TWI326569B - Manufacturing processes for flexible and rigid compound printed circuit board - Google Patents

Description

1326569 15864twf.doc/g IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a circuit board, and particularly to a method of manufacturing a soft and hard composite circuit board. [Prior Art] 'With the advancement of technology and the continuous improvement of the quality of life, coupled with the integration and continuous growth of the 3C industry, the integrated circuit (Integmted # has become more and more widely used, for example, Notebook PC) , in the mobile phone (Cell Phone), digital camera (digital camera), personal digital assistant (PDA), printer (printer) and disk player (disk player) and other electronic devices, which are applied to The carrier in the body circuit is not only used for electrical connection, but also for carrying wafers or other electronic components, etc. Such carriers can be divided into soft-type circuit boards, flexible circuit boards, and soft and hard according to their different characteristics. Composite circuit boards, etc. In the conventional soft and hard composite circuit board process, it usually includes the following steps: First, the two adhesive layers are respectively disposed on a surface of the two rigid circuit boards; then The flexible circuit board is disposed between the surfaces of the two rigid circuit boards that are provided with the adhesive layer; after that, a thermal compression process is performed to thermally melt the adhesive layer, so that the two rigid circuit boards and The flexible circuit boards are bonded to each other; then, the rigid circuit board and the flexible circuit board are bonded into a plurality of soft and hard composite circuit boards by a routing process to complete the fabrication of the soft and hard composite circuit board. Compared with the rigid circuit board, due to the poor control accuracy of the flexible circuit board, the flexible circuit board rarely has a large size of 5 1326569 15864tvvf.doc / g design, so that the manufacturing method of the soft and hard composite circuit board will Limited by the size control of the flexible circuit board' Therefore, it is difficult to see the large-size production method of the soft and hard composite circuit board. In addition, when the flexible circuit board is completed, if there is part

^When the road is in a bad condition, the soft circuit board must be scrapped and discarded. (4) In the manufacturing method of the soft Weihe circuit board, because the flexible circuit board county and the hard circuit are silky, therefore, The action of scrapping and discarding must be performed after the bonded rigid circuit board and the flexible circuit board are divided into a plurality of soft and hard composite circuit boards. In other words, when it is necessary to scrap and discard a bad flexible circuit board, it is necessary to discard the rigid circuit board bonded to the soft circuit board, and waste the hard circuit (4) material of the part, thereby improving the whole soft and hard. The manufacturing cost of the composite circuit board. [Summary of the Invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a soft and hard composite circuit board to reduce the manufacturing cost required for fabricating a soft and hard composite circuit board. The present invention is directed to a method of manufacturing a soft and hard composite circuit board comprising the following steps. First, at least one flexible circuit board is provided. Next, the flexible circuit board is separated into a plurality of sub-flexible circuit boards. After that, a good sub-flexible circuit board is secreted from these sub-flexible boards. The flexible sub-circuit board is disposed on at least one rigid circuit board to form a soft and hard composite circuit board. A method of manufacturing a soft and hard composite circuit board according to a preferred embodiment of the present invention, wherein a good sub-flexible circuit board is disposed on a rigid circuit board 1326569

The v-step on 15864 twf.doc/g further includes dividing the soft and hard composite circuit board into a plurality of sub-soft and hard composite boards by a routing process or a punching process. The method for manufacturing a soft and hard composite circuit board according to the preferred embodiment of the present invention includes the step of separating the flexible circuit board by softening by a routing process or a punch process. Multiple sub-soft boards. Proud knife. A manufacturing method of a soft and hard composite circuit board according to a preferred embodiment of the present invention, wherein a good sub-flexible circuit board is disposed on a rigid circuit board ^

The steps further include using a _, , A ^ , and a good sub-flexible circuit board on the rigid circuit board. ^In accordance with the preferred embodiment of the present invention, the manufacturing method of the hard composite circuit board is described. ^In the good sub-flexible circuit board, the well board = board formed on the rigid circuit board = forming an adhesive layer on the good sub-flexible circuit board with '^ According to the manufacturing method of the soft and hard composite circuit board according to the preferred embodiment of the present invention, after the step of disposing the good sub-flexible circuit board on the rigid circuit board, the method further includes performing a “thermal relocation process” to thermally melt the adhesive layer. ς = The circuit board and the good sub-flexible circuit board can be drawn by the adhesive layer. In the method for manufacturing the soft and hard composite circuit board of the present invention, the flexible circuit board is separated into a plurality of sub-soft circuit boards before the soft rigid circuit board, and the defective sub-flexible circuit board is replaced, so that 1326569 ί 5864twf.d 〇c/g The sub-flexible circuit board on the rigid circuit board is a good knowledge of the technology that wastes a good hard power "manufacturing cost of the white soft and hard composite circuit board. In addition, since the present invention is to first reconfigure the flexible circuit board on the rigid circuit board, the size of the second circuit board is smaller than that of the original flexible circuit board. The hard composite circuit board can be made in a large size), and the manufacturing cost of the soft and hard composite circuit board per unit area is paid. Further, the reduction is easy to understand as ==; the two purposes, features and advantages can be more clearly as follows. The example of the present invention is described in detail with reference to the accompanying drawings. [Embodiment] FIGS. 1A to 1C illustrate a preferred embodiment of the present invention.

