JP4134729B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component in which a multilayer chip for a plurality of multilayer ceramic electronic components is taken out from a mother multilayer body. .
[0002]
[Prior art]
FIG. 7 is a sectional view showing a multilayer ceramic capacitor 1 as an example of the multilayer ceramic electronic component of interest to the present invention.
[0003]
The multilayer ceramic capacitor 1 includes a multilayer chip 4 including a plurality of ceramic layers 3 stacked with an internal electrode 2 as an internal circuit element interposed therebetween. An external electrode 5 is formed so as to be electrically connected to the electrode 3.
[0004]
When manufacturing such a multilayer ceramic capacitor 1 on a factory scale, a mother multilayer body in which a plurality of multilayer chips 4 can be taken out by division by cutting, breaking or dicing is produced. The mother laminated body includes a plurality of laminated ceramic green sheets to be the ceramic layer 3 and internal electrodes 2 formed in a plurality of locations on a specific ceramic green sheet.
[0005]
In the raw stage before firing, the mother laminated body as described above can be taken out along a predetermined dividing line to take out a plurality of laminated chips 4 in a raw state. These multilayer chips 4 are then fired, and then external electrodes 5 are formed, whereby a desired multilayer ceramic capacitor 1 is obtained.
[0006]
In order to produce the mother laminate, a plurality of ceramic green sheets including the ceramic green sheet on which the internal electrode 2 is formed are laminated, and then each step of pressing the ceramic green sheets in the lamination direction is performed.
[0007]
On the other hand, in order to improve the manufacturing efficiency of the multilayer ceramic capacitor 1, a larger number of multilayer chips 4 can be taken out from one mother multilayer body by making the mother multilayer body have a larger area. It is effective.
[0008]
However, when the mother laminate is enlarged, the following problems are encountered.
[0009]
First, with an increase in the size of the mother laminate, handling in each process such as transport from the laminating apparatus for producing the mother laminate to the press apparatus, positioning to the press apparatus, and removal from the press apparatus becomes more difficult.
[0010]
Further, the apparatus used in the laminating process, the conveying process, the pressing process, etc. is increased in size, and the problem such as an increase in equipment cost cannot be ignored.
[0011]
Furthermore, in the pressing process, deformation and misalignment of the internal electrode 2 that can occur due to the flow of raw ceramics are more likely to occur as the mother laminate is increased in size.
[0012]
In connection with these problems, the process of dividing the mother laminate is divided into two stages, an intermediate laminate having intermediate dimensions is obtained in the first stage, and the intermediate laminate is divided and laminated in the second stage thereafter. While adopting a method of obtaining a body chip, a press process with a relatively high pressure is not performed at the stage of the mother laminate, and a press process with a relatively high pressure is performed on the intermediate laminate, for example. This is proposed in Japanese Unexamined Patent Publication No. 2000-100635 (Patent Document 1).
[0013]
According to the method described in Patent Document 1, it is possible to avoid an increase in the size of an apparatus used in the pressing process, and it is possible to reduce deformation and displacement of the internal electrode 2 that may occur in the pressing process.
[0014]
Further, for example, in Japanese Patent Application Laid-Open No. 7-106190 (Patent Document 2), when a laminated body in which a plurality of ceramic green sheets are laminated is pressed in a pressing mold, the mold has excellent release properties on the surface thereof. It has been proposed that an adhesive film be pressed between a laminate and a press mold.
[0015]
According to the method described in Patent Document 2, handling when the mother laminate is taken out from the press device is facilitated, and therefore, the enlargement of the mother laminate can be dealt with to some extent.
[0016]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-100635
[Patent Document 2]
JP-A-7-106190
[0017]
[Problems to be solved by the invention]
According to the techniques described in Patent Documents 1 and 2 described above, the above-mentioned several problems encountered when the mother laminate is enlarged are solved. However, even with the techniques described in Patent Documents 1 and 2, the problem that it is difficult to transport the mother laminate from the laminating apparatus to the press apparatus and the positioning to the press apparatus, the problem that the laminating apparatus is enlarged, etc. Still not solved.
[0018]
Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.
