TWI318329B - - Google Patents
Info
- Publication number
- TWI318329B TWI318329B TW093122766A TW93122766A TWI318329B TW I318329 B TWI318329 B TW I318329B TW 093122766 A TW093122766 A TW 093122766A TW 93122766 A TW93122766 A TW 93122766A TW I318329 B TWI318329 B TW I318329B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003282830A JP4168443B2 (ja) | 2003-07-30 | 2003-07-30 | 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504463A TW200504463A (en) | 2005-02-01 |
TWI318329B true TWI318329B (ja) | 2009-12-11 |
Family
ID=34267920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093122766A TW200504463A (en) | 2003-07-30 | 2004-07-29 | Radiation-sensitive resin composition, interlayer insulating film and microlens and manufacturing method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4168443B2 (ja) |
KR (1) | KR100776121B1 (ja) |
TW (1) | TW200504463A (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101206780B1 (ko) * | 2005-03-03 | 2012-11-30 | 주식회사 동진쎄미켐 | 감광성 수지 조성물 |
JP4713262B2 (ja) * | 2005-07-22 | 2011-06-29 | 昭和電工株式会社 | 感光性の樹脂組成物 |
JP5003081B2 (ja) * | 2005-09-28 | 2012-08-15 | 東レ株式会社 | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
KR101271783B1 (ko) * | 2005-10-28 | 2013-06-07 | 도레이 카부시키가이샤 | 실록산 수지 조성물 및 그의 제조 방법 |
WO2007119947A1 (en) * | 2006-04-13 | 2007-10-25 | Kolon Industries, Inc | Method of manufacturing metal electrode |
KR100908694B1 (ko) * | 2006-08-07 | 2009-07-22 | 도쿄 오카 고교 가부시키가이샤 | 층간절연막용 감광성 수지조성물 및 층간절연막의 형성방법 |
JP4905700B2 (ja) | 2007-05-16 | 2012-03-28 | Jsr株式会社 | 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズならびにそれらの形成方法 |
JP5099140B2 (ja) * | 2007-08-24 | 2012-12-12 | 東レ株式会社 | 感光性組成物、それから形成された硬化膜、および硬化膜を有する素子 |
EP2239301B1 (en) | 2008-01-28 | 2016-04-27 | Toray Industries, Inc. | Siloxane resin compositions |
JP5240459B2 (ja) * | 2008-02-19 | 2013-07-17 | Jsr株式会社 | 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズならびにそれらの形成方法 |
JP5437027B2 (ja) * | 2009-03-31 | 2014-03-12 | 東京応化工業株式会社 | 感光性樹脂組成物及び液晶パネル |
KR101193185B1 (ko) | 2009-12-29 | 2012-10-19 | 삼성디스플레이 주식회사 | 패턴 형성 방법 및 유기 발광 소자의 제조방법 |
JP5676179B2 (ja) | 2010-08-20 | 2015-02-25 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置 |
EP2447773B1 (en) * | 2010-11-02 | 2013-07-10 | Fujifilm Corporation | Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure |
JP5635449B2 (ja) | 2011-03-11 | 2014-12-03 | 富士フイルム株式会社 | 樹脂パターン及びその製造方法、mems構造体の製造方法、半導体素子の製造方法、並びに、メッキパターン製造方法 |
US10175577B2 (en) | 2012-02-07 | 2019-01-08 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component |
TWI494339B (zh) | 2012-10-23 | 2015-08-01 | Ind Tech Res Inst | 部分酯化環氧樹脂及應用其製成之環氧樹脂組成物及其製法 |
JP6218393B2 (ja) * | 2013-02-28 | 2017-10-25 | 東京応化工業株式会社 | 層間絶縁膜用感光性樹脂組成物 |
JP6167016B2 (ja) | 2013-10-31 | 2017-07-19 | 富士フイルム株式会社 | 積層体、有機半導体製造用キットおよび有機半導体製造用レジスト組成物 |
CN107207456B (zh) | 2015-02-02 | 2021-05-04 | 巴斯夫欧洲公司 | 潜酸及其用途 |
JP6284671B2 (ja) * | 2017-05-02 | 2018-02-28 | 東京応化工業株式会社 | 層間絶縁膜用感光性樹脂組成物 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2933145B2 (ja) * | 1991-05-23 | 1999-08-09 | 日本化薬株式会社 | カラ−フイルタ−保護膜用紫外線硬化性樹脂組成物及びその硬化物 |
JPH075301A (ja) * | 1993-06-15 | 1995-01-10 | Tosoh Corp | マイクロレンズ形成用感光性組成物 |
JP3965868B2 (ja) | 2000-06-12 | 2007-08-29 | Jsr株式会社 | 層間絶縁膜およびマイクロレンズ |
-
2003
- 2003-07-30 JP JP2003282830A patent/JP4168443B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-29 KR KR1020040059735A patent/KR100776121B1/ko active IP Right Grant
- 2004-07-29 TW TW093122766A patent/TW200504463A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR100776121B1 (ko) | 2007-11-16 |
KR20050014716A (ko) | 2005-02-07 |
TW200504463A (en) | 2005-02-01 |
JP4168443B2 (ja) | 2008-10-22 |
JP2005049691A (ja) | 2005-02-24 |