CN211267288U

CN211267288U - Cover membrane pressfitting structure

Info

Publication number: CN211267288U
Application number: CN201922436686.XU
Authority: CN
Inventors: 姚阿平
Original assignee: Suzhou Lezheng Electronic Technology Co ltd
Current assignee: Suzhou Lezheng Electronic Technology Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-08-14
Anticipated expiration: 2029-12-30

Abstract

The utility model relates to a cover film pressing structure, which comprises an upper baking iron plate, a lower baking iron plate, an upper uniform heat buffer plate, a lower uniform heat buffer plate and a material to be pressed, wherein the material to be pressed is arranged between the upper uniform heat buffer plate and the lower uniform heat buffer plate, and the upper baking iron plate and the lower baking iron plate are respectively in corresponding contact with the upper uniform heat buffer plate and the lower uniform heat buffer plate; the material to be pressed comprises an upper release film layer, a lower release film layer and one layer of semi-finished product, and is characterized by also comprising at least one heat-conducting hard liner plate; the number of the materials to be pressed is at least two, and the heat-conducting hard liner plate is arranged between the materials to be pressed. Preferably, the heat-conducting hard liner plate is a flat aluminum plate with the thickness of 0.8 mm. Overall structure is succinct, need not change current quick pressfitting machine and just can effectively improve production efficiency, and is easy and simple to handle, does benefit to the popularization.

Description

Cover membrane pressfitting structure

Technical Field

The utility model relates to a flexible line way board preparation field, especially flexible line way board cover structure in the membrane pressfitting technology soon.

Background

The flexible circuit board, also called FPC board, is a printed circuit made of flexible insulating base material, has many advantages that hard printed circuit boards do not have, can be freely bent, wound and folded, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in three-dimensional space, thereby achieving the integration of component assembly and wire connection. The FPC flexible board can greatly reduce the volume of electronic products, and is suitable for the development of the electronic products in the directions of high density, miniaturization and high reliability. Therefore, the FPC flexible board is widely applied to the fields or products of aerospace, military, mobile communication, laptop, computer peripheral, PDA, digital camera and the like.

In the production and processing process of the flexible circuit board, a process of pressing the flexible circuit board is provided, in the existing process of pressing the flexible circuit board, a flexible circuit board is wrapped by a release film in an artificial mode, then the wrapped flexible circuit board is placed in a pressing window of a pressing machine, then the pressing machine is started to carry out pressing work, after the machine pressing work is completed, a product which is pressed completely is manually taken out from the pressing window, then the release film is peeled off, and the flexible circuit board which is pressed completely is obtained.

In the prior art, a layer of protective film is attached to a flexible circuit board after circuit etching is finished to prevent oxidation, meanwhile, a bonding pad required to be used is exposed outside to facilitate welding or plug-in connection of the rear end, and the like, the industry adopts a polyimide PI film and hot-pressing adhesive combined material, namely the flexible circuit board protective film material in the industry, and when the protective film and an etched copper foil substrate are aligned and attached, a rapid press is used for keeping pure adhesive (generally epoxy hot-pressing adhesive) on the protective film for about 2-3 minutes under the conditions of high temperature (generally about 180 ℃) and certain pressure (generally about 100 kilograms of force) so that the pure adhesive and the copper foil wiring of the flexible circuit board are fully combined. At present, the production process is completed by a rapid laminating machine. The existing rapid laminating machine is operated in a single station, a single-sheet operation mode is adopted, namely, only one flexible circuit board can be rapidly laminated at a time, and uninterrupted production can approximately produce only about 20 flexible circuit boards per hour. If a large number of quick laminating machines need to be purchased for a large number of production tasks, the production efficiency is greatly limited, and laminating a plurality of flexible circuit boards at one time is a general appeal of enterprises. Although the flexible circuit board with one more board can be pressed at one time, enterprises must purchase or improve the conventional quick pressing machine, the cost is high, the efficiency is slow, the machine cannot be generally applied to various types of production enterprises with various scales, brand new operation instruction books need to be compiled, personnel are trained, the operation is not simple, and the application is not flexible enough. However, if a conventional rapid press is directly adopted and the press is simultaneously overlapped, circuit transfer printing is generated on the surface of the product, and the quality is unqualified.

