TWI318421B - Structure and method for improving carrier mobility of a channel - Google Patents
Structure and method for improving carrier mobility of a channelInfo
- Publication number
- TWI318421B TWI318421B TW093103284A TW93103284A TWI318421B TW I318421 B TWI318421 B TW I318421B TW 093103284 A TW093103284 A TW 093103284A TW 93103284 A TW93103284 A TW 93103284A TW I318421 B TWI318421 B TW I318421B
- Authority
- TW
- Taiwan
- Prior art keywords
- channel
- carrier mobility
- improving carrier
- improving
- mobility
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/2807—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being Si or Ge or C and their alloys except Si
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/933—Germanium or silicon or Ge-Si on III-V
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/366,220 US6924181B2 (en) | 2003-02-13 | 2003-02-13 | Strained silicon layer semiconductor product employing strained insulator layer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200419659A TW200419659A (en) | 2004-10-01 |
TWI318421B true TWI318421B (en) | 2009-12-11 |
Family
ID=32849726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093103284A TWI318421B (en) | 2003-02-13 | 2004-02-12 | Structure and method for improving carrier mobility of a channel |
Country Status (3)
Country | Link |
---|---|
US (1) | US6924181B2 (zh) |
CN (1) | CN1293646C (zh) |
TW (1) | TWI318421B (zh) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6967143B2 (en) * | 2003-04-30 | 2005-11-22 | Freescale Semiconductor, Inc. | Semiconductor fabrication process with asymmetrical conductive spacers |
US7078742B2 (en) | 2003-07-25 | 2006-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Strained-channel semiconductor structure and method of fabricating the same |
US6940705B2 (en) * | 2003-07-25 | 2005-09-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capacitor with enhanced performance and method of manufacture |
US6936881B2 (en) * | 2003-07-25 | 2005-08-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capacitor that includes high permittivity capacitor dielectric |
US7163867B2 (en) * | 2003-07-28 | 2007-01-16 | International Business Machines Corporation | Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom |
US7112495B2 (en) * | 2003-08-15 | 2006-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method of a strained channel transistor and a second semiconductor component in an integrated circuit |
US7071052B2 (en) * | 2003-08-18 | 2006-07-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Resistor with reduced leakage |
US20050077574A1 (en) * | 2003-10-08 | 2005-04-14 | Chandra Mouli | 1T/0C RAM cell with a wrapped-around gate device structure |
US8008724B2 (en) * | 2003-10-30 | 2011-08-30 | International Business Machines Corporation | Structure and method to enhance both nFET and pFET performance using different kinds of stressed layers |
US7888201B2 (en) | 2003-11-04 | 2011-02-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor-on-insulator SRAM configured using partially-depleted and fully-depleted transistors |
US7119404B2 (en) * | 2004-05-19 | 2006-10-10 | Taiwan Semiconductor Manufacturing Co. Ltd. | High performance strained channel MOSFETs by coupled stress effects |
US7495266B2 (en) * | 2004-06-16 | 2009-02-24 | Massachusetts Institute Of Technology | Strained silicon-on-silicon by wafer bonding and layer transfer |
DE102004031710B4 (de) * | 2004-06-30 | 2007-12-27 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Herstellen unterschiedlich verformter Halbleitergebiete und Transistorpaar in unterschiedlich verformten Halbleitergebieten |
US7397087B2 (en) * | 2004-08-06 | 2008-07-08 | International Business Machines Corporation | FEOL/MEOL metal resistor for high end CMOS |
DE102004042167B4 (de) * | 2004-08-31 | 2009-04-02 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Ausbilden einer Halbleiterstruktur, die Transistorelemente mit unterschiedlich verspannten Kanalgebieten umfasst, und entsprechende Halbleiterstruktur |
US7323391B2 (en) * | 2005-01-15 | 2008-01-29 | Applied Materials, Inc. | Substrate having silicon germanium material and stressed silicon nitride layer |
US7442597B2 (en) * | 2005-02-02 | 2008-10-28 | Texas Instruments Incorporated | Systems and methods that selectively modify liner induced stress |
US8138104B2 (en) * | 2005-05-26 | 2012-03-20 | Applied Materials, Inc. | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure |
US7566655B2 (en) * | 2005-05-26 | 2009-07-28 | Applied Materials, Inc. | Integration process for fabricating stressed transistor structure |
US8129290B2 (en) | 2005-05-26 | 2012-03-06 | Applied Materials, Inc. | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure |
US7425740B2 (en) * | 2005-10-07 | 2008-09-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and structure for a 1T-RAM bit cell and macro |
US20070246776A1 (en) * | 2006-04-20 | 2007-10-25 | Synopsys, Inc. | Stress engineering for cap layer induced stress |
US7678636B2 (en) * | 2006-06-29 | 2010-03-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Selective formation of stress memorization layer |
US20080157292A1 (en) * | 2006-12-29 | 2008-07-03 | Texas Instruments Inc. | High-stress liners for semiconductor fabrication |
US8558278B2 (en) | 2007-01-16 | 2013-10-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained transistor with optimized drive current and method of forming |
