201137583 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別係指一用於電子元件的 散熱裝置。 [先前技術] [0002] 由於當前電子元件的發熱量越來越大，如不能有效地對 其進行散熱，將容易導致電子元件過熱而造成工作不穩 定甚至於燒壞。因此，通常在電子元件上加裝散熱裝置 以對其散熱。 Ο [0003] 傳統的散熱裝置一般包括一基座及形成於基座上的複數 、 散熱鰭片。此外，為使基座更充分地進:行導熱，通常還 會在基座下方加裝一與電子元件面積相當的底板。通過 將底板與電子元件接觸，使電子元件的熱董更均勻地傳 導至基座上，再通過鰭片散發出去。 [0004] 然而，該種散熱裝置的底板通常係通過焊接固定至基座 上的。由於底板與^痤之間並無可相互定位的連接關係 Ο ，因此在焊接之胸須採用冶具將底板預ϋ定於基座上 ，‘致散熱裝置的製造過程較為繁瑣，不利於快速量產 〇 【發明内容】 [0005] 本發明旨在提供一能製造簡單的散熱裝置。 剛-種散熱裝置’用於對電子元件散熱，散熱裝置包括一 基座及用於與電子元件接觸的底板，該底板包括一導 熱板及複數自導熱板延伸的扣腳，該等扣腳穿人基座内 099113882 表單編號Α0101 第3頁/共16頁 0992024520-0 201137583 而將底板扣接於基座上。 [0007] 與習知技術相比，本發明的散熱裝置的底板本身即可通 過其扣腳與基座相扣接，從而在焊接二者時免去用冶具 進行預固定的過程，以減少製造工序。更進一步地，由 於底板自身就可固定於基座，因此甚至於焊接過程都可 省去，更有利於節約製造工序。 【實施方式】 [0008] 請參閱圖1-3，其示出了本發明的散熱裝置。該散熱裝置 包括一基座10、一收容在基座10内的風扇20、一蓋住基 座10的蓋板30、一固定於基座10上的鰭片組40、一固定 於基座10底部的底板50及二連接鰭片組40與底板50的熱 管6 0。 [0009] 請一併參閱圖4，該基座10包括一底座12及自底座12周緣 垂直向上延伸的側壁14。該底座12由一圓形部分及一矩 形部分連接而成。底座12在圓形部分的中部區域開設一 圓形的開孔100，並在開孔100中部設有一相對底座12下 凹的矩形板體16。該板體16週邊形成一環壁18，板體16 通過其四角連接至環壁18内侧，環壁18外側則通過四肋 片13連接至底座12。板體16的底面形成有二平行的凹槽 160，用於嵌入熱管60。環壁18的下部與板體16連接， 上部高出板體16並在周緣形成四抵壓部15。四抵壓部15 彼此隔開，每一抵壓部15的一端向内凸伸，另一端則連 接至相應的肋片13。每一肋片13連接環壁18的一端厚度 較大，連接底座12的相對另一端厚度較小。肋片13在其 上部開設一容置槽130，在其下部開設一與該容置槽130 099113882 表單編號A0101 第4頁/共16頁 0992024520-0 201137583 Ο [0010] 連通的“L”形定位槽132。該“L”形定位槽132靠近板 體1 6，其一由沿基座1 0徑向延伸的部分及一沿基座1 〇周 向延伸的部分組成。該容置槽130穿過二抵壓部15之間的 間隙與環壁丨8所圍設的空間連通。板體16、環壁18、肋 片1 3以及底座12之間的空隙形成多個氣流通道，以供風 扇20的氣流通過。底座12在其右側形成一上龜的臺階120 ’用於安裝鰭片組40。側壁14部分環繞底座12並在臺階 120的位置處形成一開口。側壁14用於引導風扇2〇的氣流 從開口處通過，以對安裝在臺階120上的鰭片組40進行散 熱°基座10還形成有四支撐件17，以供扣件70穿過而將 基座10固定於一電路板9〇上。 每一熱管60的冷凝段62穿入鰭片組40内，蒸發段64則嵌 入基座10的凹槽160内，其中二熱管6〇穿入鰭片組4〇的 冷凝段62位於不同的高度，嵌入基座10凹槽160内的蒸發 段64位於同一高度。 [0011] ο 請一併參閱圖5，該底板50包括一導熱板52及自導熱板52 周緣垂直向上延伸的铋扣腳54，其中每一扣腳54的末端 向内彎折而形成—鉤狀結構。該導熱板52呈圓形，其頂 面貼合於熱管60的蒸發段64而與基座10的板體16共同夾 置熱管60 ’底面用於與電路板90上的電子元件92接觸而 將熱量傳輸給熱管6〇。導熱板52的底面還塗有一層方形 的導熱朦56 ’用於黏接電子元件92。底板5〇的每一扣腳 54穿入基座10的“l”形定位槽132内以將底板50固定於 基座10上°由於扣腳54的寬度要大於“L”形定位槽132 的周向部分的寬度，因此在安裝底板50時，須首先將扣 099113882 表單編號Α0101 第5頁/共16頁 0992024520-0 201137583 腳54自“L”形定位槽132的徑向部分穿入基座1〇内而使 扣腳54處於如圖5所示的自由位置，然後再沿著“L，，形 定位槽132的周向部分滑動直至抵靠於定位槽132的末端 而將扣腳54定位於如圖2所示的鎖扣位置，才能完成底板 50與基座10間的固定。 [0012] [0013] 一支架80安裝於基座10上以為風扇2〇提供支撐。該支架 80包括一矩形支座82、自支座82四角出水平向外延伸的 四支臂84以及自支座82中部向上凸伸的一支臺86。該支 座82與基座1〇的板體16相.貼:合，.以將.支架&〇襄設於基座 10上。支座82的形狀與基座1〇的板體形狀一致以避 免遮擋住氣流通道而阻擋風扇2〇氣流的流通。四支臂Μ 分別穿過環壁18的抵壓部1 5之間的間隙而收容於容置槽 130内。每—抵壓部15的内凸的末端均抵壓住相應支臂84 ，以將支架80定位於基座10上。每一支臂84的底面中部 °下凸伸出凸點88，用於抵靠已處於鎖扣位置的扣腳 ^，以進一步固定扣腳54，防止$在定位槽132内滑動。 每-支臂84的自由末_穿設有絲72，支細通過 該等螺絲72鎖人基座1()的容置槽13()内，以㈣於基座 W上。支臺86呈圓臺狀，其綠將風扇2G切於基如 内。 蓋板30的形狀與側壁14的外周輪廓—致，其通過螺絲η 固疋於基座10頂部。蓋板30在對應於基座1〇開孔i㈧的 位置處開設—圓形的窗口32 ’用於供風扇20的氣流通過 〇 099113882 當將底板50安裝於基座1〇上時 表單編號細01 第6頁/共16頁 ，/、需將底板50的扣腳54 0992( [0014] 201137583 穿入基座10的定位槽132内，並旋轉至鎖固位置，即可完 成底板50與基座10間的固定。因此，由於底板50本身即 可與基座10固定，在後續焊接過程中無需再使用冶具對 底板50及基座10進行預固定，從而節省製造工序。更進 一步地，甚至於後續的焊接都可一併省去，直接在底板 50與基座10間填入導熱膠即可，從而大幅度地減少製造 工序，更利於產品的快速量產。 [0015] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0016] 圖1係本發明的散熱裝置的組裝圖，其中一電路板位於散 熱裝置下方。 [0017] 圖2係圖1的散熱裝置的倒置圖，其中散熱裝置的底板處 於鎖扣位置。 [0018] 圖3係圖1的散熱裝置的分解圖。 [0019] 圖4係圖3的散熱裝置的倒置圖。 [0020] 圖5與圖2相似，其中散熱裝置的底板處於自由位置。 【主要元件符號說明】 [0021] 基座：10 [0022] 開孔：100 [0023] 底座：12 099113882 表單編號A0101 第7頁/共16頁 0992024520-0 201137583 [0024]臺階：120 [0025] 肋片：13 [0026] 容置槽：130 [0027] 定位槽：132 [0028] 侧壁：14 [0029] 抵壓部：15 [0030] 板體：16 [0031] 凹槽：160 [0032] 支撐件：17 [0033] 環壁：18 [0034] 風扇：2 0 [0035] 蓋板：30 [0036] 窗口 ： 32 [0037] 鰭片組：40 [0038] 底板：50 [0039] 導熱板：52 [0040] 扣腳：54 [0041] 導熱膠：56 [0042] 熱管：60 099113882 表單編號A0101 第8頁/共16頁 0992024520-0 201137583 [0043] 冷凝段 ：62 [0044] 蒸發段 ：64 [0045] 扣件： 70 [0046] 螺絲： 72 [0047] 支架： 80 [0048] 支座： 82 [0049] 支臂： 84 [0050] 支臺： 86 [0051] 凸點： 88 [0052] 電路板 ：90 [0053] 電子元件：92 099113882 表單編號A0101 第9頁/共16頁 0992024520-0201137583 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic component. [Prior Art] [0002] Since the heat generation amount of the current electronic component is becoming larger and larger, if it cannot be efficiently dissipated, it will easily cause the electronic component to overheat and cause work instability or even burnout. Therefore, a heat sink is usually added to the electronic component to dissipate heat therefrom. [0003] Conventional heat sinks generally include a base and a plurality of heat sink fins formed on the base. In addition, in order to make the pedestal more fully conductive, it is usually also provided with a bottom plate corresponding to the area of the electronic component under the pedestal. By bringing the backplane into contact with the electronic components, the thermal elements of the electronic components are more evenly transferred to the pedestal and then dissipated through the fins. [0004] However, the bottom plate of such a heat sink is usually fixed to the base by soldering. Since there is no mutual connection relationship between the bottom plate and the bottom plate, the welding plate must be pre-set on the base by using a metallurgical tool. The manufacturing process of the heat sink device is cumbersome, which is not conducive to rapid mass production. SUMMARY OF THE INVENTION [0005] The present invention is directed to providing a heat sink that can be manufactured in a simple manner. The heat sink device is configured to dissipate heat from the electronic component, and the heat sink comprises a base and a bottom plate for contacting the electronic component, the bottom plate comprising a heat conducting plate and a plurality of fastening legs extending from the heat conducting plate, the buckles are worn In the base of the base 099113882 Form No. Α 0101 Page 3 / Total 16 Page 0992024520-0 201137583 The base plate is fastened to the base. Compared with the prior art, the bottom plate of the heat dissipating device of the present invention can be fastened to the base through the fastening leg thereof, so that the process of pre-fixing with the tool is eliminated during the welding to reduce the manufacturing. Process. Further, since the bottom plate itself can be fixed to the base, even the welding process can be omitted, which is more