TWI317526B - A composition and a method for increasing the resistivity of an electrically-conductive pattern - Google Patents

A composition and a method for increasing the resistivity of an electrically-conductive pattern Download PDF

Info

Publication number
TWI317526B
TWI317526B TW091107085A TW91107085A TWI317526B TW I317526 B TWI317526 B TW I317526B TW 091107085 A TW091107085 A TW 091107085A TW 91107085 A TW91107085 A TW 91107085A TW I317526 B TWI317526 B TW I317526B
Authority
TW
Taiwan
Prior art keywords
composition
particles
present
resistivity
component
Prior art date
Application number
TW091107085A
Other languages
English (en)
Chinese (zh)
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of TWI317526B publication Critical patent/TWI317526B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW091107085A 2001-04-09 2002-04-09 A composition and a method for increasing the resistivity of an electrically-conductive pattern TWI317526B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0108888.9A GB0108888D0 (en) 2001-04-09 2001-04-09 Conductor composition IV

Publications (1)

Publication Number Publication Date
TWI317526B true TWI317526B (en) 2009-11-21

Family

ID=9912548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091107085A TWI317526B (en) 2001-04-09 2002-04-09 A composition and a method for increasing the resistivity of an electrically-conductive pattern

Country Status (8)

Country Link
EP (1) EP1377985B1 (enExample)
JP (1) JP4252315B2 (enExample)
KR (1) KR100668548B1 (enExample)
CN (1) CN1307650C (enExample)
DE (1) DE60229367D1 (enExample)
GB (1) GB0108888D0 (enExample)
TW (1) TWI317526B (enExample)
WO (1) WO2002082467A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0307547D0 (en) * 2003-04-01 2003-05-07 Du Pont Conductor composition V
KR101207363B1 (ko) * 2009-03-04 2012-12-04 엘에스전선 주식회사 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물
KR101246750B1 (ko) * 2009-03-27 2013-03-26 엘에스전선 주식회사 금속 나노입자로 표면 수식된 나노미터 두께의 금속 마이크로판을 함유하는 전도성 페이스트용 조성물
TW201115592A (en) * 2009-06-19 2011-05-01 Du Pont Glass compositions used in conductors for photovoltaic cells
JP2014201683A (ja) * 2013-04-05 2014-10-27 n−tech株式会社 融雪塗料およびこれを利用した施工方法、融雪システム
WO2021141021A1 (ja) * 2020-01-08 2021-07-15 ナミックス株式会社 抵抗体ペースト、焼成体及び電気製品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE52134B1 (en) * 1980-07-31 1987-07-08 Du Pont Thick film conductor compositions
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
JPH08134388A (ja) * 1994-11-14 1996-05-28 Matsushita Electric Ind Co Ltd 導電性インキ
JP2001028290A (ja) * 1999-05-07 2001-01-30 Ibiden Co Ltd ホットプレート及び導体ペースト

Also Published As

Publication number Publication date
CN1511325A (zh) 2004-07-07
JP4252315B2 (ja) 2009-04-08
CN1307650C (zh) 2007-03-28
GB0108888D0 (en) 2001-05-30
KR100668548B1 (ko) 2007-01-16
EP1377985B1 (en) 2008-10-15
WO2002082467A1 (en) 2002-10-17
EP1377985A1 (en) 2004-01-07
DE60229367D1 (de) 2008-11-27
JP2004533091A (ja) 2004-10-28
KR20040030572A (ko) 2004-04-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees