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Application filed by Compeq Mfg Co LtdfiledCriticalCompeq Mfg Co Ltd
Priority to TW94108736ApriorityCriticalpatent/TWI326569B/en
Publication of TW200635462ApublicationCriticalpatent/TW200635462A/en
Application grantedgrantedCritical
Publication of TWI326569BpublicationCriticalpatent/TWI326569B/en
Production Of Multi-Layered Print Wiring Board
(AREA)
Combinations Of Printed Boards
(AREA)
Abstract
A manufacturing process for a rigid and flexible compound printed circuit board is disclosed. It includes the following steps. First, at least a flexible printed circuit board is provided. And then, the flexible printed circuit board is divided into a plurality of sub-flexible printed circuit boards. Next, a plurality of good sub-flexible printed circuit boards are chosen among the sub-flexible printed circuit boards. Afterwards, these good sub-flexible printed circuit boards are disposed on at least one rigid printed circuit board or are disposed between/among at least two rigid printed circuit boards so as to form the rigid and flexible compound printed circuit board.
TW94108736A2005-03-222005-03-22Manufacturing processes for flexible and rigid compound printed circuit board
TWI326569B
(en)
Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same