conducive to saving the manufacturing process. [Embodiment] [0008] Referring to Figures 1-3, there is shown a heat sink of the present invention. The heat sink includes a base 10, a fan 20 housed in the base 10, a cover 30 covering the base 10, a fin set 40 fixed to the base 10, and a fixed base 10 The bottom plate 50 and the two heat pipes 60 connecting the fin group 40 and the bottom plate 50. Referring to FIG. 4 together, the base 10 includes a base 12 and side walls 14 extending vertically upward from the periphery of the base 12. The base 12 is formed by a circular portion and a rectangular portion. The base 12 defines a circular opening 100 in the central portion of the circular portion, and a rectangular plate 16 recessed relative to the base 12 in the middle of the opening 100. A peripheral wall 18 is formed around the periphery of the plate body 16. The plate body 16 is connected to the inner side of the ring wall 18 by its four corners, and the outer side of the ring wall 18 is connected to the base 12 by four ribs 13. The bottom surface of the plate body 16 is formed with two parallel grooves 160 for embedding the heat pipe 60. The lower portion of the ring wall 18 is connected to the plate body 16, and the upper portion is raised above the plate body 16 and forms a four pressing portion 15 at the periphery. The four pressing portions 15 are spaced apart from each other, and one end of each pressing portion 15 is inwardly projected, and the other end is connected to the corresponding rib 13. One end of each of the ribs 13 connecting the ring walls 18 is thicker, and the opposite end of the connecting base 12 is smaller in thickness. The rib 13 defines a receiving groove 130 in the upper portion thereof, and an "L"-shaped positioning is formed in the lower portion thereof to communicate with the receiving groove 130 099113882 Form No. A0101 Page 4 / 16 Page 0992024520-0 201137583 Ο [0010] Slot 132. The "L" shaped positioning groove 132 is adjacent to the plate body 16, and is composed of a portion extending radially along the base 10 and a portion extending circumferentially along the base 1 . The accommodating groove 130 communicates with a space surrounded by the ring rim 8 through a gap between the two pressing portions 15. The gap between the plate body 16, the ring wall 18, the ribs 13 and the base 12 forms a plurality of air flow passages for the airflow of the fan 20 to pass. The base 12 forms a step 120' of the upper turtle on its right side for mounting the fin set 40. The side wall 14 partially surrounds the base 12 and forms an opening at the location of the step 120. The side wall 14 is for guiding the airflow of the fan 2〇 to pass through the opening to dissipate heat to the fin set 40 mounted on the step 120. The base 10 is further formed with four support members 17 for the fastener 70 to pass through. The base 10 is fixed to a circuit board 9A. The condensation section 62 of each heat pipe 60 penetrates into the fin set 40, and the