[0019]
[Means for Solving the Problems]
The method of manufacturing a multilayer ceramic electronic component according to the present invention provides a multilayer chip for each multilayer ceramic electronic component when divided along a predetermined plurality of dividing lines, A mother laminate production process for producing a mother laminate, and a plurality of mother laminates comprising a plurality of ceramic green sheets and internal circuit elements distributed and formed on a specific ceramic green sheet. A primary dividing step for dividing a plurality of intermediate laminates having intermediate dimensions by dividing along a specific one of the dividing lines, and a pressing step for pressing the intermediate laminates in the laminating direction. And a secondary dividing step for dividing the pressed intermediate laminate along the remainder of the plurality of dividing lines, thereby obtaining a plurality of laminate chips.
[0020]
In order to solve the above-described technical problem, the present invention is characterized in that the following configuration is provided in such a method for manufacturing a multilayer ceramic electronic component.
[0021]
First, a step of preparing an undersheet in which the peripheral edge portion is held by a frame-shaped holder is provided.
[0022]
The mother laminate manufacturing step includes a step of laminating a plurality of ceramic green sheets including a ceramic green sheet on which internal circuit elements are formed on the undersheet held by the frame-shaped holder.
[0023]
Further, in the above-described primary division step, in order to take out the intermediate laminated body from the frame-shaped holder, the undersheet is divided inside the frame-shaped holder, and an intermediate laminated body that is backed by the undersheet is obtained. For this purpose, a step of dividing the mother laminate together with the undersheet is provided.
[0024]
And a press process is implemented with respect to the intermediate | middle laminated body of the state backed by the undersheet.
[0025]
In this invention, it is preferable that the above-mentioned secondary division process is carried out after the undersheet is peeled from the intermediate laminate.
[0026]
Moreover, it is preferable that an undersheet has adhesiveness in the surface which contact | connects a mother laminated body.
[0027]
Moreover, it is preferable that the mother laminate manufacturing process and the primary division process are performed while positioning the frame-shaped holder.
[0028]
In the mother laminate manufacturing step, the undersheet is preferably fixed by applying vacuum suction to the surface opposite to the surface on which the ceramic green sheets are laminated.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
1 to 6 are for explaining a method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. In this embodiment, a multilayer ceramic capacitor 1 including a multilayer chip 4 as shown in FIG. 7 is manufactured as a multilayer ceramic electronic component.
[0030]
In order to carry out the manufacturing method according to this embodiment, a frame-shaped holder 11 and an undersheet 12 as shown in FIG. 1 are prepared. The undersheet 12 is overlaid on the frame-shaped holder 11, and the peripheral edge thereof is attached to the holder 11 by a pressing plate 13. Although not shown, for example, screwing is applied to this attachment. In this way, as shown in FIGS. 2 and 3, the undersheet 12 is in a state in which the peripheral edge thereof is held by the frame-shaped holder 11.
[0031]
In FIG. 3, the mother laminate 14 is illustrated. In order to produce such a mother laminate 14, the following steps are performed.
[0032]
With reference to FIG. 2, carrier film 15 is prepared, and ceramic green sheet 16 is produced by forming ceramic slurry into a sheet on carrier film 15. For forming the ceramic slurry into a sheet, for example, a coating method or a printing method is applied. The thickness of the ceramic green sheet 16 is usually about 1 to 30 μm.
[0033]
The carrier film 15 is made of, for example, a polyester film or a polyolefin film having a thickness of 50 to 70 μm, and particularly preferably made of a polyethylene terephthalate film or a polypropylene film from the viewpoints of cost and physical properties. The carrier film 15 is usually elongated, and the ceramic green sheet 16 is continuously formed in the longitudinal direction on the elongated carrier film 15.
[0034]
Next, a conductor film that is distributed at a plurality of locations on the ceramic green sheet 16 and is to be the internal electrode 2 (see FIG. 7) as an internal circuit element is formed by, for example, printing of a conductive paste. In FIG. 2 and FIGS. 3 to 6 to be described later, illustration of such a conductor film to be the internal electrode 2 is omitted.
[0035]
The step of forming the ceramic green sheet 16 on the carrier film 15 and the step of forming the conductor film that becomes the internal electrode 2 may be performed in the reverse order.
[0036]
In many drawings, the mother laminate 14 and the ceramic green sheet 16 are illustrated with exaggerated dimensions in the thickness direction, and the number of stacked ceramic green sheets 16 is less than the actual number. Point out that there is.