St manufacturing method. The "soft and hard composite circuit board of the present invention" includes the following several steps. Please refer to the figure u, first of all, 'to mention the two-dimensional circuit board 1. Then, please refer to the figure 丨二二播1者疋(routlng) The process of performing the separation step of the process. In the sm of the sub-board 3 of the circuit board 110, the bad sub-soft circuit board shape is too squid = bad", for example, the line breaks the electric break, the father == _ a good child Flexible circuit board (10). Then, "14 good sub-flexible circuit board 11G ge* is placed on at least the rigid circuit board 120 to complete the fabrication of the soft and hard composite circuit board. 1326569 15864twf.doc / g In the preferred embodiment, which will be good The step of disposing the flexible circuit board on the rigid circuit board 120 is, for example, accurately positioning the good sub-flexible circuit board 110 on the rigid second board 120 by means of a jig (not shown). A side view of a soft and hard composite circuit in accordance with a preferred embodiment of the present invention. Referring to FIG. 2, in a preferred embodiment, wherein the good sub-flexible circuit board 110 is disposed on the rigid circuit board 12 Further, an adhesive layer 130 is formed between the good sub-flexible circuit board 110 and the rigid circuit board 12G, wherein the material of the adhesive layer 13G is, for example, epoxy resin, etc. < In the preferred embodiment, the good one is After the step of disposing the flexible circuit board 11 on the rigid circuit board 12G, the method further includes performing a thermal pressing process to thermally melt the adhesive layer 13 〇, so that the hard circuit board 12 is good. Figure 3 is a side view of a soft and hard circuit board according to a preferred embodiment of the present invention. Referring to Figure 3, in a preferred embodiment, After the good flexible circuit board 11G is disposed on the rigid circuit board 12, it further includes separating the soft and hard composite circuit board 2 by, for example, a forming process or a punching process. The plurality of sub-soft and hard composite circuit boards 210 ′′, wherein the rigid circuit board 12 〇 is also separated into a plurality of sub-hard circuit boards 12 〇 a. The age of each sub-soft and hard composite circuit board 21 〇 is a sub-flexible circuit board 110 4 is a side view of a soft and hard composite electric 1326569 • 5864 twf.doc/g board according to another preferred embodiment of the present invention. Please refer to FIG. 1B at the same time. 4, in a preferred embodiment, after separating the flexible circuit board 1 into a plurality of sub-flexible circuit boards, after sub-screening a good sub-flexible circuit board uo, for example, by using a jig (not shown), and these good sub-flexible boards U0 are configured Between the rigid circuit boards 120 to complete the fabrication of the soft and hard composite circuit board. The preferred embodiment of the present invention further includes forming an adhesive layer (not shown) on the good sub-flexible circuit board 11 respectively. Between the crucible and the two hard-acting circuit boards m, a thermal pressing process may be further included to thermally melt the adhesive layer, so that the rigid circuit board 120 and the good sub-flexible circuit board 11 are joined to each other. A side view of a soft and hard composite electric circuit board according to another preferred embodiment of the present invention. Referring to FIG. 5, in a preferred embodiment, a good sub-power circuit board 110 is disposed on a rigid circuit board. After uo, the process includes: separating the soft and hard composite circuit board 2〇1 into a plurality of sub-soft and hard composite circuits by, for example, a routing process or a punch process. The rigid circuit board 120 is also separated into a plurality of pieces; the hard board I is provided with the circuit board 120a. In other words, each of the soft and hard composite circuit boards 212 is a structure in which a sub-flexible circuit board 11 is sandwiched between the two sub-hard boards i2〇a. Anyone skilled in the art will recognize that the method of separating a flexible circuit board 1 into a plurality of sub-flexible circuit boards 110 can include a variety of different singulation processes, and is not limited to a stamping process or molding ((7) says 匕In addition, the method of separating the soft and hard composite circuit boards 200 and 201 into a plurality of sub-soft and hard composite circuit boards 210 and 212 may also include various types of 1326569 15864 twf.d〇c/〇刀, and is not limited thereto. The m-table of the molding process or the soft and hard composite circuit board is configured on the rigid circuit board or two rigid electric boards: - or a plurality of flexible circuit boards are arranged on the plurality of hard boards i or Between multiple rigid boards. In other words, any number of soft thundery uncles can be created in the private sector to achieve the th^_ illusion of the board and the rigid board and its stacking method may produce ' All of them are within the scope of the present invention. The idea is that due to the soft and hard composite circuit board 200 of the present invention

