 125 [0047] Slot 126 Ο [0048] Mounting Post 1260 [0049] Trench 128 [0050] Through Hole 1280 [0051] Fixing Plate 1242 [0052] Through Hole 1246 [0053] Screw 1247 098143280 Form number Α0101 Page 10 of 17 0982074198-0 201124061
[0054] 通孔140 [0055] 鰭片162 [0056] 吸熱段182 [0057] 放熱段184 [0058] 面板2 2 0 [0059] 側壁222 [0060] 第二進風口 2200 [0061] 定位柱224 [0062] 孔口 2240 [0063] 支撐座242 [0064] 螺釘244 [0065] 中間部32 [0066] 限定部322 !:丫;:彻"y C:、Hice [0067] 抵壓部324 [0068] 電路板40 [0069] 電子元件42 [0070] 通孔44 [0071] 扣環46 098143280 表單編號A0101 第11頁/共17頁 0982074198-0[0054] Through Hole 140 [0055] Fin 162 [0056] Heat absorbing section 182 [0057] Heat release section 184 [0058] Panel 2 2 0 [0059] Sidewall 222 [0060] Second air inlet 2200 [0061] Positioning post 224 [0062] Aperture 2240 [0063] Support Seat 242 [0064] Screw 244 [0065] Intermediate portion 32 [0066] Defined portion 322 !: 丫;: 彻 " y C:, Hice [0067] Pressing portion 324 [ 0068] Circuit Board 40 [0069] Electronic Component 42 [0070] Through Hole 44 [0071] Buckle 46 098143280 Form No. A0101 Page 11 of 17 0982074198-0