[0037]
In order to fabricate the mother laminated body 14, the step of laminating a plurality of ceramic green sheets 16 including the ceramic green sheet 16 on which the conductor film to be the internal electrode 2 is formed includes a frame-shaped holder 11 as shown in FIG. Is carried out on the undersheet 12 held by
[0038]
First, the frame-shaped holder 11 is positioned, and the undersheet 12 is placed on the lamination table 17. Although not shown, the laminate table 17 is preferably configured to be able to apply vacuum suction to the lower surface of the undersheet 12, whereby the undersheet 12 is fixed to the laminate table 17. Moreover, the lamination | stacking table 17 is heated to the temperature of about 60-80 degreeC.
[0039]
A suction head 18 is used to stack the ceramic green sheets 16. The suction head 18 can reciprocate between a position above the carrier film 15 and a position above the stacking table 17 as indicated by a double arrow 19. Although not shown, the suction head 18 includes a cutting blade. When the suction head 18 is in a position indicated by a broken line in FIG. 2, the cutting blade cuts out a predetermined region of the ceramic green sheet 16 on the carrier film 15. The suction head 18 is configured to hold the ceramic green sheet 16 thus cut out based on vacuum suction, and conveys the ceramic green sheet 16 thus held to a position above the stacking table 17.
[0040]
As described above, the ceramic green sheet 16 conveyed by the suction head 18 is moved on the undersheet 12 on the stacking table 17 or the ceramic already disposed on the undersheet 12 by the further downward movement of the suction head 18. It is arranged on the green sheet 16. At this time, in order to press-bond the ceramic green sheets 16 to be laminated to the ceramic green sheets 16 that have already been laminated, a temporary pressing step with a lower pressure than in the case of the pressing step described later may be performed. And the mother laminated body 14 as shown in FIG. 3 is obtained by repeating the above processes.
[0041]
In the laminating process as described above, the undersheet 12 acts to restrain and position the ceramic green sheet 14. As the undersheet 12, the same one as the carrier film 15 can be used. However, in order to exert the above-described action more effectively, the undersheet 12 exerts a greater restraining force on the ceramic green sheet 16. It is preferable that it can work. Further, the undersheet 12 must not be deformed even by a temperature of 60 to 80 ° C. as described above applied in the laminating process. Furthermore, the undersheet 12 must be capable of being cut by push-off in the division step described later.
[0042]
In consideration of these, as the undersheet 12, a polyester film or a polypropylene film such as a polyethylene terephthalate film having a thickness of about 100 to 250 μm is preferably used. And in order to be able to advance easily the peeling process of the undersheet 12 mentioned later, the release agent coating which gives favorable mold release property is given to the surface which contacts the mother laminated body 14 of the undersheet 12 at least. The ceramic green sheet 16 can be sufficiently restrained by the undersheet 12 due to the adhesiveness of the release agent itself.
[0043]
In addition, the adhesiveness by adhesives other than a mold release agent may be coated.
[0044]
As described above, when a release agent or an adhesive coating is applied, the surface roughness (Ra) of the undersheet 12 is preferably a smooth surface of 0.1 μm or less. Thereby, the smoothness of the surface of the ceramic green sheet 16 in contact with the undersheet 12 can be prevented from being impaired.
[0045]
On the other hand, when there is no particular need to prevent the smoothness of the surface of the ceramic green sheet 16 in contact with the undersheet 12, a release agent or an adhesive as described above is used to restrain the ceramic green sheet 16. You may employ | adopt the method of roughening the surface of the undersheet 12 without depending on the adhesiveness which has. In this case, the surface roughness (Ra) of the undersheet 12 is, for example, about 0.5 to 10 μm.
[0046]
Note that both the method based on adhesiveness and the method based on roughening may be used together. In any case, the undersheet 12 has a greater restraining force on the ceramic green sheet 16 than the carrier film 15. It is preferable to be configured as described above.
[0047]
In addition, it is important that the undersheet 12 having the above-described function is held by the frame-shaped holder 11.
[0048]
That is, when the undersheet 12 is not held by the holder 11, the ceramic green sheet 16 is enlarged although the undersheet 12 is sucked and held by the stacking table 17 during the stacking process. Accordingly, the amount of deformation of the ceramic green sheet 16 due to heat increases, and as a result, the undersheet 12 may be warped and the undersheet 12 may be lifted from the stacking table 17.
[0049]
Such lifting may cause a shift in the stacking position of the ceramic green sheets 16, or in the worst case, the suction head 18 and the ceramic green sheets 16 may interfere with each other, resulting in equipment failure. .