US20080191285A1 (en) | 2007-02-09 | 2008-08-14 | Chih-Hsin Ko | CMOS devices with schottky source and drain regions |
US8466508B2 (en) * | 2007-10-03 | 2013-06-18 | Macronix International Co., Ltd. | Non-volatile memory structure including stress material between stacked patterns |
US7943961B2 (en) | 2008-03-13 | 2011-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strain bars in stressed layers of MOS devices |
US7808051B2 (en) | 2008-09-29 | 2010-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Standard cell without OD space effect in Y-direction |
DE102009010883B4 (de) * | 2009-02-27 | 2011-05-26 | Amd Fab 36 Limited Liability Company & Co. Kg | Einstellen eines nicht-Siliziumanteils in einer Halbleiterlegierung während der FET-Transistorherstellung mittels eines Zwischenoxidationsprozesses |
US8236709B2 (en) | 2009-07-29 | 2012-08-07 | International Business Machines Corporation | Method of fabricating a device using low temperature anneal processes, a device and design structure |
CN102110710A (zh) * | 2009-12-23 | 2011-06-29 | 中国科学院微电子研究所 | 形成有沟道应力层的半导体结构及其形成方法 |
US8883598B2 (en) * | 2012-03-05 | 2014-11-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thin capped channel layers of semiconductor devices and methods of forming the same |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
US10084063B2 (en) * | 2014-06-23 | 2018-09-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534713A (en) * | 1994-05-20 | 1996-07-09 | International Business Machines Corporation | Complementary metal-oxide semiconductor transistor logic using strained SI/SIGE heterostructure layers |
US5633202A (en) * | 1994-09-30 | 1997-05-27 | Intel Corporation | High tensile nitride layer |
JPH08321612A (ja) * | 1995-05-26 | 1996-12-03 | Ricoh Co Ltd | 半導体装置及びその製造方法 |
JPH10144919A (ja) * | 1996-11-14 | 1998-05-29 | Denso Corp | Misトランジスタの製造方法 |
US5963817A (en) * | 1997-10-16 | 1999-10-05 | International Business Machines Corporation | Bulk and strained silicon on insulator using local selective oxidation |
JPH11274315A (ja) * | 1998-03-19 | 1999-10-08 | Hitachi Ltd | 半導体装置 |
US6690043B1 (en) * | 1999-11-26 | 2004-02-10 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
JP2002198368A (ja) * | 2000-12-26 | 2002-07-12 | Nec Corp | 半導体装置の製造方法 |
WO2002052652A1 (fr) * | 2000-12-26 | 2002-07-04 | Matsushita Electric Industrial Co., Ltd. | Composant a semi-conducteur et son procede de fabrication |
US20020168802A1 (en) * | 2001-05-14 | 2002-11-14 | Hsu Sheng Teng | SiGe/SOI CMOS and method of making the same |
US20020167048A1 (en) * | 2001-05-14 | 2002-11-14 | Tweet Douglas J. | Enhanced mobility NMOS and PMOS transistors using strained Si/SiGe layers on silicon-on-insulator substrates |
US6730551B2 (en) * | 2001-08-06 | 2004-05-04 | Massachusetts Institute Of Technology | Formation of planar strained layers |
-
2003
- 2003-02-13 US US10/366,220 patent/US6924181B2/en not_active Expired - Lifetime
-
2004
- 2004-02-12 TW TW093103284A patent/TWI318421B/zh not_active IP Right Cessation
- 2004-02-13 CN CNB2004100043357A patent/CN1293646C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1525574A (zh) | 2004-09-01 |
TW200419659A (en) | 2004-10-01 |
CN1293646C (zh) | 2007-01-03 |
US6924181B2 (en) | 2005-08-02 |
US20040159834A1 (en) | 2004-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI318421B (en) | Structure and method for improving carrier mobility of a channel | |
SG120086A1 (en) | Method of forming a transistor with a strained channel | |
AU2003293056A8 (en) | Multimedia editor for wireless communication devices and method therefor | |
AU2003266149A1 (en) | Finfet having improved carrier mobility and method of its formation | |
GB2407240B (en) | Method and apparatus for providing channel state information | |
SG123567A1 (en) | Multiple-gate transistor structure and method for fabricating | |
AU2003220088A8 (en) | Ald method and apparatus | |
GB2436035B (en) | Apparatus and method capable of improved coexistence of multiple wireless communication techniques | |
GB2392067B (en) | Channel estimation apparatus and methods | |
GB0306603D0 (en) | Method and apparatus for broadcasting communications | |
EP1578251A4 (en) | APPARATUS AND METHOD FOR BENEFICIAL MODIFICATION OF BIORYTHMIC ACTIVITY | |
AU2003265618A8 (en) | Method and apparatus of position location | |
AU2003225740A8 (en) | Antenna adaptation comparison method for high mobility | |
AU2003225153A8 (en) | Method and apparatus for efficient channel assignment | |
EP1651075A4 (en) | BAG AND MOVEMENT PROCESS | |
EP1632074A4 (en) | METHOD AND SYSTEM FOR SUPPRESSION OF CARRIER LEAK | |
TWI371856B (en) | Structure for and method of fabricating a high-mobility field-effect transistor | |
EP1577280A4 (en) | DEUTERATION PROCESS | |
EP1487024A4 (en) | LATERAL JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | |
EP1599904A4 (en) | LATERAL LUBISTOR STRUCTURE AND METHOD | |
HK1089021A1 (zh) | 提供信道接入參數的方法和設備 | |
SG108874A1 (en) | Channel equalisation | |
GB0319361D0 (en) | A method of and system for wireless communication | |
EP1599962A4 (en) | PROCESS FOR AN EXCLUSIVE WLAN DOWNWARD CHANNEL | |
EP1491091A4 (en) | MEANS OF PROTECTION AGAINST INSECTS AND METHODS OF PROTECTION AGAINST INSECTS |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |