TW200635462A - Manufacturing processes for flexible and rigid compound printed circuit board - Google Patents

Manufacturing processes for flexible and rigid compound printed circuit board

Info

Publication number
TW200635462A
TW200635462A TW094108736A TW94108736A TW200635462A TW 200635462 A TW200635462 A TW 200635462A TW 094108736 A TW094108736 A TW 094108736A TW 94108736 A TW94108736 A TW 94108736A TW 200635462 A TW200635462 A TW 200635462A
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit board
flexible
rigid
manufacturing processes
Prior art date
Application number
TW094108736A
Other languages
Chinese (zh)
Other versions
TWI326569B (en
Inventor
jun-yi Wang
Chao-Ting Lee
Kai-His Lee
sheng-hui Wang
Chia-Hua Pai
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW94108736A priority Critical patent/TWI326569B/en
Publication of TW200635462A publication Critical patent/TW200635462A/en
Application granted granted Critical
Publication of TWI326569B publication Critical patent/TWI326569B/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A manufacturing process for a rigid and flexible compound printed circuit board is disclosed. It includes the following steps. First, at least a flexible printed circuit board is provided. And then, the flexible printed circuit board is divided into a plurality of sub-flexible printed circuit boards. Next, a plurality of good sub-flexible printed circuit boards are chosen among the sub-flexible printed circuit boards. Afterwards, these good sub-flexible printed circuit boards are disposed on at least one rigid printed circuit board or are disposed between/among at least two rigid printed circuit boards so as to form the rigid and flexible compound printed circuit board.
TW94108736A 2005-03-22 2005-03-22 Manufacturing processes for flexible and rigid compound printed circuit board TWI326569B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94108736A TWI326569B (en) 2005-03-22 2005-03-22 Manufacturing processes for flexible and rigid compound printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94108736A TWI326569B (en) 2005-03-22 2005-03-22 Manufacturing processes for flexible and rigid compound printed circuit board

Publications (2)

Publication Number Publication Date
TW200635462A true TW200635462A (en) 2006-10-01
TWI326569B TWI326569B (en) 2010-06-21

Family

ID=45074347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94108736A TWI326569B (en) 2005-03-22 2005-03-22 Manufacturing processes for flexible and rigid compound printed circuit board

Country Status (1)

Country Link
TW (1) TWI326569B (en)

Also Published As

Publication number Publication date
TWI326569B (en) 2010-06-21

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