[0050]
These disadvantages can be advantageously avoided by holding the undersheet 12 by the frame-shaped holder 11.
[0051]
Further, when the undersheet 12 is not held by the holder 11, the undersheet 12 is likely to be deformed by heating from the stacking table 17. Such deformation is likely to occur in the surface direction of the stacking table 17, and this also causes a shift in the stacking position of the ceramic green sheets 16.
[0052]
Such inconvenience can be advantageously avoided by keeping the undersheet 12 held by the frame-shaped holder 11.
[0053]
When the production of the mother laminate 14 is finished as described above, the vacuum suction by the lamination table 17 is stopped, and the mother laminate 14 is held by the frame-shaped holder 11 as shown in FIG. 12 is taken out from the laminating apparatus. At this time, since tension is applied to the undersheet 12 by the frame-shaped holder 11, it is possible to prevent warpage due to a difference in thermal deformation amount between the undersheet 12 and the mother laminated body 14.
[0054]
The mother laminated body 14 taken out from the laminating apparatus is transported to a place where the next step is performed. This transportation is performed by placing the mother laminated body 14 on the undersheet 12 held by the frame-shaped holder 11. It is performed in the state of putting. Therefore, a conveying device for conveying the frame-shaped holder 11 can be applied, and the mechanism of the conveying device can be made simpler than when only the mother laminate 14 is conveyed.
[0055]
Next, the mother laminate 14 is divided along a specific dividing line 20 in the state shown in FIG. 3, thereby obtaining a plurality of intermediate laminates 21 having intermediate dimensions as shown in FIG. The next division step is performed. In this primary division step, usually, pressing with a cutting blade is applied, and the mother laminate 14 is divided together with the undersheet 12.
[0056]
The dividing line 20 described above is a virtual line obtained by sensing the mother laminate 14 and is a specific one of the plurality of dividing lines for obtaining the individual laminate chips 4 from the mother laminate 14. Yes, in this embodiment, it passes through the center of the mother laminate 14. The mother laminated body 14 is divided along a dividing line 20 passing through the central portion thereof and another dividing line that crosses the mother laminated body 14 in a cross shape, whereby, for example, four intermediate laminated bodies 21 are taken out.
[0057]
Further, in the primary division step, the undersheet 12 is divided inside the frame-shaped holder 11 in order to take out the intermediate laminate 21 from the frame-shaped holder 11. This division | segmentation is implement | achieved by the cutting | disconnection along the dividing line 22 which passes along the peripheral part of the mother laminated body 14, for example. Thus, if the cutting | disconnection along the dividing line 22 located in the peripheral part of the mother laminated body 14 is implemented, the external dimension precision of the obtained intermediate laminated body 21 can be improved.
[0058]
In addition, when the external dimension accuracy of the intermediate laminated body 21 is not so required, division in a region where the mother laminated body 14 in the undersheet 12 is not located, such as division along the dividing line 23, is applied. Also good.
[0059]
The above-described primary division process is preferably performed while positioning the frame-shaped holder 11. If the holder 11 is positioned, the mother laminated body 14 is positioned through the undersheet 12 held by the holder 11, and the division performed on the mother laminated body 14 can be performed with high positional accuracy. Further, a positioning mechanism can be easily realized as compared with the case where the mother laminate 14 is directly positioned.
[0060]
The primary division step is preferably performed at a low temperature of, for example, 60 ° C. or less in order to prevent deformation of the mother laminate 14 due to heat.
[0061]
FIG. 4 shows an intermediate laminate 21 obtained by performing the primary division step. As a result of the primary division process as described above, the intermediate laminate 21 is backed by the undersheet 12.
[0062]
Next, a pressing step for pressing the intermediate laminated body 21 as described above in the laminating direction is performed. In this pressing step, a hydrostatic press or a rigid press is applied. In the pressing step, pressing may be performed after an elastic body is interposed.
[0063]
In such a pressing process, since the intermediate laminate 21 is lined with the undersheet 12, the undersheet 12 functions to constrain the flow of the raw ceramic, and can be generated in the intermediate laminate 21. Distortion can be reduced. Further, the pressing device for pressing the intermediate laminate 21 can be reduced in size as compared with the pressing device for pressing the mother laminate 14.