evaporation section 64 is embedded in the groove 160 of the base 10, wherein the condensation section 62 of the two heat pipes 6〇 penetrates the fin group 4〇 is at a different height. The evaporation sections 64 embedded in the grooves 160 of the base 10 are at the same height. [0011] Please refer to FIG. 5 together, the bottom plate 50 includes a heat conducting plate 52 and a buckle leg 54 extending vertically upward from the periphery of the heat conducting plate 52, wherein the end of each pin 54 is bent inwardly to form a hook Structure. The heat conducting plate 52 has a circular shape, and its top surface is attached to the evaporation section 64 of the heat pipe 60 to sandwich the heat pipe 60' with the plate body 16 of the base 10 for contacting the electronic component 92 on the circuit board 90. Heat is transferred to the heat pipe 6〇. The bottom surface of the heat conducting plate 52 is also coated with a square heat conducting crucible 56' for bonding the electronic components 92. Each of the fastening pins 54 of the bottom plate 5 穿 penetrates into the "l" shaped positioning groove 132 of the base 10 to fix the bottom plate 50 to the base 10. Since the width of the fastening leg 54 is larger than that of the "L" shaped positioning groove 132 The width of the circumferential portion, therefore, when mounting the bottom plate 50, the first part of the "L" shaped positioning groove 132 should be inserted into the base by first pressing the 099113882 form number Α0101, page 5/16 pages 0992024520-0, 201137583. 1 而 so that the buckle 54 is in the free position as shown in FIG. 5, and then slid along the circumferential portion of the L-shaped positioning groove 132 until the end of the positioning groove 132 is pressed to position the buckle 54 The fixing between the bottom plate 50 and the base 10 can be completed at the locking position shown in Fig. 2. [0013] A bracket 80 is mounted on the base 10 to provide support for the fan 2A. The bracket 80 includes a The rectangular support 82 and the four arms 84 extending horizontally outward from the four corners of the support base 82 and a table 86 projecting upward from the middle of the support 82. The support 82 is opposite to the plate body 16 of the base 1〇. Stick: fit, to set the bracket & 〇襄 on the base 10. The shape of the bracket 82 is consistent with the shape of the base of the base 1 以避免 to avoid obscuration The air flow passage is blocked to block the flow of the airflow of the fan 2. The four arms 收容 are respectively received in the accommodating groove 130 through the gap between the pressing portions 15 of the ring wall 18. Each of the inner convex portions of the pressing portion 15 The ends of each arm are pressed against the corresponding arms 84 to position the bracket 80 on the base 10. The bottom surface of each arm 84 is convexly protruded from the bottom portion of the bottom portion 84 for abutting against the buckle already in the latching position. The foot ^ is further fixed to