Therefore, it is necessary and practical to design a pressing structure which can press more than one flexible circuit board at a time without changing the existing rapid pressing machine and completely changing the operation flow of the existing process, and is beneficial to the wide popularization and application in the actual production of enterprises.

SUMMERY OF THE UTILITY MODEL

The utility model designs a cover film pressing structure, which comprises an upper baking iron plate, a lower baking iron plate, an upper even heat buffer plate, a lower even heat buffer plate and a material to be pressed, wherein the material to be pressed is arranged between the upper even heat buffer plate and the lower even heat buffer plate, and the upper baking iron plate and the lower baking iron plate are respectively in corresponding contact with the upper even heat buffer plate and the lower even heat buffer plate; the material to be pressed comprises an upper release film layer, a lower release film layer and one layer of semi-finished product, and is characterized by also comprising at least one heat-conducting hard liner plate; the number of the materials to be pressed is at least two, and the heat-conducting hard liner plate is arranged between the materials to be pressed.

In a specific embodiment, the cover film laminating structure comprises two materials to be laminated and a heat-conducting hard liner plate; the upper surface of the heat-conducting hard liner plate is sequentially stacked with a material to be pressed and an upper uniform heat buffer plate; the lower surface of the heat-conducting hard lining plate is connected with a second piece of material to be pressed on the lower uniform heat buffer plate.

In a particularly effective embodiment, the heat-conducting hard liner plate has a planar size shape which is consistent with the upper and lower sintered iron plates.

Preferably, the vertical thickness between the upper surface and the lower surface of the heat-conducting hard liner plate is not less than 0.8 mm.

In a preferred embodiment, the heat-conducting hard liner plate is an aluminum plate with parallel upper and lower surfaces.

To sum up, compared with the prior art, the utility model discloses a cover membrane pressfitting structure and do not change the current conventional quick pressfitting machine inner structure of enterprise or configuration, can realize the improvement of pressfitting efficiency, and the structure is succinct, and the application is nimble, practices thrift cost and convenient operation and does not influence the quality, and safe and reliable has improved labor efficiency, and it is wide to be suitable for the scene.

Drawings

Embodiments of the invention are explained in detail below with the aid of schematic drawings. Wherein:

FIG. 1 is a schematic view of a prior art lamination arrangement;

FIG. 2 is a schematic view of a pressing structure in the first embodiment;

fig. 3 is a schematic view of the operation process of the pressing structure of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be further described below with reference to the accompanying drawings.

The structure of the prior art when the covering film is pressed by rapid pressing is shown in fig. 1, the material to be pressed is formed by respectively arranging a layer of release film including an upper release film 31 and a lower release film 32 on the upper and lower sides of a flexible circuit board semi-finished product 30. The lower release film 32 is in contact with the upper surface of the lower uniform heat buffer plate 22; the lower surface of the lower uniform heat buffer plate 22 is contacted with the upper surface of the lower baked iron plate 12, and the lower baked iron plate 12 is arranged on the lower hot plate 02 of the rapid press. An upper uniform heat buffer plate 21 is stacked on the upper release film 31; the upper surface of the upper uniform heat buffer plate 21 is jointed with the lower surface of the upper baked iron plate 11. The upper hot plate 01 is pressed on the upper baked iron plate 11. A quick pressing machine can only produce one flexible circuit board in the quick pressing machine at a time under the covering film pressing structure. To improve the production efficiency, the original rapid laminating machine cannot be used after a plurality of sheets are laminated at one time.