[0064]
In the pressing process, a mold that accommodates the intermediate laminate 21 is usually used. However, this mold is used exclusively in the pressing process. That is, it is not necessary to use such a mold in the above-described stacking process and transporting process. The mold used in the pressing process is usually relatively heavy in order to withstand the pressure in the pressing process. For this reason, when such a mold is used also in the transfer process, high rigidity is required for the transfer device, which causes an increase in cost. Moreover, such a mold has a large heat capacity. Therefore, when such a mold is used as the above-described lamination table 17 in the lamination process, it takes a preheating time for heating it to a predetermined temperature, and an extra heat source is also required. These problems can be all solved by using the frame-shaped holder 11 that holds the undersheet 12 in the stacking process and the transporting process.
[0065]
Next, as shown in FIG. 5, the undersheet 12 is peeled from the intermediate laminate 21.
[0066]
Next, as shown in FIG. 6, a secondary division step for dividing the intermediate laminate 21 along the remaining dividing lines 24 is performed. Also in this secondary division step, pressing with a cutting blade is applied. As a result of the secondary division step, a plurality of laminated chips 4 are obtained.
[0067]
Thereafter, each multilayer chip 4 is fired as is well known, and then when the external electrode 5 is formed as shown in FIG. 7, a desired multilayer ceramic capacitor 1 is obtained.
[0068]
As described above, the present invention has been described in relation to the method of manufacturing the multilayer ceramic capacitor according to the illustrated embodiment, but the present invention is not limited to the multilayer ceramic capacitor, and the multilayer ceramic electronic component that functions as a resistor, an inductor, a varistor, and the like, The present invention can also be applied to a multilayer ceramic electronic component such as a multilayer ceramic substrate or a multilayer ceramic electronic component in which a plurality of functions are combined.
[0069]
In the embodiment described above, the internal circuit element formed inside the multilayer chip is the internal electrode. However, as described above, the present invention is applicable to various multilayer ceramic electronic components having an arbitrary function. Therefore, various modes can be considered as the internal circuit element. For example, the internal circuit element may be, for example, a circuit element having a relatively large electrical resistance or other electrical characteristics, in addition to a circuit element having good conductivity such as an internal electrode.
[0070]
Further, the undersheet 12 used in the above-described embodiment may be heat-treated before being attached to the frame-shaped holder 11, and measures for suppressing thermal shrinkage may be taken.
[0071]
The undersheet 12 may be made of paper, a thin metal sheet, or the like other than a resin film such as polyethylene terephthalate. Thus, even when paper or a thin metal sheet is used, a release agent coating is applied as necessary.
[0072]
【The invention's effect】
As described above, according to the present invention, the step of preparing an undersheet in which the peripheral portion is held by the frame-shaped holder and laminating a plurality of ceramic green sheets on the undersheet Since it carries out, the mother laminated body after a lamination process can be conveyed with the undersheet held by the frame-shaped holder. Therefore, handling of the mother laminate can be facilitated, and damage to the mother laminate being handled can be made difficult to occur.
[0073]
Moreover, since the undersheet is held by the frame-shaped holder, thermal deformation occurs in the ceramic green sheet in the laminating process, and even if this thermal deformation occurs largely due to the enlargement of the ceramic green sheet, the undersheet is not deformed. It is prevented from being brought. Therefore, it is possible to prevent the accuracy of the stacking position from being lowered and the ceramic green sheet or the mother stacked body from being warped.
[0074]
Further, in the present invention, before obtaining a laminated chip for each laminated ceramic electronic component from the mother laminated body, an intermediate laminated body having an intermediate size is obtained, and the intermediate laminated body is pressed. To implement. And in the primary division | segmentation process for obtaining an intermediate | middle laminated body, the mother laminated body is divided | segmented with the undersheet hold | maintained with the frame-shaped holder.
[0075]
Therefore, since the mother laminated body in which the primary division process is performed is in a state of being placed on the undersheet held by the frame-shaped holder, it is easy to handle and gives high accuracy with respect to the division position. be able to.
[0076]
In addition, since the pressing process is performed on the intermediate laminated body having a smaller size than the mother laminated body, the handling in the pressing process is facilitated and the pressing device can be miniaturized. Further, since the pressing step is performed on the intermediate laminate that is backed by the undersheet, the undersheet acts so as to restrain the flow of the raw ceramic, thereby making it difficult to cause press distortion. .