the buckle 54 to prevent the slid in the positioning groove 132. The free end of each arm 84 is provided with a wire 72, and the volume of the pedestal 1 () is locked by the screws 72. The groove 13 () is placed in the groove (4) on the base W. The support 86 has a truncated cone shape, and the green cuts the fan 2G into the base. The shape of the cover plate 30 and the outer peripheral contour of the side wall 14 pass through The screw η is fixed to the top of the base 10. The cover 30 is opened at a position corresponding to the opening 1 (eight) of the base 1 - a circular window 32 ' is used for the airflow of the fan 20 to pass through the 〇 099113882 when the bottom plate 50 is mounted When the base 1 is attached, the form number is fine 01 page 6 / total 16 pages, /, the base plate 50 of the buckle 54 0992 ([0014] 201137583 is inserted into the positioning groove 132 of the base 10, and Turning to the locking position, the fixing between the bottom plate 50 and the base 10 can be completed. Therefore, since the bottom plate 50 itself can be fixed to the base 10, it is no longer necessary to use the tooling tool to perform the bottom plate 50 and the base 10 in the subsequent welding process. Pre-fixing, thereby saving the manufacturing process. Further, even the subsequent soldering can be omitted, and the thermal conductive glue can be directly filled between the bottom plate 50 and the base 10, thereby greatly reducing the manufacturing process and facilitating the manufacturing process. Rapid mass production of the product. [0015] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0016] FIG. 1 is an assembled view of a heat sink of the present invention, wherein a circuit board is located below the heat sink. 2 is an inverted view of the heat sink of FIG. 1 with the bottom plate of the heat sink in a latched position. [0017] FIG. 3 is an exploded view of the heat sink of FIG. 1. 4 is an inverted view of the heat sink of FIG. 3. [0020] FIG. 5 is similar to FIG. 2 in that the bottom plate of the heat sink is in a free position. [Main component symbol description] [0021] Base: 10 [0022] Opening: 100 [0023] Base: 12 099113882 Form No. A0101 Page 7 / Total 16 Page 0992024520-0 201137583 [0024] Step: 120 [0025] Rib: 13 [0026] accommodating groove: 130 [0027] Locating groove: 132 [0028] Side wall: 14 [0029] Pressing portion: 15 [0030] Plate body: 16 [0031] Groove: 160 [0032 Support: 17 [0033] Ring wall: 18 [0034] Fan: 2 0 [0035] Cover: 30 [0036] Window: 32 [0037] Fin set: 40 [0038] Base plate: 50 [0039] Heat conduction Plate: 52 [0040] Buckle: 54 [0041] Thermal paste: 56 [0042] Heat pipe: 60 099113882 Form number A0101 Page 8 / Total 16 page 0992024520-0 201137583 [0043] Condensation section: 62 [0044] Evaporation section :64 [0045] Fastener: 70 [0046] Screw: 72 [0047] Bracket: 80 [0048] Support: 82 [0049] Arm: 84 [0050] Support: 86 [0051] Bump: 88 [ 0052] Board: 90 [0053] Electronic Components: 92 099113882 Form Number A0101 Page 9 / Total 16 Page 0992024520-0