In a first embodiment of the present invention, please refer to fig. 1, which is different from the prior art that a heat-conducting hard lining board 40 is added in the pressing structure of the cover film. In the embodiment, the upper thermal buffer plate 21 and the lower thermal buffer plate 22 are made of silicon aluminum foil. The upper release film 31 and the lower release film 32 of the release film are made of high-crystalline transparent plastic TPX. The flexible circuit board semi-finished product 30 is wrapped in the middle by a release film TPX to form a material to be pressed. In this embodiment, the heat-conducting hard liner plate 40 is made of an aluminum plate with parallel upper and lower surfaces and a vertical thickness of 0.8 mm. The heat-conducting hard liner plate 40 is placed between the two materials to be pressed, and the sizes and the shapes of the heat-conducting hard liner plate 40, the upper baked iron plate 11 and the lower baked iron plate 12 are consistent in the embodiment. Because the surface hardness of the heat-conducting hard liner plate 40 aluminum plate is very good, and the heat-conducting hard liner plate has a good quick heat transfer effect, the poor indentation caused by mutual extrusion of the upper and lower flexible circuit board semi-finished product 30 circuit forming areas can be effectively avoided, and meanwhile, the whole production efficiency can be improved by one time.

Adopt the utility model discloses a cover membrane pressfitting structure and carry out the operation process of quick pressfitting as illustrated in figure 3. Firstly, pseudo-sticking a flexible circuit board semi-finished product 30 and an upper release film 31 and a lower release film 32 of a TPX material to form a material to be pressed; a lower baked iron plate 12 is arranged on the lower hot plate 02; then, a silicon aluminum foil with a lower uniform heat buffer plate 22 is arranged on the lower baking iron plate 12; then putting a first material to be pressed, and placing a heat-conducting hard lining plate 40 aluminum plate on the first material to be pressed; stacking a second material to be pressed on the heat-conducting hard lining plate 40 aluminum plate; arranging a silicon aluminum foil of a uniform heat buffer plate 21 on the second material to be pressed, and then covering the silicon aluminum foil with a baking iron plate 11; and starting the rapid pressing machine, pressing the upper hot plate 01 on the upper baked iron plate 11, and pressing the upper hot plate 01 and the lower hot plate 02 to complete the laminating work of the covering films of the two flexible circuit board semi-finished products 30 at one time, namely the production efficiency of the same rapid pressing machine is doubled.

From this the above-mentioned embodiment can know a cover membrane pressfitting structure can realize the utility model discloses the technological effect that expects to reach.

The utility model discloses not be limited to the specific details among the above-mentioned embodiment the utility model discloses a within the technical idea scope, can be right the technical scheme of the utility model carry out multiple simple variant, these simple variants all belong to the utility model discloses a protection scope. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the present invention does not separately describe various possible combinations.

Claims

1. A covering film pressing structure comprises an upper baking iron plate, a lower baking iron plate, an upper uniform heat buffer plate, a lower uniform heat buffer plate and a material to be pressed, wherein the material to be pressed is arranged between the upper uniform heat buffer plate and the lower uniform heat buffer plate, and the upper baking iron plate and the lower baking iron plate are respectively in corresponding contact with the upper uniform heat buffer plate and the lower uniform heat buffer plate; the material to be pressed comprises an upper release film layer, a lower release film layer and one layer of semi-finished product, and is characterized by also comprising at least one heat-conducting hard liner plate; the number of the materials to be pressed is at least two, and the heat-conducting hard liner plate is arranged between the materials to be pressed.

2. The cover film lamination structure of claim 1, wherein the cover film lamination structure comprises two materials to be laminated and a thermally conductive rigid backing sheet; the upper surface of the heat-conducting hard liner plate is sequentially stacked with a material to be pressed and an upper uniform heat buffer plate; the lower surface of the heat-conducting hard lining plate is connected with a second piece of material to be pressed on the lower uniform heat buffer plate.

3. The cover film lamination structure according to claim 1, wherein the heat conductive hard liner has a planar size and shape conforming to the upper and lower baked iron plates.

4. The cover film lamination structure according to claim 1, wherein a vertical thickness between the upper and lower surfaces of the thermally conductive stiffener is not less than 0.8 mm.

5. The cover film laminating structure of claim 1, wherein the thermally conductive hard liner is an aluminum plate with parallel upper and lower surfaces.