[0077]
The above undersheet is not particularly required in the secondary division step for further dividing the intermediate laminate to obtain a plurality of laminate chips. Therefore, if a secondary division process is implemented after peeling an undersheet from an intermediate layered product, a secondary division process can be advanced more smoothly. Moreover, after obtaining a laminated body chip | tip, an undersheet can be peeled efficiently compared with the case where an undersheet is peeled.
[0078]
If the undersheet has adhesiveness on the surface in contact with the mother laminated body, the ceramic green sheet or the mother laminated body can be reliably positioned with respect to the undersheet. The accuracy of the division position in the next division step can be further increased. In addition, since the positioning of the ceramic green sheet or the mother laminate with respect to the under sheet is ensured, the surface of the ceramic green sheet in contact with the under sheet has good smoothness because no treatment such as roughening the under sheet is required. Can be.
[0079]
When the mother laminate manufacturing step and the primary division step are performed while positioning the frame-shaped holder, the ceramic green sheet or the mother laminate can be positioned more reliably, and for such positioning. This mechanism can be realized with a simple configuration.
[0080]
In the mother laminate manufacturing process, when the undersheet is fixed by applying vacuum suction to the surface opposite to the surface on which the ceramic green sheets are laminated, the accuracy of the ceramic green sheet lamination position is further increased. Can do.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a frame-shaped holder 11, an under sheet 12, and a pressing plate 13 used in a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention in a state where they are separated from each other.
2 is a cross-sectional view showing a state in which a step of laminating ceramic green sheets 16 using an undersheet 12 held by a frame-shaped holder 11 shown in FIG. 1 is performed.
3 is a cross-sectional view showing a mother laminate 14 located on an undersheet 12 held by a frame-shaped holder 11 obtained by performing the process shown in FIG.
4 is a cross-sectional view showing a plurality of intermediate laminates 21 obtained by performing a primary division step in the state shown in FIG.
FIG. 5 is a cross-sectional view showing a process of peeling the undersheet 12 from the intermediate laminate 21 shown in FIG.
6 is a cross-sectional view for explaining a secondary division step for obtaining individual laminate chips 4 from the intermediate laminate 21 shown in FIG.
FIG. 7 is a cross-sectional view showing a multilayer ceramic capacitor 1 as an example of a multilayer ceramic electronic component of interest to the present invention.
[Explanation of symbols]
1 Multilayer ceramic capacitor
2 Internal electrodes (internal circuit elements)
3 Ceramic layer
4 Laminated chip
11 Frame-shaped holder
12 Under sheet
14 Mother laminate
16 Ceramic green sheet
17 Stacking table
20, 22, 23, 24 Dividing line
21 Intermediate laminate

Claims (5)

When divided along a plurality of predetermined dividing lines, a multilayer chip for each multilayer ceramic electronic component is provided, and the plurality of stacked ceramic green sheets and a specific ceramic green sheet A mother laminate production process for producing a mother laminate, comprising internal circuit elements distributed and formed in a plurality of locations,
Dividing the mother laminate along a particular one of the plurality of dividing lines, thereby obtaining a plurality of intermediate laminates having intermediate dimensions;
A pressing step for pressing the intermediate laminate in the laminating direction;
Dividing the pressed intermediate laminate along the remainder of the plurality of dividing lines, thereby providing a secondary dividing step for obtaining a plurality of laminate chips, and
A step of preparing an undersheet in a state where the peripheral edge thereof is held by a frame-shaped holder,
The mother laminate manufacturing step includes a step of laminating the plurality of ceramic green sheets including the ceramic green sheet on which the internal circuit element is formed on the undersheet held by the frame-shaped holder,
In the primary division step, in order to take out the intermediate laminated body from the frame-shaped holder, the intermediate sheet is divided inside the frame-shaped holder and is backed by the undersheet. Splitting the mother laminate with the undersheet to obtain a body,
The pressing step is performed on the intermediate laminate that is backed by the undersheet.
Manufacturing method of multilayer ceramic electronic component. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the secondary division step is performed after the undersheet is peeled from the intermediate laminate. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the undersheet has adhesiveness on a surface in contact with the mother laminate. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the mother laminate manufacturing step and the primary division step are performed while positioning the frame-shaped holder. 5. 5. The laminated ceramic according to claim 1, wherein, in the mother laminate manufacturing step, the undersheet is fixed by applying vacuum suction to a surface opposite to a surface on which the ceramic green sheets are laminated. Manufacturing method of electronic components.

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