TWI319812B - System for inspecting surfaces with improved light efficiency - Google Patents

System for inspecting surfaces with improved light efficiency

Info

Publication number
TWI319812B
TWI319812B TW096108463A TW96108463A TWI319812B TW I319812 B TWI319812 B TW I319812B TW 096108463 A TW096108463 A TW 096108463A TW 96108463 A TW96108463 A TW 96108463A TW I319812 B TWI319812 B TW I319812B
Authority
TW
Taiwan
Prior art keywords
light efficiency
improved light
inspecting surfaces
inspecting
improved
Prior art date
Application number
TW096108463A
Other languages
English (en)
Other versions
TW200739061A (en
Inventor
Zhao Guoheng
Yan Zheng
Li Bo
Chen Weihua
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200739061A publication Critical patent/TW200739061A/zh
Application granted granted Critical
Publication of TWI319812B publication Critical patent/TWI319812B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/062—LED's
    • G01N2201/0627—Use of several LED's for spectral resolution
TW096108463A 2006-03-22 2007-03-12 System for inspecting surfaces with improved light efficiency TWI319812B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74367206P 2006-03-22 2006-03-22

Publications (2)

Publication Number Publication Date
TW200739061A TW200739061A (en) 2007-10-16
TWI319812B true TWI319812B (en) 2010-01-21

Family

ID=38943012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108463A TWI319812B (en) 2006-03-22 2007-03-12 System for inspecting surfaces with improved light efficiency

Country Status (3)

Country Link
US (1) US7564544B2 (zh)
CN (1) CN100582717C (zh)
TW (1) TWI319812B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448730B (zh) * 2011-10-25 2014-08-11 Ind Tech Res Inst 均勻打光之掃描式視覺系統

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US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen
US7838302B2 (en) 2006-08-07 2010-11-23 President And Fellows Of Harvard College Sub-diffraction limit image resolution and other imaging techniques
CN101622525A (zh) * 2007-02-28 2010-01-06 株式会社尼康 观察方法、检查装置及检查方法
CN101918816B (zh) * 2007-12-21 2015-12-02 哈佛大学 三维中的亚衍射极限图像分辨率
CN102105777B (zh) 2008-07-22 2013-03-13 奥博泰克有限公司 高效的远心光学系统
TWI497061B (zh) * 2009-04-30 2015-08-21 Corning Inc 用以偵測玻璃板中的缺陷之方法及設備
JP2011039005A (ja) * 2009-08-18 2011-02-24 Topcon Corp 測定装置
KR20110029011A (ko) * 2009-09-14 2011-03-22 주식회사 엘지화학 파우치형 전지 내의 이물질 검출장치
KR101197706B1 (ko) * 2010-02-12 2012-11-05 엘아이지에이디피 주식회사 광균일도가 향상된 기판검사장치
CN102169284A (zh) * 2010-02-26 2011-08-31 深圳清溢光电股份有限公司 一种铬版的检查方法
KR101832526B1 (ko) 2010-08-05 2018-04-13 오르보테크 엘티디. 조명 시스템
JP5621498B2 (ja) * 2010-10-19 2014-11-12 凸版印刷株式会社 ムラ欠陥の検査方法
CN102253051A (zh) * 2011-05-03 2011-11-23 3i系统公司 一种线扫描探测器检测太阳能电池片缺陷的系统
CN102798030A (zh) * 2011-05-21 2012-11-28 辽宁奇辉电子系统工程有限公司 一种基于线阵扫描相机短距离线性光源装置
CN102798031A (zh) * 2011-05-21 2012-11-28 辽宁奇辉电子系统工程有限公司 一种基于线阵扫描相机长距离线性光源装置
US8896827B2 (en) * 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
WO2014005185A1 (en) * 2012-07-06 2014-01-09 Bt Imaging Pty Ltd Methods for inspecting semiconductor wafers
CN103177983B (zh) * 2013-03-01 2016-09-28 日月光半导体制造股份有限公司 检测装置及方法
TWI477736B (zh) * 2013-12-05 2015-03-21 Nat Applied Res Laboratories 多工物件參數光學量測整合裝置與方法
JP6436664B2 (ja) * 2014-07-14 2018-12-12 住友化学株式会社 基板の検査装置及び基板の検査方法
US9460886B2 (en) * 2014-07-22 2016-10-04 Kla-Tencor Corporation High resolution high quantum efficiency electron bombarded CCD or CMOS imaging sensor
DE102015109431A1 (de) * 2015-06-12 2016-12-15 Witrins S.R.O. Inspektionssystem und Verfahren zur Fehleranalyse von Drahtverbindungen
FR3045846B1 (fr) * 2015-12-22 2018-09-28 Centre National De La Recherche Scientifique Dispositif electro-optique pour la detection de la modification locale d’un champ electrique.
DE102016101452B4 (de) * 2016-01-27 2018-10-11 Infineon Technologies Ag Inspektion elektronischer Chips durch Rückseitenbeleuchtung
CN105784714B (zh) * 2016-03-31 2018-05-29 浙江工业大学 一种通过鱼眼透镜组检测货架横梁是否合格的装置
JP6546672B1 (ja) * 2018-02-22 2019-07-17 陽程科技股▲ふん▼有限公司 光路検出装置の検出方法
US10746599B2 (en) * 2018-10-30 2020-08-18 Variable, Inc. System and method for spectral interpolation using multiple illumination sources
CN111351794B (zh) * 2018-12-20 2021-12-10 上海微电子装备（集团）股份有限公司 一种物体表面检测装置及检测方法
DE102019103035A1 (de) * 2019-02-07 2020-08-13 Analytik Jena Ag Atomabsorptionsspektrometer
CN110068534A (zh) * 2019-05-17 2019-07-30 北京领邦智能装备股份公司 检测用精准出光装置和测量仪
US11733605B2 (en) 2019-06-20 2023-08-22 Kla Corporation EUV in-situ linearity calibration for TDI image sensors using test photomasks

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US5024529A (en) * 1988-01-29 1991-06-18 Synthetic Vision Systems, Inc. Method and system for high-speed, high-resolution, 3-D imaging of an object at a vision station
IL116717A (en) * 1996-01-09 1999-12-22 Elop Electrooptics Ind Ltd Optical tracing system
US5883714A (en) * 1996-10-07 1999-03-16 Phase Metrics Method and apparatus for detecting defects on a disk using interferometric analysis on reflected light
US6046812A (en) * 1997-05-29 2000-04-04 Korea Atomic Energy Research Institute Shape-measuring laser apparatus using anisotropic magnification optics
WO2003083510A1 (en) * 2002-04-02 2003-10-09 Institut National D'optique Sensor and method for range measurements using a tdi device
JP2006509190A (ja) * 2002-11-27 2006-03-16 オプティカル・メトロロジー・パテンツ・リミテッド 光学測定装置及び方法
EP1697729B1 (en) * 2003-09-04 2010-11-10 KLA-Tencor Corporation Methods for inspection of a specimen using different inspection parameters

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448730B (zh) * 2011-10-25 2014-08-11 Ind Tech Res Inst 均勻打光之掃描式視覺系統

Also Published As

Publication number Publication date
CN101089579A (zh) 2007-12-19
US20070222974A1 (en) 2007-09-27
TW200739061A (en) 2007-10-16
CN100582717C (zh) 2010-01-20
US7564544B2 (en) 2009-07-21

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