It:: First, the flexible circuit board 1〇0 is separated into a plurality of sub-soft circuits 3 in these sub-flexible circuit boards 11G, and the good flexible circuit board 11G is turned out, and the bad sub-flexible circuit board n〇 is replaced. The good sub-flexible circuit board 110 is disposed between the rigid circuit board 12 and the rigid circuit board 120, so that the sub-flexible circuit board UG disposed between the rigid circuit board 12〇 or the two rigid circuit boards 12〇 can be ensured. Both are good and do not waste the material of the rigid circuit board 12G, thereby reducing the manufacturing cost of the soft and hard 5 circuit boards 200, 201. In addition, the present invention can effectively control the dimensional accuracy of these sub-flexible circuit boards 110 (since the size of the separated sub-flexible circuit boards 11 is smaller than the size of the original flexible circuit board 100), so that the soft and hard composite circuits are reversed. 200, 201 can be mass-produced in a large-sized manner, thereby reducing the manufacturing cost of the soft and hard composite circuit boards 2, 201 per unit area. In summary, the manufacturing method of the soft and hard composite circuit board of the present invention has the following advantages: ~ () The manufacturing method of the soft and hard composite circuit board of the present invention can ensure 1326569 J5864twf.doc/g 'to reduce the hard configuration Sub-soft boards on rigid boards are a waste of material for good boards. (2) The manufacturing method of the soft and hard composite circuit board of the present invention can effectively control the dimensional accuracy of the sub-soft circuit board, so that the soft and hard composite circuit board can be mass-produced in a large size manner, and the flexible circuit board can be improved. Typesetting utilization to reduce the manufacturing cost of soft and hard composite boards per unit area.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1C illustrate a method of manufacturing a soft and hard eight circuit board according to a preferred embodiment of the present invention. Figure 2 is a side elevational view of a soft and hard composite circuit which is not a preferred embodiment of the present invention. Figure 3 is a side elevational view of a soft and hard composite circuit board, not divided into a preferred embodiment of the present invention. 4 is a side view of a soft and hard composite circuit board according to another preferred embodiment of the present invention. Fig. 5 is a side elevational view showing a soft and hard composite circuit board ′ according to another preferred embodiment of the present invention. [Main component symbol description] 100: Flexible circuit board 110: Sub-flexible circuit board 1326569 15864t\vf.doc/g 120: Hard circuit board 120a: Sub-hard circuit board 130: Adhesive layer 200, 201: Soft and hard composite circuit board 210 , 212: sub-soft and hard composite circuit board

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Claims (1)

1326569 99-3-25 Application for Patent Park: X. Provide manufacturing methods for H-hard circuit board, including: mention i, eve-soft circuit board. These = = : sub-soft circuit board, so that from There is no connection between the ^ and the flexible circuit board; the board; and - the A circuit board towel selects the sub-soft circuit which will be good on the sub-soft circuit board, and forms a soft and hard composite circuit board. The manufacturing of the hard and soft composite circuit board of the hard circuit comprises: separating the soft and hard composite circuit board into a soft and hard composite circuit board according to the second item of the second profit range, the soft and hard composite circuit The board is divided into the t (irGutmg) process and the soft and hard composite circuit is a soft and hard composite circuit board. . Such as the sub-, (such as the application of the soft U-soft manufacturing method described in the second paragraph of the second paragraph), the steps of the separation of the hard composite circuit board is more funeral, pressure (pu_ process and the soft and hard composite Circuit board $ soft and hard composite circuit board. 『 战 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The flexible circuit board is divided into the "Electronic = Board 14 1326569 99-3-25, 6. The method for manufacturing the soft and hard composite t-board according to Item 1 of the full-time application, the towel is softened. Circuit board separation of the turn package # by fpuiich) process and the (four) circuit board division (four) some of the circuit to specifically touch the soft and hard composite circuit board described in item i: board: some of the sub-flexible circuit board Arranged in the pair of rigid electrical circuit boards: the same as the soft and hard composite circuit board described in the first item of the range of the first method, the f ^ method H shape of the soft and hard composite circuit board Before the step, the sentence is more than the penis to go to the ruler "birth board circuit board with the hard 4: =: sticky layer in the good of the soft ^ Please refer to the soft and hard complex described in item 8 of the patent; party: 'After the good sub-flexible circuit board is arranged at 4:=fi: after the step, it also includes the -hot press-bonding process to hot melt = t Making the rigid circuit board and the good sub-soft circuits